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Poly(arylene ether) composition, method and article

A technology of arylene ether and composition, applied to poly(arylene ether) composition, can solve problems such as insufficient heat resistance

Active Publication Date: 2009-08-26
SHPP GLOBAL TECH BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, cured vinyl is often too brittle and has insufficient heat resistance for use in some circuit board applications

Method used

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  • Poly(arylene ether) composition, method and article
  • Poly(arylene ether) composition, method and article
  • Poly(arylene ether) composition, method and article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-11

[0086] Examples 1-11, Comparative Examples 1-11

[0087] Eleven examples and eleven comparative examples illustrate the preparation and curing of compositions comprising alkylstyrenes and monofunctional or difunctional poly(arylene ether). The inventive examples used a difunctional poly(arylene ether) while the comparative examples used a monofunctional poly(arylene ether).

[0088] The properties of the poly(arylene ether) resin prior to methacrylate capping ("uncapped PPE") are shown in Table 1. In this context only for uncapped poly(arylene ether), "functionality" and "monofunctional" and "difunctional" refer to the average number of hydroxyl groups per molecule, not to the average The number of polymeric groups. Intrinsic viscosity is measured at 25°C in chloroform on poly(arylene ether) samples that have been vacuum dried at 125°C for 1 hour. Number average molecular weight (M n ), weight average molecular weight (M w ) and polydispersity index (M w / M n ) was dete...

Embodiment 12-15

[0111] Examples 12-15, Comparative Examples 12-14

[0112] In Table 4 are shown examples of compositions comprising a difunctional poly(arylene ether) having an intrinsic viscosity of 0.06 dL / g as measured in chloroform at 25°C. The poly(arylene ether) is obtained by oxidative copolymerization of 2,6-dimethylphenol and 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane, followed by methacrylic anhydride Prepared by end-capping with methacrylate. The performance results in Table 4 show increased glass transition temperature, increased heat distortion temperature, and Increased notched and unnotched Izod impact strength is associated with addition of difunctional poly(arylene ether). The results also show an increased glass transition temperature and increased Notched and unnotched Izod impact strength in relation to combinations of difunctional poly(arylene ether) and alkylstyrene. Furthermore, compared to examples of difunctional poly(arylene ether) / triallyl isocyanurate (TAIC) ...

Embodiment 16-30

[0117] Examples 16-30 illustrate other compositions of difunctional poly(arylene ether) having an intrinsic viscosity of 0.09 dL / g. Viscosity values ​​for curable (cured) compositions are expressed in centipoise (cps) and measured using a Brookfield Digital Viscometer Model DV-II following the Manufacturing Operation Manual no: m / 85-160-G procedure. The compressive strength and compressive modulus values ​​of the cured compositions, both expressed in megapascals (MPa), were measured according to ASTM D4762-04 at 23°C on samples with dimensions 1.25 cm x 1.25 cm x 5.08 cm. The Shore D hardness value of the cured composition is measured according to ASTM D2240-05 at 23°C. The data in Table 5 show that the glass transition temperature and compressive strength values ​​increase with increasing poly(arylene ether) content.

[0118] table 5

[0119] Ex.16

Ex.17

Ex.18

Ex.19

Ex.20

Ex.21

Ex.22

composition

PPE bifxl.0.09 ...

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Abstract

A curable composition includes an alkyl styrene and a low molecular weight, bifunctional poly(arylene ether). The composition can be prepared and processed at substantially lower temperatures than prior art poly(arylene ether) thermosets. After curing, the composition exhibits an improved balance of heat resistance, impact strength, and dielectric properties, making it particularly suitable for the fabrication of electronic components.

Description

Background of the invention [0001] Circuit boards are currently used in virtually every electronic device from computer devices to cell phones to electronic toys and even watches. As circuit board usage increases, so do their performance requirements, including better toughness, higher temperature tolerance, and better signal-to-noise ratios. [0002] Usually circuit boards are manufactured by coating a cloth made of glass fibers with a liquid resin that wets the cloth. Chemicals called hardeners or curing agents are added to liquid resins to start the chemical reaction that turns the liquid resin into a solid. This chemical transformation is often referred to as curing. [0003] Glass cloths containing liquid resins are often partially cured and referred to as "prepregs," describing glass cloths that have been pre-impregnated with liquid resins. When manufacturing circuit boards, several layers of prepreg are often combined under pressure and allowed to fully cure into a s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/08C08G65/48C08L71/12
CPCC08J9/32C08F283/08C08J2201/024C08L51/08C08F290/06C08L71/126C08J2371/12C08F290/062C08L2666/02C08L2666/04
Inventor 郭桦爱德华·N·彼得斯克里斯蒂娜·L·布雷德伍德
Owner SHPP GLOBAL TECH BV