Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device

Abstract

There is provided a semiconductor device that suppresses the occurrence of resin burrs and has favorable electrical connectivity and bond strength, and a manufacturing method for such semiconductor device. A resin-coated metal part is manufactured by forming an organic coating by depositing a material including functional organic molecules on a wiring lead composed of a metallic material. Each of the functional organic molecules includes a main chain, a first functional group having a metal bonding property, and a second functional group. The first functional group and the second functional group are provided at different ends of the main chain. Thereafter the functional organic molecules self-assemble by bonding of the first functional groups to metal atoms of the wiring lead. After performing the organic coating formation step, resin is adhered to a predetermined surface area of the wiring lead having the organic coating formed thereon.

Description

technical field [0001] The present invention relates to a wiring component, a resin-coated metal component, and a resin-sealed semiconductor device, and a method for manufacturing the resin-coated metal component and the semiconductor device. In particular, it relates to a technique for improving the adhesion between a metal material and a resin material. Background technique [0002] In semiconductor devices or wiring components, resin materials are widely used. [0003] Semiconductor devices such as integrated circuits (ICs) and large-scale integrations (LSIs) are generally manufactured by a method in which predetermined semiconductor elements are connected to wiring leads by wire bonding or the like, and a part of the wiring leads is exposed to the outside. Resin is adhered, and resin sealing is performed for encapsulation. [0004] 21 is a schematic cross-sectional view showing manufacturing steps of a resin-sealed QFP (quad flat package) type semiconductor device. [...

AI Technical Summary

Problems solved by technology

As a result, there are problems of lowered manufacturing efficiency and increased manufacturing cost.

[0019] The second problem is when silicone resin is used for the above-mentioned sealing resin of LED devices

Although it is known that silver material can increase the reflectance of visible light in the long-wavelength region, it has relatively low reflectivity for light in the short-wavelength region (below about 500nm)

Therefore, when a diode that emits blue light, purple light, or ultraviolet light is mounted on an LED device, sufficient reflectance cannot be obtained, and the target luminous efficiency cannot be obtained.

[0021] The fourth problem is that, as shown in Patent Document 4, when tin plating is performed on a wiring pattern layer in a film carrier tape

[0022] On the surface of the wiring pattern layer, a tin-plated layer is previously applied in order to connect the mounting parts with solder, but in this plating step, there are problems in that the end of the solder resist layer is lifted due to the heating atmosphere, Between the raised solder resist layer and the surface of the wiring pattern layer, and between the other surface regions of the wiring pattern layer, a problem of local battery ( Figure 22(a))

Therefore, in addition to the decrease in the mechanical strength of the film carrier tape after tin plating, there is also a problem that uniform plating cannot be performed.

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