High-speed multi-beam parallel laser direct-writing device

A laser direct writing and multi-beam technology, which is used in photolithography process exposure devices, laser welding equipment, microlithography exposure equipment, etc. and other problems, to achieve the effect of shortening writing time, improving system reliability, and reducing temperature drift

Active Publication Date: 2009-07-08
安徽中科春谷激光产业技术研究院有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. Using a single beam to write samples point by point, the writing speed is too slow, and it takes too long to write large-scale samples
[0005] 2. Without a microscopic monitoring module, it is impossible to observe the surface of the sample
[0006] 3. The sample to be

Method used

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  • High-speed multi-beam parallel laser direct-writing device
  • High-speed multi-beam parallel laser direct-writing device
  • High-speed multi-beam parallel laser direct-writing device

Examples

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no. 1 example

[0057] see first figure 1 , figure 1 It is a schematic diagram of the overall structure of the first embodiment of the high-speed multi-beam parallel laser direct writing device of the present invention, figure 2 It is the basic principle diagram of multi-beam writing in this embodiment. The high-speed multi-beam parallel laser direct writing device of the present invention is composed of six modules: a writing light source modulation module 1, a writing optical head 2, a defocus detection module 3, an illumination and monitoring module 4, a sample displacement table 5, and a main control module 6.

[0058] The writing light source modulation module 1 includes a laser 101 , an acousto-optic modulator 102 , and a spectroscopic beam splitter 103 . The laser 101 is a gas, solid or semiconductor laser, preferably a semiconductor laser. The spectral beam splitter 102 has high reflectivity for the laser light emitted by the laser 101 and high transmittance for other wavelength l...

no. 2 example

[0086] The overall structure schematic diagram of the second embodiment is as image 3 As shown, its working principle is as follows Figure 4 shown. Compared with the first embodiment, the feature of this embodiment is that a bi-telecentric lens group 104 is added between the acousto-optic modulator 102 and the spectral beamsplitter 103, and the function is to carry out the light beam emitted by the acousto-optic modulator The beam is expanded and collected at the entrance pupil of the writing objective lens 202 , and the light beam fills the entrance pupil of the writing objective lens 202 , thereby having a smaller converging spot and a smaller size of the writing spot.

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PUM

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Abstract

The invention provides a high-speed multi-beam parallel laser direct-writing device applying to micro-nano processing. The device consists of an inscribing light source modulation module, an inscribing optical header, an out-of-focus detection module, an illuminating and monitoring module, a sample displacement table and a master control module. The device greatly improves inscribing speed by multi-beam laser parallel high-speed inscribing. A multi-beam inscribing sub-system can be combined with sample tables with different motion modes to form inscribing devices with different functions according to the requirement of actual application.

Description

technical field [0001] The invention relates to the field of micro-nano processing, in particular to a high-speed multi-beam parallel laser direct writing device, which can be applied to the production of micro-electromechanical systems (referred to as MEMS) devices, semiconductor chip maskless lithography, semiconductor mask production, binary optics device manufacturing and many other fields. Background technique [0002] In the 21st century, nanotechnology will become one of the driving forces to promote the economic development of all countries in the world, and will bring revolutionary changes to industries such as medicine, manufacturing, materials and information communication. As one of many micro-nano processing methods, laser direct writing technology has many advantages such as low cost, short processing cycle, flexible use, and low environmental requirements. In microelectronics, integrated optics (DOEs), micro-electromechanical systems (MEMs), It has been widel...

Claims

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Application Information

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IPC IPC(8): G03F7/00G03F7/20B23K26/06B23K26/08B23K26/42B23K26/064B23K26/70
Inventor 徐文东范永涛
Owner 安徽中科春谷激光产业技术研究院有限公司
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