Multilayer soft printed wiring board and production method thereof

A flexible printing and manufacturing method technology, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problem that insulating resin cannot meet the requirements of thinning printed wiring boards, and reduce electrostatic capacitance and delay , to achieve the effect of thin film

Inactive Publication Date: 2008-05-07
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, the increase in the thickness of the insulating resin disclosed in Patent Document 3 cannot meet the demand for thinner printed wiring boards accompanying the reduction in weight and size of electronic equipment.

Method used

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  • Multilayer soft printed wiring board and production method thereof
  • Multilayer soft printed wiring board and production method thereof
  • Multilayer soft printed wiring board and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

1A and 1B show the steps of Embodiment 1 of the present invention. First, as shown in FIG. 1A(1), wiring constituting the signal line 8 is formed on the first insulating layer 9 with a thickness of 25 μm by etching a copper foil with a thickness of 12 μm.

[0030]

In order to form this structure, the starting material is NeoflexNEX-23FE (25T) (Mitsui Chemical Co., Ltd.).

[0031]

Next, as shown in FIG. 1A(2), the first insulating layer 9 was removed to a thickness of 12.5 μm by chemical etching using an etchant TPE-3000 (manufactured by Toray Engineering Co., Ltd.) using the signal line 8 as a mask.

[0032]

Next, as shown in FIG. 1A (3), as the second insulating layer 10 with a low dielectric constant, Vexta (manufactured by KURARAY Co., Ltd., heat distortion temperature 275° C., dielectric constant 2.95 ) at a temperature higher than the heat distortion temperature of the liquid crystal polymer, and press and form it with a vacuum flat press.

[0033]

Thereafter, a...

Embodiment 2

Fig. 2 shows the process of the second embodiment of the present invention. First, as shown in FIG. 2(1), wiring constituting the signal line 13 was formed on the first insulating layer 14 with a thickness of 25 μm by etching a copper foil with a thickness of 12 μm.

[0037]

In order to form this structure, the starting material used is NeoflexNEX-23FE (25T) (Mitsui Chemicals Co., Ltd. Co., Ltd.).

[0038]

Next, as shown in FIG. 2(2), the first insulating layer 14 was removed to a thickness of 13 μm by chemical etching using an etchant TPE-3000 (manufactured by Toray Engineering Co., Ltd.) using the signal line 13 as a mask.

[0039]

Next, as shown in FIG. 2(3), Vexta (manufactured by KURARAY Co., Ltd., heat distortion temperature 240° C., dielectric constant 2.95) which is a liquid crystal polymer with a thickness of 25 μm as the second insulating layer 15 with a low dielectric constant and a liquid crystal polymer single-sided copper-clad laminate Espanex LC-12-50-00N...

Embodiment 3

3A and 3B show the steps of the third embodiment of the present invention. First, as shown in FIG. 3A (1), by etching copper foil with a thickness of 12 μm, the wiring constituting the signal line 19 is formed on the first insulating layer 20 having a copper foil of 12 μm and a thickness of 25 μm constituting the first planar layer 21. superior.

[0043]

In order to form the structure of the third embodiment, the starting material is a single polyimide that integrates the first insulating layer 20, the signal line 19 and the copper foil constituting the first plane layer 21, and can be chemically etched homogeneously. Metaroyal (manufactured by Toyo Metal Spray Co., Ltd.) PI-25D-CCW-12D0 (#25) composed of Kapton EN layer.

[0044]

Next, as shown in FIG. 3A (2), use a chemical etching method, use the signal line 19 as a mask, etchant TPE-3000 (manufactured by Toray Engineering Co., Ltd.) to etch the first insulating layer 20 to the first plane layer 21 surfaces.

Next, as...

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PUM

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Abstract

The invention provides a multi-layer soft printing wiring plate and a method for manufacturing the wiring plate, wherein, a part of an insulation resin provided with a signal wire is removed and resins which are low in specific inductive capacity are overlapped with each other so as to increase the volume of the insulation resin which wraps the signal wire and is low in specific inductive capacity. In the multi-layer soft printing wiring plate which is provided with a signal wire (8), a plane layer (12) and a plurality of insulation layers which are placed around the signal wire and between the signal wire than the plane layer, and has a structure of a microstrip line or a strip line, the periphery of the signal wire is provided with an insulation layer of three layers (9, 10 and11).

Description

technical field [0001] The present invention relates to a multilayer flexible printed wiring board and a manufacturing method thereof, and more particularly to a multilayer printed wiring board for transmitting high-speed signals meeting demands for miniaturization and high performance of electric and electronic equipment, and a manufacturing method thereof. Background technique [0002] The processing speed of signals in electronic devices has been increasing in recent years. Therefore, the transfer of signals through the printed wiring board also becomes faster. In high-speed signal transmission, the characteristic impedance of the signal line must be matched. If it is not matched, it will cause signal reflection and cause transmission loss. [0003] In order to obtain a desired impedance, in a printed wiring board that handles high-speed signals, as shown in FIGS. 7 and 8 , microstrip lines or striplines in which signal lines and plane layers are arranged are used....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/46
CPCH05K1/0393H05K3/4644H05K3/4694
Inventor 丰岛良一
Owner NIPPON MEKTRON LTD
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