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Electronic assembly lead-free welding paste scaling powder and preparing method thereof

A technology of lead-free solder paste and flux, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., to achieve good printability, bright solder joint surface, and good print formability

Active Publication Date: 2010-11-17
GUANGZHOU SOLDERWELL ADVANCED MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As for mounting reflow solder paste, it is still blank because there is no suitable flux to match it.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A kind of soldering flux for electronic mounting lead-free solder paste, its component and content (wt%) are:

[0018] Hydrogenated rosin 45

[0019] Polymerized α-styrene resin 10

[0020] Succinic acid 6.8

[0021] Ethylene bis stearic acid amide 6

[0022] Benzotriazole 1

[0023] Hexadecyltrimethylammonium bromide 0.2

[0024] Diethylene glycol monobutyl ether 16

[0025] Benzyl alcohol 10

[0026] Diethylene glycol 5

[0027] The preparation method of the above-mentioned flux is as follows: first place the solvent and the bonding film-forming agent according to the batching amount in a container with a dispersing device, heat and stir continuously until the materials are completely dissolved, then add the rest of the materials at one time, continue heating and stirring until all When the material is completely dissolved into a clear thin viscous liquid, stop heating and stirring, seal the mouth of the container, and let it stand for cooling.

Embodiment 2

[0029] A kind of soldering flux for electronic mounting lead-free solder paste, its component and content (wt%) are:

[0030] polymerized rosin 30

[0031] Acrylic 120 Resin 18

[0032] TSR-610 resin 6

[0033] Succinic acid 5.9

[0034] Methylene stearic acid amide 5

[0035] Polyethylene wax 4

[0036] Benzotriazole 1

[0037] Hexadecyltrimethylammonium bromide 0.1

[0038] Diethylene glycol monobutyl ether 20

[0039] Benzyl alcohol 10

[0040] The preparation method of the above-mentioned flux is as follows: first place the solvent and the bonding film-forming agent according to the batching amount in a container with a dispersing device, heat and stir continuously until the materials are completely dissolved, then add the rest of the materials at one time, continue heating and stirring until all When the material is completely dissolved into a clear thin viscous liquid, stop heating and stirring, seal the mouth of the container, and let it stand for cooling.

Embodiment 3

[0042] A kind of soldering flux for electronic mounting lead-free solder paste, its component and content (wt%) are:

[0043] polymerized rosin 28

[0044] TSR-685 resin 16

[0045] TSR-610 resin 11

[0046] Succinic acid 6

[0047] Salicylic acid 2.4

[0048] Ethylene bis stearic acid amide 2.5

[0049] Hydrogenated castor oil 2.5

[0050] castor oil 3

[0051] Benzotriazole 1

[0052] Hexadecyltrimethylammonium bromide 0.1

[0053] Diethylene glycol monobutyl ether 16.5

[0054] N-methyl-2-pyrrolidone 8.5

[0055] Diethylene glycol 2.5

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PUM

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Abstract

The invention discloses an electronic mounting lead-free soldering paste flux, with the components and weight contents: 45-65% of bonding-film forming agent, 0.2-15% of activator and surfactant, 1-10% of thixotropic sink-proof slipping agent, 0.5-10% of fitting additive, and the residual quantity of solvent. The preparation method of the flux is that the solvent and the bonding film-forming agentare arranged in a container which is provided with a dispersion device according to the dosage, are heated and continuously mixed till that the material is fully dissolved; after that, other materials are once added; the heating and mixing are continued till that all materials are dissolved into bright dilute viscous liquid, and then the heating and mixing are stopped; the mouth of the container is sealed, and the invention can be obtained after static arrangement. The SnAgCuBi and AnAgCu soldering paste which is made by the flux of the invention contains no halogens, requires no cleans, has good printing performance, does not stick plates, has no bypasses or topnotch and good forming of printing point, and has no edge collapse. By reflow soldering, the welding surface and the welding spot are bright and smooth without residue or solder beadings. All technical indexes of the flux and the soldering paste achieve the JIS-3197 standard.

Description

technical field [0001] The invention relates to a flux used for lead-free solder paste, and meanwhile, the invention also relates to a preparation method of the flux used for lead-free solder paste. Background technique [0002] Electronic surface mount technology reflow soldering (SMT) is a solder paste pre-distributed on the electronic printed circuit board pad (PCB), which is heated and melted in a reflow furnace to achieve soldering of surface mount components or pins to the printed board. Mechanical and electrical connections between disks. The main feature of this technology is that the components do not invade the molten solder, the thermal shock is small, only the soldering part is soldered, and the amount of solder can be controlled. Mounting is not limited by pin pitch and through-hole pitch, and it can be mounted on both sides, which greatly improves the assembly density of electronic products and realizes fine-pitch soldering. Compared with plug-in welding, its...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/36B23K35/365
Inventor 曾宪逸陆雁
Owner GUANGZHOU SOLDERWELL ADVANCED MATERIALS
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