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Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film

A resin composition, thermosetting technology, applied in printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problem that the wiring pattern has not been studied in detail, and achieve excellent long-term reliability, not easy to warp and deform, and tightness excellent effect

Inactive Publication Date: 2009-04-01
RESONAC HOLDINGS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Therefore, although conventional overcoating agents have been studied for their adhesion to wiring pattern forming metals such as copper, they have not been studied in detail for wiring patterns with tin plating.

Method used

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  • Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film
  • Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film
  • Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film

Examples

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Comparison scheme
Effect test

Embodiment

[0195] The following examples are given to illustrate the present invention, but the present invention is not limited by these examples.

Synthetic example 1

[0197] Synthesis example of carboxyl group-containing polyurethane resin (A-1) using polycarbonate diol

[0198] In a reaction vessel equipped with a stirring device, a thermometer, and a condenser, C-1065N (polycarbonate diol manufactured by Kuraray Co., Ltd.) was added as polycarbonate diol (polyol component (b)), and the raw material diol molar ratio was 1,9-nonanediol: 2-methyl-1,8-octanediol = 65:35, molecular weight 991) 70.7 g, 2,2-dimethylol as a dihydroxy compound (c) having a carboxyl group 13.5 g of butyric acid (manufactured by Nippon Kasei Co., Ltd.) and 128.9 g of diethylene glycol ethyl ether acetate (manufactured by Daicel Chemical Co., Ltd.) as a solvent were all dissolved in the solvent at 90°C.

[0199] The temperature of the reaction liquid was lowered to 70° C., and 42.4 g of Desmogel-W (manufactured by Sumitomo Bayer Uletan Co., Ltd.) was added dropwise through the dropping funnel over 30 minutes as the polyisocyanate (a).

[0200] After completion of ...

Synthetic example 2

[0203] Synthesis example of carboxyl group-containing polyurethane resin (A-2) using polybutadiene diol

[0204] In the reaction container that has stirring device, thermometer, condenser, add the commercial product named G-1000 (Nippon Soda Co., Ltd.) as polybutadiene diol (polyol component (b)) 646.5g, as having 103.8 g of 2,2-dimethylolbutyric acid (manufactured by Nippon Kasei Co., Ltd.) and 989.5 g of diethylene glycol ethyl ether acetate (manufactured by Daicel Chemical Co., Ltd.) as a solvent of the dihydroxy compound (c) of the carboxyl group, All starting materials were dissolved in solvent at 90°C.

[0205] The temperature of the reaction liquid was lowered to 70° C., and 217.3 g of Takenet 600 (manufactured by Mitsui Takeda Chemical Co., Ltd.) was dropped as polyisocyanate (a) over 30 minutes through the dropping funnel.

[0206] After completion of the dropwise addition, the reaction was carried out at 80°C for 1 hour, at 90°C for 1 hour, and at 100°C for 1.5 ho...

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Abstract

This invention provides an overcoating agent, which has excellent adhesion to a base material, particularly to tin, and, at the same time, has excellent long-term reliability of electrical insulation, and can provide a protective film having a small warpage level, and a heat curable resin composition. The heat curable resin composition is characterized by comprising a carboxyl group-containing urethane resin (A), a curing agent (B), and an acid anhydride (C) as indispensable components. The overcoating agent for a flexible circuit board is characterized by comprising a heat curable resin composition having the above constitution. There is also provided a surface protective film characterized by comprising a cured product of the heat curable resin composition.

Description

technical field [0001] The present invention relates to a thermosetting resin composition whose cured product has good adhesiveness, and uses of the thermosetting resin composition. More specifically, the present invention relates to a thermosetting resin composition capable of forming a flexible circuit board that maintains good electrical insulation over a long period of time and that has excellent adhesion between a cured product after heat curing and, for example, a wiring pattern constituting a wiring board. A material, a flexible circuit board overcoating agent formed from the thermosetting resin composition, and a surface protection film as a cured product of the overcoating agent. Background technique [0002] Conventionally, the surface protection film of the flexible wiring circuit has a type in which a polyimide film called a coverlay film is punched out according to a pattern, and then adhered with an adhesive; A type in which a flexible UV-curable or heat-curab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42C08K3/00C08L63/00C08L75/04H05K3/28
CPCH05K1/0393C09D175/04C08G18/69C08G18/348C08G59/4269C08G18/44H05K2201/0209C08L75/04C08K5/1539C08G18/6659C08K5/41C09D163/00H05K3/285C08G18/12C08G18/282C08L2666/20C08L2666/04C08L2666/14C08G59/42H05K3/28
Inventor 石原吉满井上浩文大西美奈
Owner RESONAC HOLDINGS CORPORATION