A waterless
abrasive-free
polishing solution for chemical-mechanical
polishing of flexible, crisp and deliquescent crystals is characterized in that the solution comprises 0.5-40% of an organic
corrosion agent, 0.5-20% of an organic
corrosion inhibitor, 0.5-15% of an organic surfactant, 0.01-10% of an organic pH adjustment agent, and 30-95% of an
organic solvent. The waterless
abrasive-free
polishing solution contains no water, so a problem of easy deliquescent
cracking of the flexible, crisp and deliquescent crystals when meeting water is avoided. Simultaneously the waterless
abrasive-free polishing solution which contains no abrasives has small damages to surfaces of the flexible, crisp and deliquescent crystals, allows the flexible, crisp and deliquescent crystals can have nondestructive and super-smooth surfaces to be obtained, does not precipitate, and can be preserved and used for a long time. The waterless abrasive-free polishing solution has the advantages of good stability, good fluidity, easy cleaning, and small
corrosion to equipment. The waterless abrasive-free polishing solution prepared in the invention is specially used for the chemical-mechanical polishing of the flexible, crisp and deliquescent crystals, has the advantages of no water and no abrasives, and allows flexible, crisp and deliquescent materials to have
high surface qualities, and the
high surface quality obtaining method is simple, is easy to implement, and costs low.