Flame-retardant organosilicon powder encapsulating material for electronic component

Abstract

The invention relates to a flame-retardant organic silicon powder encapsulation material used for an electronic component. The compositions by weight percentage of the flame-retardant organic silicon powder encapsulation material are: 15 to 60 percent of organic silicon resin, 20 to 80 percent of padding, 1 to 20 percent of plasticizer, 0.5 to 1.5 percent of catalyst, and 0.5 to 5 percent of addition agent. The flame-retardant organic silicon powder encapsulation material has the characteristics of environmental protection, innocuousness, high temperature resistance, good flame redartance, low solidification temperature, self-levelling, good electrical insulation property and so on, and is applicable to encapsulations of voltage dependent resistor, thermistance, porcelain capacitor and other electronic components.

Description

technical field [0001] The invention belongs to the field of packaging materials for electronic components, in particular to a flame-retardant organic silicon powder packaging material for electronic components. Background technique [0002] Electronic components need to be coated with a high-strength, insulating and moisture-proof coating on the surface of these chips after the component chips are produced, processed and passed the inspection. The quality and performance of this coating is of great importance to the quality of electronic components. Impact. Now this kind of coating material generally uses epoxy powder packaging material, which has good adhesion, high mechanical performance and low cost, and can reach the UL-V0 flame retardant level. Nevertheless, when electronic components are impacted by instantaneous overload voltage, the huge heat generated can still ignite the epoxy packaging material. Although the use of halogen flame retardants and antimony-based sy...

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Problems solved by technology

[0005] By searching, the following two similar patented technologies were found: European patent (EP0950695A1) once mentioned a silicone resin composition, which can be used for heat-resistant coatings, but has the following disadvantages when used for encapsulating coatings: 1. The thickness of the coating film can only be Reach tens of μm, too thick will easily cause the coating film to crack and fall off, while the thickness of the coating film formed by the surface packaging material of electronic components should reach at least 300 μm; 2. The curing temperature exceeds 230°C, and the heat-resistant temperature of electronic components generally does not exceed 180°C , otherwise it is easy to cause the solder joints to fall off

Chinese patent (CN101163748A) mentions a silicone encapsulant. The product is molded by heating, which cannot achieve self-leveling by heating. However, the encapsulation material involved in the present invention must be self-leveling by heating and have a glossy appearance.

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