Unlock instant, AI-driven research and patent intelligence for your innovation.

Process for producing low-dielectric loss cyanate resin

A cyanate resin, low dielectric technology, applied in the field of preparation of low dielectric loss cyanate resin, can solve the problems of cyanate resin dielectric performance improvement, dielectric constant and dielectric loss factor increase, etc. Achieve the effects of improving mechanical properties, reducing dielectric constant and dielectric loss, and improving heat resistance

Active Publication Date: 2009-05-13
NANJING JINSHAN AUTOMOBILE ENG PLASTIC
View PDF0 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved in the present invention is that the dielectric constant and dielectric loss factor increase after modification in the modification method of the existing cyanate resin, and the dielectric properties of the cyanate resin cannot be improved. Provide a method for preparing low dielectric loss cyanate resin, the method can improve the dielectric properties of cyanate resin on the premise of ensuring the excellent mechanical properties of cyanate resin

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Process for producing low-dielectric loss cyanate resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Prepare according to the following formula

[0021] 95 parts by mass of bisphenol A type cyanate resin

[0022] Hollow glass microspheres (10-100 μm) 5 parts by mass

[0023] KH-560 0.25 parts by mass

[0024] 0.03 parts by mass of dibutyltin dilaurate

[0025] Put the hollow glass microspheres in a blast drying oven, and dry them at 80°C to 90°C for 1 hour; heat the bisphenol A cyanate resin monomer above the melting point to make it into a liquid state, and add silane to couple Agent KH-560 and dried hollow glass microspheres were mixed and stirred for 3 hours at 130°C to 145°C until the silane coupling agent diffused well and coupled on the surface of hollow glass microspheres; Dibutyltin dilaurate, stirred and dissolved, poured into a glass mold coated with a release agent, and cured in an electronic oven at 160°C / 2h+180°C / 2h+200°C / 2hr+220°C / 2h , and then post-treatment, the post-treatment temperature is 240 ° C, the time is 2 hours. The properties of the modif...

Embodiment 2

[0027] Prepare according to the following formula

[0028] 90 parts by mass of bisphenol A type cyanate resin

[0029] Hollow glass microspheres (10-100 μm) 10 parts by mass

[0030] KH-570 0.5 parts by mass

[0031] Di-n-octyltin dilaurate 0.03 parts by mass

[0032] Put the hollow glass microspheres in a blast drying oven, and dry them at 80°C to 90°C for 1 hour; heat the bisphenol A cyanate resin monomer above the melting point to make it into a liquid state, and add silane to couple Agent KH-570 and dried hollow glass microspheres were mixed and stirred for 3 hours at 130°C to 145°C until the silane coupling agent diffused well and coupled on the surface of hollow glass microspheres; Di-n-octyltin dilaurate, stirred and dissolved, poured into a glass mold coated with a release agent in advance, and carried out in an electronic oven according to the process of 160°C / 2h+180°C / 2h+200°C / 2hr+220°C / 2h Curing, and then post-processing, the post-processing temperature is 240 °...

Embodiment 3

[0034] Prepare according to the following formula

[0035] 85 parts by mass of bisphenol A type cyanate resin

[0036] Hollow glass microspheres (10-100 μm) 15 parts by mass

[0037] KH-560 / KH570 (1:1) 1 part by mass

[0038] Dibutyltin dilaurate / Di-n-octyltin dilaurate (2:1) 0.03 parts by mass

[0039] Put the hollow glass microspheres in a blast drying oven, and dry them at 80°C to 90°C for 1 hour; heat the bisphenol A cyanate resin monomer above the melting point to make it into a liquid state, and add silane to couple The mixture of agent KH560 / KH-570 (1:1) and the dried hollow glass microspheres were mixed and stirred at 130℃~145℃ for 3 hours until the silane coupling agent diffused well and coupled on the surface of the hollow glass microspheres. Link; add di-n-octyltin dilaurate / di-n-octyltin dilaurate (2:1) mixture to the above mixing system, stir to dissolve, pour into a glass mold pre-coated with a release agent, press 160 in an electronic oven °C / 2h+180°C / 2h+200...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to a method for preparing low dielectric electric loss cyanate resin. The method comprises the following steps: (1) hollow glass micro-beads are dried for 5 to 6 hours at a temperature of between 80 and 90 DEG C; the cyanate resin is heated to above melting point; after the cyanate resin is converted into a liquid; and a silane coupling agent and the dried hollow glass micro-beads are added to the cyanate resin, are mixed and stirred at a temperature of between 130 and 145 DEG C till the silane coupling agent is well diffused and is coupled on the surface of the hollow glass micro-beads; and (3) a catalyst is added to the mixing system, is stirred, is dissolved and is molded through a resin transfer moulding process to obtain the product. In the steps, the use amount of the compositions is as follows: 75 to 95 mass portions of the cyanate resin, 5 to 25 mass portions of the hollow glass micro-beads, 0.25 to 5 mass portions of the silane coupling agent and 0.02 to 0.05 mass portion of the catalyst. The prepared modified cyanate resin reduces the dielectric constant and dielectric loss of the cyanate resin, improves heat resistance and simultaneously improves certain mechanical performances, and reduces water absorption.

Description

Technical field: [0001] The invention relates to a preparation method of low dielectric loss cyanate resin. Background technique [0002] Cyanate resin has good mechanical properties, dielectric properties, heat resistance, etc. It, together with phenolic resin, epoxy resin, and bismaleimide resin, constitutes four high-performance resin matrix materials. Advanced composite material preparation technology - Resin Transfer Molding (RMT) solves the molding problem of cyanate resin, so that cyanate resin can be widely used. It can be used in structural materials, wave-transparent materials, dielectric functional materials, etc., and can be used in the fields of aerospace, electronic information, etc. [0003] In modern technology, stealth materials and radar materials are required to have very low dielectric constant (<3.5), low dielectric loss factor (<0.01), Tg>150°C, and good heat and humidity resistance. Most of the materials used are epoxy resin, bismaleimide re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/06C08K9/06H01B3/30
Inventor 牛建勋汪家宝孙瑜吴锡忠
Owner NANJING JINSHAN AUTOMOBILE ENG PLASTIC