Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for processing rectangular micropore mould of diamond with laser

A micro-hole mold and laser processing technology, applied in the field of mold processing, can solve the problems of difficult to ensure tolerance size, difficult to process small hole electrodes, consumption of precious metal materials, etc., to achieve high hole shape dimensional accuracy, shorten production cycle, and hole shape good consistency

Inactive Publication Date: 2009-01-14
CHENGDU HONGBO INDAL
View PDF0 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, this method is affected by the influence of the electrode size accuracy, the error of the clamping and automatic feeding device, and the power of the electric spark. The precision of the die hole is not high, especially the die hole cannot be made small; and the initial shape of the die hole after piercing It does not necessarily meet the requirements of wire drawing and extrusion deformation. The shaping can only be partially corrected. The hole shape deviation after manufacture is large. The hole shape of the same specification mold is not the same. It is difficult to guarantee the tolerance size, so the mold is discrete; in addition In addition, this method consumes precious metal materials - copper and kerosene, and it is also very difficult to make electrodes for processing small holes.
[0006] Due to the development of production, the market needs high-precision, high-strength fine rectangular metal wires. The molds for manufacturing such high-end wires must be made of the hardest and best wear-resistant natural diamond crystals in nature. However, diamonds do not conduct electricity. Conventional mechanical processing and electrical processing methods are powerless to process rectangular micro-holes on diamond, so we can only find another solution

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for processing rectangular micropore mould of diamond with laser
  • Method for processing rectangular micropore mould of diamond with laser
  • Method for processing rectangular micropore mould of diamond with laser

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The method for laser machining diamond rectangular micro-hole mold provided in this embodiment comprises the following steps:

[0027] (1) Design the hole shape of the die hole so that the longitudinal section in the length direction of the die hole--Y direction and the width direction--X direction has a wire introduction area 1, a lubrication area 2, an extrusion deformation area 3, a fixed Path area 4 and lead-out area 5 (such as figure 1 shown);

[0028] (2) According to the shape of the hole, design and compile the computer operation program;

[0029] (3) The three-dimensional motion platform is controlled by a computer program for three-dimensional motion in space; the X-axis and Y-axis strokes are each 50 mm, and a grating displacement digital measurement system is installed with a resolution of less than 0.5 microns for closed-loop monitoring and control of displacement. Z The displacement is controlled by the motor;

[0030] (4) Using light-emitting diode pum...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method that diamond rectangle micropore die is processed by laser, comprising the following steps: (1) the shape of the die hole is designed, and the die hole can have wire material lead-in area, lubrication area, compression deformation area, sizing area and lead-out area; (2) the computer working procedure can be designed and compiled according to the hole shape; (3) the three-dimensional motion platform makes spatial three-dimensional motion under the control of computer procedure; (4) the laser power of the laser device can be adjusted by the computer, and the laser repetitive pulse frequency can be adjusted by automatic linear; (5) the laser bundle is focused on the work pieces, and cremation is produced on the focal point. The three-dimensional motion platform bears the pellets, and the processed parts of the pellets are moved on the laser focal point. The laser bundle can be controlled, the required hole shape can be scanned and processed on the diamond pellets circle by circle and layer by layer. The provided method can process the diamond into rectangle micropore die. The rectangle metal wire materials with the pore diameter less than 0.1mm, high precision and high strength can be made by using the die.

Description

technical field [0001] The invention relates to a processing method of a mold, in particular to a processing method of a diamond rectangular micro-hole mold. Background technique [0002] Diamond wire drawing dies are used to draw high-strength hard metal wires or high-precision soft metal wires. Usually the shape of the hole is a round hole, that is, the cross section of the drawn wire is circular, but in special applications, it is necessary to use tungsten wire, molybdenum wire or other metal wire with high strength, high precision, small size, and rectangular cross section. . In the prior art, metal wires such as tungsten wires and molybdenum wires can be obtained by rolling round wires, but the cross-section is not rectangular, it is a flat wire with arc-shaped ends at both ends of the cross-section, and the width and uneven thickness, for example, within a length of 1 meter, the size of each section of its width and thickness is not the same, which cannot meet the re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/04B23K26/08B21C3/02
Inventor 华文斗何庆春
Owner CHENGDU HONGBO INDAL
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products