Technique for producing sheet-type electronic component paper carrying base paper by using waste paper pulp

Abstract

The invention relates to paper technology used waste pulp to produce sheet electronic component paper characteristic carried band base paper. It includes the following steps: mixing 50-80% broadleaf pulp, 0-35% need pulp, 0-15% mechanism ground pulp and sending them into high concentration pulping machine to pump to 40-48 degree SR; adding 0.8-1wt% starch and 0.5-1wt% sizing agent to form cover pulp; de-inking, de-sanding, de-dusting for the waste pulp; sending them into the pulping machine; putting into core pulp storing pool; adding 0.8-1wt% starch and 0.5-1wt% sizing agent to form core pulp; distributing the cover and core pulp into cover net and core net by splitting box to form many paper sheet; spraying a layer of starch on them; folding them to form base paper; rolling; drying; dehydrating; surface sizing; cooling; balancing moisture; coiling up. The invention has the advantages of reasonable technology, convenient production, stable quality, practicality, and environmental protection.

Description

technical field [0001] The invention relates to a papermaking process, in particular to a process for producing paper carrier tape base paper for chip electronic components by using waste paper pulp. Background technique [0002] With the miniaturization of electrical appliances, the miniaturization requirements for electronic components are getting higher and higher. Chip electronic components are currently the mainstream form of discrete electronic components, and their size is getting smaller and smaller, from 3216 to 1608. Its application The mainstream size is transitioning from 1608 to 1005. At present, the smallest size has grown to 0603 or even 0402. On such a small scale, there must be corresponding carriers for the packaging, transportation and retrieval of components. At present, it is generally used Plastic carrier tape is used as the packaging carrier, but it is acceptable to use plastic carrier tape when the size is large. When the size is smaller, the producti...

AI Technical Summary

Problems solved by technology

[0002] With the miniaturization of electrical appliances, the miniaturization requirements for electronic components are getting higher and higher. Chip electronic components are currently the mainstream form of discrete electronic components, and their size is getting smaller and smaller, from 3216 to 1608. Its application The mainstream size is transitioning from 1608 to 1005. At present, the smallest size has grown to 0603 or even 0402. On such a small scale, there must be corresponding carriers for the packaging, transportation and retrieval of components. At present, it is generally used Plastic carrier tape is used as the packaging carrier, but it is acceptable to use plastic carrier tape when the size is large. When the size is smaller, the production of plastic carrier tape is very difficult, and its dimensional accuracy is difficult to guarantee, especially when punching holes. It is difficult to eliminate corners, which is particularly obvious when the size is small, and it is especially important that the static electricity of plastic products is difficult to eliminate, which brings difficulties to the extraction process of components. Therefore, paper carrier tapes are used as micro-chip electronic components. Packaging carrier is an inevitable trend in the development of miniaturization of electronic components. Now there is also a production technology of paper carrier tape. The inventor has applied for a patent for a production process of paper carrier tape, but this process is completely produced with raw wood pulp. , consumes a large amount of wood resources, high cost and unfavorable to environmental protection, research and development of base paper for processing chip electronic component paper carrier tape with waste paper is an urgent problem to be solved