Micromechanical terahertz waveguide, terahertz waveguide type resonant cavity and preparation method thereof

A terahertz, micro-mechanical technology, applied in optical waveguides, waveguides, resonators, etc., can solve the problems of difficult to ensure circuit operating characteristics and yield, long time consumption, high processing accuracy requirements, etc., to achieve large-scale parallelization Processing, shape flexibility and variety of effects

Inactive Publication Date: 2009-11-11
BEIJING INFORMATION SCI & TECH UNIV
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] 1) Active devices in the THz frequency band are usually planar devices made using IC (Integrated Circuit) technology; traditional metal waveguide designs are three-dimensional structures processed by precision mechanical cutting methods. When interfacing with active devices, high The precision fixture places the active device in a specific part inside the waveguide with a cross-sectional size of no more than 5mm, but then solders the corresponding leads, so there are problems such as assembly alignment difficulties, which affects the loss characteristics of its interface, and each connection process It takes a long time. According

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  • Micromechanical terahertz waveguide, terahertz waveguide type resonant cavity and preparation method thereof
  • Micromechanical terahertz waveguide, terahertz waveguide type resonant cavity and preparation method thereof
  • Micromechanical terahertz waveguide, terahertz waveguide type resonant cavity and preparation method thereof

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[0040]The present invention will be further described in detail below in conjunction with the drawings and specific embodiments:

[0041] figure 1 The basic structure of the micromechanical terahertz waveguide embedded in the low-temperature co-fired ceramic substrate of the present invention is shown. In the figure, the LTCC package substrate is composed of three-layer substrates 1a, 1b, and 1c. The above-mentioned flat substrates are stacked parallel to each other. The upper surface plate 1a and the lower surface plate 1c are processed by a bulk micromachining process with vertical axes. The waveguides 2a and 2b on the upper surface plate 1a and the lower surface plate 1c are used for signal input / output; the middle substrate 1b is fabricated with a rectangular cross-section waveguide 3 whose axis is parallel to the direction of the substrate, and the inner wall of all the waveguides is coated with High-conductivity metals such as Au, Ag or Cu are used to guide the propagation...

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Abstract

The invention discloses a micromechanical terahertz waveguide, a terahertz waveguide resonant cavity and a preparation method thereof, belonging to the technical field of spectrums. The micromechanical terahertz waveguide is a pipeline structure which is embedded in a package basal plate, and the package basal plate is formed by the stack of an upper surface plate, a lower surface plate and a plurality of middle basal plates; the waveguide device is arranged in the middle basal plates, and an axial line of the waveguide is parallel to the surface of the basal plate; the waveguide extends to the lateral outer surfaces of the middle basal plates, or the waveguide extends to the outer surfaces of the upper surface plate and the lower surface and is used for realizing signal input and signal output; and metals are coated on the inner wall of the waveguide. By utilizing the design principles of the THz waveguide, the terahertz waveguide resonant cavity can be prepared, and the preparation method is based on RF MEMS micromechanical technique and can be parallelized with large scale and processed with low cost.

Description

technical field [0001] The invention relates to the processing technology of metal waveguides used in the technical field of millimeter wave, submillimeter wave and terahertz (THz) wave spectrum, in particular to a micromechanical terahertz (THz) waveguide, a terahertz waveguide resonant cavity and a preparation method. Background technique [0002] At present, the operating frequency of microwave electronic devices is expanding to submillimeter wave (W band) and terahertz frequency band (THz, frequency range is about 300-3000GHz, wavelength 0.1-1mm). Among them, electromagnetic waves in the THz frequency band are sometimes called T-rays. Compared with the currently widely used S to Ka bands, these high-frequency electromagnetic waves have the following characteristics: 1) short wavelength, high resolution, clear and rich detailed information of objects can be obtained, and can be directly imaged; 2) The available frequency bandwidth can compete with light waves in high-spe...

Claims

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Application Information

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IPC IPC(8): H01P3/12H01P7/06H01P11/00G02B6/12
Inventor 缪旻张杨飞金玉丰
Owner BEIJING INFORMATION SCI & TECH UNIV
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