Waterless abrasive-free polishing solution for chemical-mechanical polishing of flexible, crisp and deliquescent crystals

A crystal chemical and mechanical polishing technology, applied in the field of polishing liquid, can solve the problems of difficult processing, difficult to obtain ultra-smooth surface, unable to obtain ultra-smooth surface, etc., and achieve the effect of small surface damage and high surface quality

Inactive Publication Date: 2012-09-12
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This polishing liquid avoids the problem of deliquescent cracking of lithium cesium borate crystals, but it is difficult to obtain an ultra-smooth surface due to the hard abrasives contained in the polishing liquid
U.S. Patent No. 6800218 and No. 20070147551

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Pick:

[0031] 20 grams of picric acid (also can be phthalic acid or ethylenediamine), 10 grams of phosphonic acid (salt) (also can be mercaptobenzothiazole, benzotriazole or organic amine); nonylphenol polyoxyethylene Ether (also can be alkyl polyoxyethylene ether, fatty alcohol polyoxyethylene ether or lauric acid diethanolamide 10 grams and acetic acid (also can be tartaric acid, oxalic acid, citric acid, ethylenediamine or N, N-dimethyl Add 5 grams of aniline to 75 grams of benzene (also can be toluene, cyclohexane, chlorobenzene, methanol, ethanol, isopropanol, ether, ethyl acetate, acetone or pyridine) and mix evenly to obtain 100 grams of organic polishing liquid Solvent. The soft, brittle and deliquescent cesium lithium borate (CLBO) crystal was polished with this polishing liquid, and the surface roughness was 1.28 nm. The surface of the crystal had no abrasive scratches, no deliquescence cracking, and the surface quality was excellent.

Embodiment 2

[0033] Pick:

[0034] Phthalic acid (also can be picric acid or ethylenediamine) 0.5g; mercaptobenzothiazole (also can be phosphonic acid (salt), benzotriazole or organic amine) 15g; alkyl polyoxyethylene ether (It can also be nonylphenol polyoxyethylene ether, fatty alcohol polyoxyethylene ether or lauric acid diethanolamide 15 grams and tartaric acid (also can be acetic acid, oxalic acid, citric acid, ethylenediamine or N, N-dimethyl Aniline) 9.5 grams, add 60 grams of toluene (also can be benzene, cyclohexane, chlorobenzene, methanol, ethanol, isopropanol, ether, ethyl acetate, acetone or pyridine) and mix evenly to get 100 grams of organic polishing liquid Solvent. The soft, brittle and deliquescent cesium triborate (CBO) crystal was polished with this polishing liquid to obtain a surface roughness of 3.16 nm, no abrasive scratches on the crystal surface, and excellent surface quality.

Embodiment 3

[0036] Pick:

[0037]Ethylenediamine (also can be picric acid or phthalic acid) 40 grams; benzotriazole (also can be phosphonic acid (salt), mercaptobenzothiazine or organic amine) 0.5 grams; fatty alcohol polyoxyethylene ether (It can also be nonylphenol polyoxyethylene ether, alkyl polyoxyethylene ether or lauric acid diethanolamide 6.99 grams and citric acid (also can be acetic acid, oxalic acid, tartaric acid, ethylenediamine or N, N-dimethyl Aniline) 0.01 g, add 52.5 g methanol (also can be benzene, cyclohexane, chlorobenzene, toluene, ethanol, isopropanol, ether, ethyl acetate, acetone or pyridine) and mix evenly to get 100 g of organic polishing liquid Solvent. Use this polishing liquid to polish soft and brittle potassium dihydrogen phosphate (KDP) crystals to obtain a surface roughness better than 1 nm, no abrasive scratches on the crystal surface, no deliquescence, and excellent surface quality.

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Abstract

A waterless abrasive-free polishing solution for chemical-mechanical polishing of flexible, crisp and deliquescent crystals is characterized in that the solution comprises 0.5-40% of an organic corrosion agent, 0.5-20% of an organic corrosion inhibitor, 0.5-15% of an organic surfactant, 0.01-10% of an organic pH adjustment agent, and 30-95% of an organic solvent. The waterless abrasive-free polishing solution contains no water, so a problem of easy deliquescent cracking of the flexible, crisp and deliquescent crystals when meeting water is avoided. Simultaneously the waterless abrasive-free polishing solution which contains no abrasives has small damages to surfaces of the flexible, crisp and deliquescent crystals, allows the flexible, crisp and deliquescent crystals can have nondestructive and super-smooth surfaces to be obtained, does not precipitate, and can be preserved and used for a long time. The waterless abrasive-free polishing solution has the advantages of good stability, good fluidity, easy cleaning, and small corrosion to equipment. The waterless abrasive-free polishing solution prepared in the invention is specially used for the chemical-mechanical polishing of the flexible, crisp and deliquescent crystals, has the advantages of no water and no abrasives, and allows flexible, crisp and deliquescent materials to have high surface qualities, and the high surface quality obtaining method is simple, is easy to implement, and costs low.

Description

technical field [0001] The invention relates to a polishing liquid used in chemical mechanical polishing, in particular to an anhydrous non-abrasive polishing liquid for chemical mechanical polishing, in particular to an anhydrous polishing liquid for chemical mechanical polishing of soft, brittle and deliquescent crystals. Non-abrasive polishing fluid. Background technique [0002] One disadvantage of soft, brittle and deliquescent crystals is that they are prone to deliquescence and cracking when the ambient humidity is high. However, water is used as a solvent in traditional chemical mechanical polishing fluids, which brings great difficulties to the polishing of crystals, and the smoothness of the crystal surface after polishing not tall. In addition, because the crystal is soft, the polishing liquid of traditional chemical mechanical polishing contains hard abrasive particles. During the polishing process, the hard particles in the polishing liquid are easy to scratch,...

Claims

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Application Information

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IPC IPC(8): C09G1/18
Inventor 李军朱永伟左敦稳李标夏磊孙玉利李鹏鹏罗海军
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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