Hard laminated film

A lamination and coating technology, applied in the direction of coating, layered products, metal material coating process, etc., can solve the problems of reduced surface properties, abnormal discharge, hindering high-efficiency ionization of gas, etc., to achieve wear resistance and Excellent lubricity, improved wear resistance or oxidation resistance

Active Publication Date: 2008-09-03
KOBE STEEL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when arc film formation and sputtering film formation are performed simultaneously in the same film formation chamber, especially in the case of film formation by increasing the partial pressure of reactive gas such as nitrogen in order to improve film performance, the The material used for the sputtering evaporation source, the sputtering target reacts with the above-mentioned reactive gas to produce an insulator (insulator) on the surface of the target, and due to this insulator, the possibility of abnormal discharge (arcing) in the sputtering evaporation source Big
In addition, this pr

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-1

[0320] The influence of the crystal structure of layer B is investigated below. That is, it was confirmed that when a material having a cubic crystal rock-salt structure in the crystal structure is selected as the layer A, and a material having the same cubic rock-salt structure or a material having a different crystal structure is selected as the layer B, the crystal grains The presence or absence of the miniaturization effect.

[0321] Specifically, using the above image 3 The shown sputtering film forming apparatus having two sputtering evaporation sources 2 and 3 forms a film having a laminated structure shown in Table 1. A cemented carbide (surface mirror-polished) for hardness measurement was used as the substrate 1 . After loading the substrate into the above image 3 After being inside the device, while heating the substrate temperature to the range of 400-500°C, vacuumize to 3×10 -3 Pa or less, after cleaning with Ar ions (pressure 0.6 Pa, substrate voltage 500 V...

Embodiment 1-2

[0328] Based on the results of this Example 1-1, the crystal structure of layer B was investigated in more detail. That is, it was confirmed that a hard coating material having a rock-salt cubic crystal structure such as TiAlN, CrN, and TiN was selected as the layer A, and a material having a crystal structure other than the rock-salt cubic crystal structure such as Cu, Co, SiN, and BN was selected as the layer B, or In the case of materials having a rock-salt cubic crystal structure such as CrN, MoN, WN, TaN, and AlN, or in the case where layer B is not provided, whether there is an effect of refining crystal grains and the strength of the film.

[0329] Specifically, and with the above image 3 The sputtering film-forming apparatus with the two sputtering evaporation sources 2 and 3 shown and the composite film-forming apparatus of arc and sputtering shown in FIG. 5 formed a film having the laminated structure shown in Table 2. As the substrate, the same cemented carbide (m...

Embodiment 1-3

[0336] Next, the effect of the thickness of the layer B made of a material having a crystal structure other than the rock-salt cubic crystal structure on the effect of refining the crystal grains of the layer A was examined.

[0337] As a film forming apparatus, a test material was prepared under the same conditions using the same sputtering apparatus and composite film forming apparatus as in Example 1-2 above. As the layer A, (Ti0.5Al0.5)N, CrN, and TiN, which are materials having a rock-salt cubic crystal structure and having high hardness, are selected, and as the layer B, SiN, BN, and Cu are selected. In the formation of layers such as SiN, BN, and Cu, Si, B 4 C and Cu targets.

[0338] In addition, by fixing the thickness of layer A at 30nm and changing the thickness of layer B in the range of 0.2 to 100nm, the effect of the thickness of layer B on the miniaturization effect of crystal grains was studied. About the test material after film formation, similarly to Examp...

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Abstract

A hard laminated film is provided, wherein a layer A and a layer B having specific compositions are deposited alternately so that the compositions of layer A and layer B are different. The thickness of layer A per layer is twice or more the thickness of layer B per layer, the thickness of layer B per layer is 0.5 nm or more, and the thickness of layer A per layer is 200 nm or less. Thereby, the invention provides a cutting tool used as the basis materials, such as the extra hard alloy, the ceramic metal or the high speed steel and the like, or the abrasion resistance capsule of the vehicle slide unit and the like.

Description

[0001] This application is a divisional application of application number 200510005755.1, filing date: January 25, 2005, and title of the invention "hard laminated film, its manufacturing method and film forming device". technical field [0002] The present invention relates to a hard laminated coating having excellent mechanical properties obtained by finely controlling the crystal particle diameter, a hard laminated coating having wear resistance formed on the surface of a cutting tool or a sliding part of an automobile, and a wear-resistant coating. Hard laminated coating with excellent damage or oxidation resistance. [0003] Furthermore, the present invention relates to a composite film-forming apparatus which has an arc evaporation source and a sputtering evaporation source and can form a hard laminated film having excellent characteristics. Background technique [0004] In recent years, there has been increasing demand for improved wear resistance of cutting tools bas...

Claims

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Application Information

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IPC IPC(8): B32B33/00B32B9/00C23C30/00C23C14/06B23B27/14
CPCC23C14/025
Inventor 山本兼司久次米进高原一树藤井博文
Owner KOBE STEEL LTD
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