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Metal microgrid transparent electrode and method for producing the same

A technology of transparent electrodes and micro-grids, applied in metal material coating process, circuits, electrical components, etc., can solve the problems of complex preparation process of transparent electrodes, low transmittance in the ultraviolet band, high resistivity, and achieve good electrical conductivity. , low cost, high transmittance effect

Inactive Publication Date: 2008-08-20
BEIHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a metal micro-grid transparent electrode with high and stable ultraviolet and visible light transmittance, high conductivity, and low preparation cost and its preparation method, so as to overcome the complicated and high cost of the existing transparent electrode preparation process, Defects with low transmittance in the ultraviolet band and high resistivity

Method used

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  • Metal microgrid transparent electrode and method for producing the same
  • Metal microgrid transparent electrode and method for producing the same
  • Metal microgrid transparent electrode and method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1, preparation Ni microgrid transparent electrode

[0020] 1. Using monodisperse polystyrene microspheres with a particle size of 1.4 μm to assemble a monolayer colloidal crystal template

[0021] 2. Using the magnetron sputtering method, metal Ni is deposited on the surface of the template, the working pressure is 0.5Pa, and the power is 40W

[0022] 3. The sputtering stopped after 5 minutes, and Ni was uniformly filled in the gap of the single-layer colloidal crystal template.

[0023] 4. Put the Ni-filled template into the toluene solution for ultrasonic treatment

[0024] 5. Stop after 30 minutes of sonication

[0025] 6. Take it out from the toluene solution and dry it to obtain a highly ordered Ni microgrid transparent electrode (as shown in Figure 3): pore size, 1.2 μm (as shown in Figure 2 (a)); grid thickness , 10nm; grid width, 140nm.

Embodiment 2

[0026] Embodiment 2, preparation of Al microgrid transparent electrode

[0027] 1. Using monodisperse polystyrene microspheres with a particle size of 3.9 μm to assemble a monolayer colloidal crystal template

[0028] 2. Using the magnetron sputtering method, metal Al is deposited on the surface of the template, the working pressure is 0.5Pa, and the power is 50W

[0029] 3. The sputtering stopped after 5 minutes, and Al was uniformly filled in the gap of the single-layer colloidal crystal template.

[0030] 4. Put the template filled with Al into the toluene solution for ultrasonic treatment

[0031] 5. Stop after 30 minutes of sonication

[0032] 6. Take it out from the toluene solution and dry it to obtain a highly ordered Al microgrid transparent electrode: aperture, 3.4 μm (as shown in Figure 2 (b)); grid thickness, 25nm; grid width, 250nm.

Embodiment 3

[0033] Embodiment 3, preparation silver Ag micro grid transparent electrode

[0034] 1. Using monodisperse polystyrene microspheres with a particle size of 5.1 μm to assemble a monolayer colloidal crystal template

[0035] 2. Use the magnetron sputtering method to deposit metal Ag on the surface of the template, the working pressure is 0.5Pa, and the power is 80W

[0036] 3. The sputtering stopped after 8 minutes, and Ag was uniformly filled in the gap of the single-layer colloidal crystal template.

[0037] 4. Put the Ag-filled template into the toluene solution for sonication

[0038] 5. Stop after 30 minutes of sonication

[0039] 6. Take it out from the toluene solution and dry it to obtain a highly ordered Ag microgrid transparent electrode: aperture, 4.5 μm (as shown in Figure 2 (c)); grid thickness, 30nm; grid width, 580nm.

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Abstract

The present invention relates to a metal microgrid transparent electrode and fabricating method thereof. The transparent electrode has orderly metal microgrid structure whose thickness is 10-50nm, width is 140-800 nm and aperture is 1-6 mum. The fabricating method is that: assembling single-layer colloid crystal template by monodisperse polystyrene microspheres, depositing metal in template sews by magnetron sputtering technique, and the sputtering time is 5-10 minutes; at last, eliminating single-layer colloid crystal template by ultrasonic washing of organic solvent for 20-30 minutes and the said transparent electrode is gained. The metal microgrid structure of transparent electrode has high light transmittance, low resistance and low cost, has widely usage in optoelectronic device, photodetector and semiconductor irradiance. The fabricating method of present invention has simply technics and easy operation.

Description

technical field [0001] The invention relates to a metal micro-grid transparent electrode and a preparation method thereof, belonging to the technical field of transparent conductive metal films. Background technique [0002] At present, transparent electrodes with low resistance and high light transmission performance are required in optoelectronic devices such as solar cells, semiconductor detectors, electroluminescence and flat panel displays. Transparent conductive oxide films (TCOs), such as indium oxide-based, zinc oxide-based, and tin oxide-based films, are often used as transparent electrodes for the above-mentioned devices. Indium oxide-based ITO (tin-doped indium oxide) is particularly famous and widely used. However, ITO has many shortcomings. For example, compared with metals such as Ag and Ni, the high resistivity of ITO cannot meet the development requirements of the lower resistivity of the above-mentioned devices. The low transmittance of ITO in the ultraviol...

Claims

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Application Information

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IPC IPC(8): H01L31/0224H01L31/18H01L51/00H01L51/44H01L51/48H01L51/52H01L51/56H01L23/48H01L21/283C23C14/04
CPCH10K50/813
Inventor 祁洪飞郝维昌王天民
Owner BEIHANG UNIV
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