Low-temperature co-fired cordierite series glass-ceramic substance power and preparation method thereof

Abstract

The present invention discloses low temperature co-baked MgO-Al2O3-SiO2 glass-ceramic wafer powder and its preparation process. The co-baked MgO-Al2O3-SiO2 glass-ceramic wafer powder is prepared based on the recipe of cordierite 2MgO.2Al2O3.5SiO2 and through adding baking assistant B2O3 and Bi2O3, and modifiers TiO2, CuO, CaO and / or K2O to improve the crystal chemistry performance. It is prepared through a sol-gel synthesis process with roasting temperature of 700-750 deg.c and sintering temperature of 850-900 deg.c. The low temperature co-baked MgO-Al2O3-SiO2 glass-ceramic wafer powder has low sintering temperature, low dielectric constant, low dielectric loss, high insulation resistance, simple preparation process and other advantages. It is applied in making low temperature co-baked wafer.

Description

technical field [0001] The invention belongs to the field of electronic ceramic substrates and the manufacture thereof, in particular to a low-temperature co-fired glass-ceramic substrate material and a preparation method thereof. Background technique [0002] The electronic substrate is the carrier of the semiconductor chip package, carrying the support of electronic components and forming the base of the electronic circuit. Traditional inorganic substrates use Al 2 o 3 , SiC, BeO, and AlN are used as substrates, which have excellent properties in terms of thermal conductivity, flexural strength, and thermal expansion coefficient. The choice of refractory metals such as W or Mo has greatly increased the cost, and the emergence of low temperature co-fired ceramic (LTCC) materials has opened up a new way out for this. [0003] The co-firing temperature of the LTCC system is generally between 800 and 900 °C. Therefore, metals with lower melting points such as Cu and Ag can...

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Problems solved by technology

[0005] However, the preparation and performance of cordierite-based LTCC materials are still unsatisfactory, and there are some problems

In the research of Mg-Al-Si series glass-ceramics (Journal of Shandong University of Science and Technology, September 25 (3), 78-80 in 2006), Han Ye and others prepared Mg-Al-Si series glass-ceramics by solid-state sintering method. Although the bending strength of crystal glass is large enough, the sintering temperature is high, the sintering time is long, and the microstructure is not dense enough; the low-temperature sintering and properties of cordierite ceramic materials for high-frequency chip inductors (Rare Metal Materials and Engineering, 2005 In February 34 (2), 33-36), Wang Shaohong and others prepared cordierite-based LTCC materials by the sol-gel method. Although the sintering temperature was reduced to a certain extent, the sintering temperature was still between 900 and 1000 °C. time, which is unfavorable for the use of silver electrodes; literature MgO-Al 2 o 3 -SiO 2 -TiO 2 -CeO 2 Crystallization process and microwave dielectric properties of system glass-ceramics (Journal of Inorganic Materials, May 18 (3), 547-552), Wang Naigang et al. Although the dielectric loss is small, the dielectric constant is very high, between 8 and 11.