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Horizontal dispersion oxide semiconductor of heterogeneous bar multi-step field electrode board

A technology of lateral double-diffusion and semiconductor tubes, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., to achieve low on-resistance, reduce the peak value of the electric field, and achieve the effects of breakdown voltage and on-resistance

Inactive Publication Date: 2007-11-28
ANHUI UNIVERSITY
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] The present invention aims at the problem that the breakdown voltage and on-resistance performance of lateral double-diffused metal oxide semiconductor transistors are contradictory, and provides a lateral double-diffused metal oxide semiconductor transistor with heterogeneous gate and multi-step field plate. The combination of gate and multi-step field plate technology, on the basis of maintaining the breakdown characteristics of lateral double-diffused metal oxide semiconductor transistors, increases the drive current, transconductance, reduces on-resistance, and reduces power consumption, so that the lateral double-diffused Metal oxide semiconductor tubes are well applied in high frequency, high voltage, high power occasions

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  • Horizontal dispersion oxide semiconductor of heterogeneous bar multi-step field electrode board

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Embodiment Construction

[0019] Referring to Fig. 1, this embodiment includes: source 1, drain 2, source gate 3, drain gate 4, substrate 5, channel well region 6 on substrate 5, well drift region 7 on substrate 5, gate oxide layer 8, a field oxide layer 9, an oxide layer 10, a first-level field plate 11, and a second-level field plate 12, and the gate oxide layer 10 is arranged between the source gate 3, the drain gate 4 and the channel well region 6 . A well contact hole 61 is provided on the channel well region 6 , and the field oxide layer 9 is between the first level field plate 8 , the second level field plate 9 and the well drift region 7 .

[0020] In specific implementation, the doping concentration of the substrate 5 is 1×10 15 cm -3 , the length of the well drift region 7 is 8 μm, the junction depth of the well drift region 7 is 2 μm, and the surface peak doping concentration of the well drift region 7 is 3.5×10 16 cm -3 , the junction depth of the channel well region 6 is 2 μm, and the ...

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Abstract

The invention discloses a lateral double diffusion metal oxide semiconductor of a heterogeneous grip multi step field polar plate, which is characterized by the following: equipping with the heterogeneous double-grip structure of the source grip and the leakage grip; composing the multi step field polar plate of the first step field polar plate and the second step field polar plate, connecting with the source grip, the leakage grip, the first step field polar plate and the second step field polar plate orderly; equipping with the source and the leakage in the channel trap section and the trap drift section; equipping with grip oxide layer among the source grip, the leakage grip and the channel trap section, equipping with the trap contact hole in the channel trap section; equipping the field oxide layer among the first step field polar plate, the second step field polar plate and the trap draft section; covering the oxide layer on the multi step field polar plate; making the channel trap section and the trap draft section on the underlay. The invention improves the driving current and the transconductance, which reduces the conducting resistance and the power consumption.

Description

technical field [0001] The invention is a metal oxide semiconductor tube, especially a metal oxide semiconductor tube applied in high frequency, high voltage and high power occasions. Background technique [0002] Lateral double-diffused metal-oxide-semiconductor power devices have the advantages of large linear dynamic range, high gain, and good temperature characteristics. More importantly, lateral double-diffused metal-oxide-semiconductor transistors are easy to be compatible with low-voltage standard CMOS processes, meeting the requirements of signal control circuits and The systematic and miniaturized design trend of integrating high-voltage power circuits on a chip improves the reliability of the chip and reduces the cost. Therefore, the bulk silicon lateral double-diffused metal oxide semiconductor transistor has the characteristics of a power amplifier with an operating voltage of 10V-200V. Greater application advantages. However, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/78H01L29/49H01L29/423
CPCH01L29/402H01L29/7835
Inventor 陈军宁柯导明代月花高珊徐超孟坚吴秀龙
Owner ANHUI UNIVERSITY
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