Molded epoxy resin sheet and its prepn process
A sheet molding compound and molding compound technology, applied in the field of materials, can solve the problems such as the method of molding without chemical thickening, and achieve the effects of improved strength, good fluidity, corrosion resistance and insulation performance.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0030] 1. Preparation of epoxy resin paste:
[0031] According to the order of epoxy resin, diluent, internal mold release agent and filler, they are added to the mixer with heating and heat preservation device in sequence, and after mixing evenly, the curing agent, thickener and organic acid are added, and mixed evenly to form a ring. Oxygen resin paste. In parts by weight, the proportions of the raw materials are: 100 parts of epoxy resin, 11 parts of diluent, 30 parts of curing agent, 10 parts of thickener, 9 parts of organic acid, 3 parts of internal mold release agent, 100 parts of filler, Fiber 70 parts.
[0032] In the above formula, the epoxy resin adopts bisphenol A diglycidyl ether type epoxy resin E-44, the diluent adopts phenyl glycidyl ether, the curing agent adopts novolac resin, the thickener adopts magnesium oxide, and the organic acid adopts n-octanoic acid. , The inner release agent is calcium stearate, the filler is light calcium carbonate, and the fiber i...
Embodiment 2
[0038] In this example, except that each raw material ratio has the following changes, the others are the same as in Example 1.
[0039] In parts by weight, the proportions of each raw material are: 100 parts of epoxy resin, 4 parts of diluent, 20 parts of curing agent, 9 parts of thickener, 18 parts of organic acid, 1 part of internal mold release agent, 80 parts of filler, Fiber 50 parts.
Embodiment 3
[0041] In this example, except that each raw material ratio has the following changes, the others are the same as in Example 1.
[0042] In parts by weight, the ratio of each raw material is: 100 parts of epoxy resin, 20 parts of diluent, 50 parts of curing agent, 16 parts of thickener, 6 parts of organic acid, 4 parts of internal mold release agent, 180 parts of filler, Fiber 150 parts.
PUM
Property | Measurement | Unit |
---|---|---|
Length | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com