Metal-ceramic composite substrate and method for manufacturing same

Abstract

A metal-ceramic composite substrate having an excellent heat dissipating characteristic and a method for manufacturing such composite substrate at low cost. The metal-ceramic composite substrate (10) is composed of a metal substrate (11), a ceramic layer (12) formed on the metal substrate (11), an electrode layer (13) formed on the ceramic layer (12), and a solder layer (14) formed on the electrode layer (13). The ceramic layer (12) is composed of a ceramic thin film. When the ceramic layer (12) is formed of an aluminum nitride thin film, the metal-ceramic composite substrate (10) having the excellent heat dissipating characteristic is provided for an electronic circuit.

Description

technical field [0001] The present invention relates to a metal-ceramic composite substrate used as a substrate for electronic circuits and a method for producing the same. Background technique [0002] Generally, various electronic components are mounted and soldered at predetermined positions on a copper wiring pattern formed on a printed circuit board, and electronic circuits are connected. However, since various resins such as paper phenolic resin, epoxy resin, and glass epoxy resin are used as the material of the printed circuit board, although it is low in cost, heat dissipation is not good. [0003] Patent Document 1 discloses a circuit board for mounting a semiconductor in which an insulating filler is poured into a patterned metal base substrate of Al, Cu, or the like to form a circuit in order to achieve high-density mounting of the circuit board for mounting a semiconductor. In this document, a silicon-containing epoxy resin having a thickness of 100 μm is used a...

AI Technical Summary

Problems solved by technology

However, there is a problem that the sintering process of the ceramic substrate itself is required, the process is complicated, the yield is poor, and the cost is higher than that of the printed circuit board and the metal base substrate of Patent Document 1.

[0007] In addition, if the circuit structure is miniaturized, the thermal resistance per unit volume of the ceramic substrate with low thermal conductivity will be higher than that of the metal substrate with Cu and Al as the substrate.

Therefore, on a small circuit such as a semiconductor element mounted thereon, such as a heat sink (submount), the thermal resistance of the AlN substrate of the entire heat sink is 90% or more, and the heat dissipation performance is deteriorated, so it cannot be said that it is not suitable for heat dissipation.

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