Waterless abrasive-free polishing solution for chemical-mechanical polishing of flexible, crisp and deliquescent crystals

Abstract

A waterless abrasive-free polishing solution for chemical-mechanical polishing of flexible, crisp and deliquescent crystals is characterized in that the solution comprises 0.5-40% of an organic corrosion agent, 0.5-20% of an organic corrosion inhibitor, 0.5-15% of an organic surfactant, 0.01-10% of an organic pH adjustment agent, and 30-95% of an organic solvent. The waterless abrasive-free polishing solution contains no water, so a problem of easy deliquescent cracking of the flexible, crisp and deliquescent crystals when meeting water is avoided. Simultaneously the waterless abrasive-free polishing solution which contains no abrasives has small damages to surfaces of the flexible, crisp and deliquescent crystals, allows the flexible, crisp and deliquescent crystals can have nondestructive and super-smooth surfaces to be obtained, does not precipitate, and can be preserved and used for a long time. The waterless abrasive-free polishing solution has the advantages of good stability, good fluidity, easy cleaning, and small corrosion to equipment. The waterless abrasive-free polishing solution prepared in the invention is specially used for the chemical-mechanical polishing of the flexible, crisp and deliquescent crystals, has the advantages of no water and no abrasives, and allows flexible, crisp and deliquescent materials to have high surface qualities, and the high surface quality obtaining method is simple, is easy to implement, and costs low.

Description

technical field [0001] The invention relates to a polishing liquid used in chemical mechanical polishing, in particular to an anhydrous non-abrasive polishing liquid for chemical mechanical polishing, in particular to an anhydrous polishing liquid for chemical mechanical polishing of soft, brittle and deliquescent crystals. Non-abrasive polishing fluid. Background technique [0002] One disadvantage of soft, brittle and deliquescent crystals is that they are prone to deliquescence and cracking when the ambient humidity is high. However, water is used as a solvent in traditional chemical mechanical polishing fluids, which brings great difficulties to the polishing of crystals, and the smoothness of the crystal surface after polishing not tall. In addition, because the crystal is soft, the polishing liquid of traditional chemical mechanical polishing contains hard abrasive particles. During the polishing process, the hard particles in the polishing liquid are easy to scratch,...

AI Technical Summary

Problems solved by technology

This polishing liquid avoids the problem of deliquescent cracking of lithium cesium borate crystals, but it is difficult to obtain an ultra-smooth surface due to the hard abrasives contained in the polishing liquid

U.S. Patent No. 6800218 and No. 20070147551 respectively disclose abrasive-free polishing fluids, both of which are aimed at chemical mechanical polishing of copper and related materials. For soft, brittle and deliquescent crystals, it is difficult to process and cannot obtain an ultra-smooth surface