Epoxy resin composition for semiconductor encapsulation and semiconductor device

A technology of epoxy resin and semiconductor, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc. It can solve the problems of not being obtained, wiring short circuit, etc., and achieve the effect of excellent laser marking

Inactive Publication Date: 2008-02-27
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with conventional epoxy resin compositions for encapsulating semiconductors containing colorants after oxidation treatment, when the distance between metal lines is 80 μm, wiring short-circuit defects do not occur, but when the distance between metal lines is as narrow as 40 μm, sometimes Wiring short-circuit failure occurs, and a very excellent epoxy resin composition for semiconductor sealing has not been obtained so far

Method used

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  • Epoxy resin composition for semiconductor encapsulation and semiconductor device
  • Epoxy resin composition for semiconductor encapsulation and semiconductor device
  • Epoxy resin composition for semiconductor encapsulation and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Epoxy resin 1, phenolic resin 1, fused spherical silica 1, fused spherical silica 2, curing accelerator 1, colorant 1, coupling agent 1, coupling agent 2, 2,3-dihydroxynaphthalene and The molding agent was mixed with a mixer according to the compounding ratio shown in Table 1, kneaded at 95° C. for 8 minutes with a hot roll, cooled, and pulverized to obtain an epoxy resin composition. The obtained epoxy resin composition was evaluated by the following method. In addition, from the above-mentioned components, only the colorant 1 was removed, mixed with a mixer in the same manner as above, kneaded at 95° C. for 8 minutes with a hot roll, cooled, and pulverized to prepare a sample, which was used as the following The above-mentioned high-temperature leakage test samples were used for evaluation. The results are shown in Table 1.

[0051] Epoxy resin 1 is a phenol aralkyl type epoxy resin having a biphenylene skeleton represented by the following formula (1) (58° C. of so...

Embodiment 2～5、 comparative example 1～4

[0072] According to the compounding ratio of Table 1, it operated similarly to Example 1, obtained the epoxy resin composition, and evaluated similarly to Example 1. The results are shown in Table 1. In addition, the epoxy resin 2 is a biphenyl type epoxy resin represented by the following formula (3) with an epoxy equivalent of 190 and a melting point of 105° C. (trade name YX-40000; manufactured by Japan Electronics Co., Ltd.).

[0073]

[0074] The phenolic resin 2 is a phenol aralkyl resin represented by the following formula (4) with an epoxy equivalent of 165 and a softening point of 79° C. (trade name XLC-LL; manufactured by Mitsui Chemicals Co., Ltd.).

[0075]

[0076] The curing accelerator 2 is triphenylphosphine (trade name PP-360; manufactured by Kei Ai Chemical Co., Ltd.).

[0077] Table 1

[0078] Example

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Abstract

An epoxy resin composition for sealing semiconductors including (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler, (D) a curing promoter, and (E) a surface-treated coloring agent, wherein the coloring agent before the surface treatment is a carbon precursor with a carbon content of 90 wt % or more or carbon black having a DBP absorption of 100 cm<3> / 100 g or more, and a semiconductor device sealed with the epoxy resin composition. The epoxy resin composition can produce semiconductors which are free from electrical failures such as a short circuit, a leak current, and the like, do not induce wire deformation, and exhibits excellent laser marking characteristics.

Description

technical field [0001] The present invention relates to an epoxy resin composition for semiconductor sealing and a semiconductor device using the same. Background technique [0002] As a sealing method for semiconductor elements such as ICs and LSIs, transfer molding of epoxy resin compositions suitable for low-cost and mass production has been used for a long time. The modification of the phenolic resin of the curing agent can also improve the characteristics. However, in recent years, in the market trend of miniaturization, weight reduction, and high performance of electronic equipment, the high integration of semiconductors is also developing, and the surface mounting of semiconductor devices is also being promoted. The requirements for epoxy resin compositions for sealing are becoming more and more stringent. Therefore, a problem that cannot be solved by the conventional epoxy resin composition also arises. [0003] Conventionally, the composition of semiconductor dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/04C08K9/02C09C1/56H01L23/29H01L23/31
CPCC08K3/04C08G59/621C08K5/0041C08K9/02C08L63/00H01L23/295
Inventor 西川敦准
Owner SUMITOMO BAKELITE CO LTD
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