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Casting die for preparing elastic plastics casting with three dimensional structure

A three-dimensional structure, elastic plastic technology, applied in the direction of photoengraving process coating equipment, optomechanical equipment, microlithography exposure equipment, etc., can solve the problem that PDMS embedded molds cannot be removed, the microstructure of casting molds is damaged, and the toxicity and corrosiveness are high. And other issues

Active Publication Date: 2008-12-31
CAPITALBIO CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The oxygen atoms in the PDMS molecular chain can easily form strong hydrogen bonds with the hydroxyl groups on the surface of the material. When the surface of the casting mold used contains a large number of hydroxyl groups, the PDMS casting will form a strong bond with the casting mold. Adhesion, resulting in difficulty in demoulding
In addition, because the strength of the PDMS material itself is not high, especially when there are microstructures with high aspect ratios on the casting mold, the following three problems will easily occur: 1. The microstructures of PDMS castings are destroyed during the demoulding process; 2. The broken PDMS embedded mold cannot be removed, causing damage to the casting mold; 3. During the demoulding process, the microstructure of the casting mold is destroyed
The commonly used demoulding method is to place the prepared mold in the environment of dichlorodimethylsilane. Due to the volatile dichlorodimethylsilane, it will be hydrolyzed when it encounters water molecules in the air to form hydrochloric acid and silicone oil. Silicone oil Adsorbed on the surface of the mold, on this surface adsorbed silicone oil, cast PDMS, easy to demould
There are two problems with this method: 1. Dichlorodimethylsilane is extremely volatile, highly toxic and corrosive, and needs to be operated in a fume hood; 2. The surface that absorbs silicone oil can only be cast once, and the next casting must be done again to adsorb
[0007] In addition, due to the poor adhesion of the film formed by SU8 on the glass surface, it is impossible to directly fabricate microstructures on the glass surface with SU8, so PDMS casting molds are all made on silicon wafers, and the cost of silicon wafers is 100-150 times that of glass.

Method used

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  • Casting die for preparing elastic plastics casting with three dimensional structure
  • Casting die for preparing elastic plastics casting with three dimensional structure
  • Casting die for preparing elastic plastics casting with three dimensional structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Embodiment 1, the elastic plastic casting mold with three-dimensional structure

[0034] The elastic plastic casting mold with three-dimensional structure comprises the following steps:

[0035] 1) Carry out overall processing directly on the surface of the glass substrate, and form such as figure 1 A conventional mold 1 structure is shown.

[0036] 2) 5 milliliters of KMP-BN303 ultraviolet negative photoresist produced by Beijing Huake Microelectronics Materials Co., Ltd. and 95 milliliters of xylene were prepared into 5% BN303 xylene solution. This solution is spin-coated onto the casting mold surface of step 1) with a spin coater at a speed of 3000rpm, and the thickness of this layer is 0.1 micron, forming figure 2 Structural casting molds;

[0037] 3) Will figure 2 The casting mold of the structure is placed on a hot plate at a temperature of 70-80° C. for 20-30 minutes.

[0038] 4) The casting mold in step 3) is exposed to ultraviolet light with an EV620 lit...

Embodiment 2

[0039] Embodiment 2, the elastic plastic casting mold with three-dimensional structure

[0040] The elastic plastic casting mold with three-dimensional structure comprises the following steps:

[0041] a) Coating cyclized rubber negative photoresist KMP-BN302 on the flat substrate surface 3 with a spin coater, spin coating at 3000rpm and 30 seconds to prepare a KMP-BN302 layer 4 with a thickness of 1 micron, as Figure 5 shown.

[0042] b) Using the EV620 lithography machine (500W mercury lamp) produced by Austrian company for ultraviolet light exposure, no mask exposure, 2 seconds, 15.3mw / cm 2 .

[0043] c) Apply SU-8 photoresist 2 on layer 4 of the cyclized rubber negative photoresist KMP-BN302, which can be coated by a coating machine, or by roller coating. Applying on the substrate or pasting the film is to paste the SU-8 prefabricated film on the substrate by rolling, and adopt different glue coating conditions to get different thickness of the film.

[0044] In this em...

Embodiment 3

[0047] Embodiment 3, the elastic plastic casting mold with three-dimensional structure

[0048] The elastic plastic casting mold with three-dimensional structure comprises the following steps:

[0049] a) Coat the RFJ-220 negative photoresist produced by Suzhou Ruihong Electronic Chemicals Co., Ltd. on the surface 3 of the flat substrate with a spin coater, and spin coat at 3000 rpm for 30 seconds to prepare a RFJ-220 with a thickness of 1 micron. 220 negative photoresist layer 4, such as Figure 5 shown.

[0050] b) Coat SU-8 photoresist 2 on the RFJ-220 negative photoresist layer 4, which can be coated with a coating machine to rotate, or can be coated with SU-8 photoresist on the substrate by roll coating. On-chip or through film-pasting method is to paste SU-8 prefabricated film on the substrate by rolling, and use different gluing conditions to get different thickness of the film.

[0051] In this embodiment, a glue applicator is used to spin-coat SU-8 2050 at a speed ...

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PUM

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Abstract

The invention discloses a casting die which is used for preparing elastic-plastic casting with three-dimensional structures. The casting die has two types: one type of the casting die consists of a device with a three-dimensional structure and a light-cured cyclized rubber negative photoresist layer on the surface of the device; the device with the three-dimensional structure can be formed by the direct integral forming with substrate material; alternatively, the required three-dimensional structure can be processed on the surface of the substrate by epoxy-group negative photoresist; the other type of the casting die consists of a substrate, a light-cured cyclized rubber negative photoresist layer on the surface of the substrate and a three-dimensional structure layer which is arranged on the surface of the cyclized rubber negative photoresist layer and is processed by the epoxy-group negative photoresist. The invention also provides a preparation method of the casting die with the three-dimensional structure. The PDMS casting prepared by the casting die of the invention is extremely easy to fall and the PDMS casting has complete structure; meanwhile, the processing cost of the casting die is reduced.

Description

technical field [0001] The invention relates to casting molds for producing elastic plastic castings with three-dimensional structures. Background technique [0002] Polydimethylsiloxane (PDMS) is widely used in rapid processing to make microfluidic chips. Usually, silicon substrates are used to make casting molds. PDMS monomers and initiators are cast on the casting molds and cured by heating. De-mold to make PDMS plastic castings. Casting molds made of silicon wafers can be used repeatedly. This method is simple, fast, low cost, and easy to use, and has been widely used in the field of biochips. This processing technology is also called soft etching technology. The most important thing in soft etching technology is the casting mold of PDMS components. [0003] The oxygen atoms in the PDMS molecular chain can easily form strong hydrogen bonds with the hydroxyl groups on the surface of the material. When the surface of the casting mold used contains a large number of hydr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C39/26B29C33/40G03F7/16G03F7/20G03F7/038
Inventor 于中尧
Owner CAPITALBIO CORP