Method for controlling growing multiple layer film for making multiple-level micro-reflector

A micro-mirror and multi-layer film technology, applied in the field of multi-level micro-mirror production, can solve the problems of difficult to precisely control corrosion or etching depth, difficult to guarantee horizontal accuracy, poor accuracy and repeatability, etc. Repeatability, high level accuracy, high flatness effect

Active Publication Date: 2008-10-22

CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI

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AI-Extracted Technical Summary

Problems solved by technology

Multi-level micro-mirrors can be used to perform multiple photolithography and multiple corrosions (dry or wet) on the substrate by binary optical technology to prepare stepped microstructures on various materials such as quartz. This method has the following disadvantages: 1. Due to multip...

Method used

(7), use magnetron sputtering or radio frequency sputtering or ion beam sputtering or dc sputtering or electron beam on the upper surface of the multilevel ladder structure made or the finished multilevel micromirror substrate Evaporation or thermal evaporation and other evaporation methods deposit a layer of high-reflection film, and the stepped structure coat...

Abstract

The invention relates to a method for producing a multi-stage microreflecting mirror by controlling the growth of a multi-layer film, which comprises the following steps that: a substrate is produced and is treated with cleaning; a first photomask is used to photoetch for forming a needed masking pattern, the width of a bright fringe and the width of a dark fringe of the first photomask are respectively L/2<1>; then coating material is deposited, photoresist and a film on the photoresist are peeled off, and a multi-stage film staircase is formed; each film layer staircase is orderly produced according to the method, the width of a bright fringe and the width of a dark fringe of the nth photomask are respectively L/2<n>, until the needed staircases are reached to finish the production of the substrate of a multi-stage microreflecting mirror; the produced substrate of the multi-stage microreflecting mirror is used as a template production mould, then a die casting method is used to produce a multi-stage staircase structure; and the surface of the multi-stage staircase structure or the substrate of the multi-stage microreflecting mirror is coated with a reflection increasing film. The method effective improves the longitudinal dimension accuracy and the repetitiveness of the staircase, has strong process controllability and good repetitiveness, does not use chemical etching, and reduces the pollution.

Application Domain

MirrorsPhotomechanical apparatus

Technology Topic

PhotoresistEtching +5

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Examples

Experimental program(1)

Example Embodiment

[0022] The method for manufacturing a multi-level micro-mirror by controlling the growth of a multilayer film of the present invention will be described in detail below. In this method, a multi-stage micro-reflector is made by a controlled growth multilayer film method. The total number of steps is 16, and the total width of the multi-stage micro-reflector is 8mm. The specific process flow is as follows:

[0023] (1) Use double-sided polished silicon or glass or silicon dioxide or silicon carbide or molybdenum wafers or quartz wafers with a surface roughness of 0.2 nm to 1 μm as the substrate, and clean it;

[0024] (2) Coating photoresist on the upper surface of the substrate, exposing and developing with the first lithography plate, hardening the film to form the required masking pattern; the width of the bright stripes and dark stripes of the first lithography plate are each L/2 1; Then by magnetron sputtering or radio frequency sputtering or ion beam sputtering or DC sputtering or electron beam evaporation or thermal evaporation or electroforming methods such as silicon or silicon dioxide or aluminum or gold or copper or silicon carbide or molybdenum or Titanium or nickel or other coating materials are deposited or electroformed on the surface of the substrate, and the photoresist and the film deposited on it are stripped with a glue remover to form a film step, as shown in Figure 1(a), the film thickness is 400nm, width 4mm, cleaning.

[0025] (3) Coat photoresist on the upper surface of the sample produced in step 2, and then use the second photolithography plate to perform the second photolithography to form the required masking pattern; the second photolithography plate has bright stripes And the width of the dark stripes are each L/2 2; Then through the same process as in step two, the same or different materials as in step two are deposited or electroformed on the surface of the substrate, and the photoresist and the film deposited on it are peeled off with a glue remover to form a second batch of film steps, As shown in Figure 1(b), the thickness of the film is 200nm, the width is 2mm, and it is cleaned.

[0026] (4). Coat photoresist on the upper surface of the sample produced in step 3, and perform the third photolithography with the third photolithography plate to form the required masking pattern; the third photolithography plate has bright stripes and The width of the dark stripes is L/2 each 3; Then through the same process as in steps two and three, the same or different materials as in steps two and three are deposited or electroformed on the surface of the substrate, and the photoresist and the film deposited on it are peeled off with a remover to form the third batch The film step, as shown in Figure 1(c), the film thickness is 100nm, the width is 1mm, and it is cleaned.

[0027] (5). Coat photoresist on the upper surface of the sample made in step 4, and perform the fourth photolithography with the fourth photolithography plate to form the required masking pattern; the fourth photolithography plate has bright stripes and The width of the dark stripes is L/2 each 4;, and then by magnetron sputtering or radio frequency sputtering or ion beam sputtering or direct current sputtering or electron beam evaporation or thermal evaporation or electroplating of metal and other methods of silicon, silicon dioxide, silicon carbide, molybdenum, titanium, nickel or other The coating material is deposited or electroplated on the surface of the substrate to form another batch of film steps, as shown in Figure 1(d), the film thickness is 50nm, the width is 0.5mm, the photoresist is removed and cleaned. The height of each small step of the final multi-stage micro-mirror substrate is 50nm, the width is 0.5mm, the vertical height between the first film and the last film is 800nm, the total number of steps is 16, and the total width of the mirror is 8mm .

[0028] (6) Use the multi-stage micro-reflector substrate made above as a template to make a metal mold by electroforming, or make a mold with silicon rubber, etc., and then use the mold-casting method to make a ladder structure. The material of the multi-level ladder structure can be Choose metals such as aluminum or gold or copper or titanium or nickel.

[0029] (7) Magnetron sputtering or radio frequency sputtering or ion beam sputtering or direct current sputtering or electron beam evaporation or heat is used on the upper surface of the manufactured multi-level stepped structure or the finished multi-level micro mirror substrate. Evaporation and other evaporation methods deposit a layer of highly reflective film, and the stepped structure coating should use film theory to design the reflective layer of the multi-level micro-mirror. A protective film layer is deposited on the reflective film layer to prevent oxidation of the film material. The protective film material is generally MgF 2 Or Al 2 O 3 Or SiO 2. So far, the production of multi-stage micro mirrors is completed.

PUM

Property	Measurement	Unit
Surface roughness	0.2	nm

Description & Claims & Application Information

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Strong process controllability
Improve accuracy and repeatability

Method for controlling growing multiple layer film for making multiple-level micro-reflector

AI-Extracted Technical Summary

Problems solved by technology

Method used

Abstract

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Examples

Example Embodiment

PUM

Description & Claims & Application Information

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