Method for making high brightness LED chip
An LED chip, high-brightness technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as limiting the external quantum efficiency of GaN-based light-emitting diodes, and achieve the effects of improving external quantum efficiency, low cost, and simple process
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Embodiment 1
[0041] Example 1, such as figure 1 Shown is a front-mounted high-brightness LED chip, which includes a sapphire substrate 1, a GaN buffer layer 2, an n-type GaN layer 3, an InGaN / GaN multiple quantum well (MQws) active layer 4, a p-type GaN layer 5, from bottom to top. The p-type ohmic contact transparent electrode 6, the p-type ohmic contact metal electrode 7, and the n-type ohmic contact metal electrode 8.
[0042] The manufacturing method of the above-mentioned formally mounted high-brightness LED chip includes the following steps:
[0043] (1) On a sapphire substrate, use MOCVD to epitaxially grow a GaN-based LED structure epitaxial wafer;
[0044] (2) Use PECVD to deposit SiO on the epitaxial wafer 2 film;
[0045] (3) Use SiO 2 The thin film is used as a mask, and the N area pattern of the chip is photoetched on the epitaxial wafer by ICP dry etching technology;
[0046] (4) Use corrosive solution (40%N 4 HF: 40% HF: H 2 The volume ratio of O is 3: 1: 1) Cleaning the SiO th...
Embodiment 2
[0053] Embodiment 2, the manufacturing method of a high-brightness LED chip, including the following steps:
[0054] (1) On a sapphire substrate, use MOCVD to epitaxially grow a GaN-based LED structure epitaxial wafer;
[0055] (2) Use PECVD to deposit SiO on the epitaxial wafer 2 film;
[0056] (3) Use SiO 2 The thin film is used as a mask, and the N area pattern of the chip is photoetched on the epitaxial wafer by ICP dry etching technology;
[0057] (4) Use corrosive solution (40%N 4 HF: 40% HF: H 2 The volume ratio of O is 3: 1: 1) Cleaning the SiO that is not protected by photoresist 2 ;
[0058] (5) Clean the photoresist with stripping liquid;
[0059] (6) Use ICP to etch the N-side steps and the scribe lanes of the chip size to expose the n-GaN mesa;
[0060] (7) Use electron beam evaporation equipment to deposit Ti film on the epitaxial surface. The thickness of the Ti film is 300nm. Soak the epitaxial wafer in 30% KOH solution. At room temperature, use ordinary mercury lamp...
Embodiment 3
[0063] Embodiment 3, the manufacturing method of the high-brightness LED chip, including the following steps:
[0064] (1) On a sapphire substrate, use MOCVD to epitaxially grow a GaN-based LED structure epitaxial wafer;
[0065] (2) Use PECVD to deposit SiO on the epitaxial wafer 2 film;
[0066] (3) Use SiO 2 The thin film is used as a mask, and the N area pattern of the chip is photoetched on the epitaxial wafer by ICP dry etching technology;
[0067] (4) Use corrosive solution (40%N 4 HF: 40% HF: H 2 The volume ratio of O is 3: 1: 1) Cleaning the SiO that is not protected by photoresist 2 ;
[0068] (5) Clean the photoresist with stripping liquid;
[0069] (6) Use ICP to etch the N-side steps and the scribe lanes of the chip size to expose the n-GaN mesa;
[0070] (7) Use electron beam evaporation equipment to deposit Ti film on the epitaxial surface. The thickness of the Ti film is 280nm. Soak the epitaxial wafer in 5% hydrochloric acid solution at room temperature. Use ordin...
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