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Process for recovering polyethylene glycol and silicon carbide from silicon wafer wire cutting waste mortar

A polyethylene glycol and recovery method technology, applied in chemical instruments and methods, plastic recycling, separation methods, etc., can solve the problems of waste polyethylene glycol, large investment, low recovery rate of polyethylene glycol, etc., to avoid Pollution, the effect of convenient filtration treatment

Inactive Publication Date: 2011-05-04
西安通鑫半导体辅料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has relatively simple process requirements, but the investment is too large, and the recovery rate of polyethylene glycol is not high, and polyethylene glycol with considerable quality will be wasted.

Method used

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  • Process for recovering polyethylene glycol and silicon carbide from silicon wafer wire cutting waste mortar
  • Process for recovering polyethylene glycol and silicon carbide from silicon wafer wire cutting waste mortar
  • Process for recovering polyethylene glycol and silicon carbide from silicon wafer wire cutting waste mortar

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Utilize the present invention to process the waste mortar after the single and polysilicon slicing process is processed by the multi-wire saw cutting fluid, wherein the mass ratio of silicon carbide and polyethylene glycol suspension is about 1:1, and the specific steps are as follows:

[0038] Step 1, stir the waste mortar, add viscosity reducer - methanol, wherein the volume ratio of viscosity reducer and waste mortar is 3.5:1, and then enter the filter centrifuge for primary solid-liquid separation to obtain primary suspension and primary Grade solid particles;

[0039] Step 2, stirring the primary suspension, adding polyacrylamide, a filter aid with a mass fraction of 2 / 10,000 of the primary suspension, and then passing through a plate and frame filter to obtain secondary suspension and secondary solid particles;

[0040] Step 3, the secondary suspension is sequentially filtered through a microporous membrane with a pore size of 0.18 microns, and a polyethersulfone ...

Embodiment 2

[0043] Utilize the present invention to process the waste mortar after the single and polysilicon slicing process is processed by the multi-wire saw cutting fluid, wherein the mass ratio of silicon carbide and polyethylene glycol suspension is about 1:1, and the specific steps are as follows:

[0044] Step 1, stir the waste mortar, add viscosity reducer - ethanol, wherein the volume ratio of viscosity reducer and waste mortar is 4:1, and then enter the decanter centrifuge for primary solid-liquid separation to obtain primary suspension and primary Grade solid particles;

[0045] Step 2, stirring the primary suspension, adding polyamine, a filter aid with a mass fraction of 2 / 10,000 of the primary suspension, and then passing through a plate and frame filter press to obtain a secondary suspension and secondary solid particles;

[0046] Step 3, the secondary suspension is sequentially filtered through a microporous membrane with a pore size of 0.22 microns, and a polyethersulfon...

Embodiment 3

[0049] Utilize the present invention to process the waste mortar after the single and polysilicon slicing process is processed by the multi-wire saw cutting fluid, wherein the mass ratio of silicon carbide and polyethylene glycol suspension is about 1:1, and the specific steps are as follows:

[0050] Step 1, stir the waste mortar, add viscosity reducer—water, wherein the volume ratio of viscosity reducer to waste mortar is 4.5:1, and then enter the filter centrifuge for primary solid-liquid separation to obtain primary suspension and primary Grade solid particles;

[0051] Step 2, stirring the primary suspension, adding polyvinyl alcohol, a filter aid with a mass fraction of 2 / 10,000 of the primary suspension, and then passing through a vacuum filter to obtain a secondary suspension and secondary solid particles;

[0052] Step 3, the secondary suspension is filtered sequentially through a microporous membrane with a pore size of 0.26 microns, and a polyethersulfone hollow fib...

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Abstract

The invention relates to the field of silicon wafer wire-electrode cutting and discloses a method for recycling carborundum and cutting polyethyleneglycol in waste mortar by silicon wafer wire-electrode cutting. In monocrystalline silicon piece processing technique, a viscosity reduction agent is firstly added before waste mortar linear cutting, and then a suspending liquid part and a solid particles part are obtained by the solid-liquid separation; The suspending liquid part is added with a filter aid, then filter pressing with a plate frame, micro porous filtration, hyper filtration with hollow fiber and ion exchange are carried out sequentially, and finally, the suspending liquid is distillated in vacuum and polyethyleneglycol is recycled. Alkali reaction cleaning, water scrubber washing, centrifugalization, acid reaction cleaning, the second water scrubber washing, the second centrifugalization, the second acid reaction cleaning, drying and drying classification are carried out onthe solid particles in sequence, and finally, recyclable silicon carbide particles are obtained.

Description

technical field [0001] The invention relates to the field of silicon wafer wire cutting, in particular to treating polyethylene glycol and silicon carbide used in silicon wafer wire cutting waste mortar through physical and chemical methods, and recovering the polyethylene glycol and silicon carbide therein to make The method can be used in silicon wafer processing technology for many times, and is specifically a method for recovering polyethylene glycol and silicon carbide from waste mortar of silicon wafer wire cutting. Background technique [0002] Multi-wire cutting is one of the most effective methods for cutting large-diameter silicon single and polycrystalline rods. In recent years, the multi-wire cutting machine (wire saw for short) that has sprung up suddenly has a tendency to gradually replace the inner circle cutting machine in the field of large-diameter silicon wafer processing due to its extremely high production efficiency and wafer output rate. The multi-wir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01D36/00B01D37/00C08J11/06C08L71/08C01B31/36
CPCY02W30/62
Inventor 奚西峰宋涵
Owner 西安通鑫半导体辅料有限公司
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