Lateral double-diffused metal-oxide-semiconductor transistor of silicon on N-type insulator

An oxide semiconductor and lateral double-diffusion technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of increased device on-resistance, increased device power consumption, unfavorable source region and middle region withstand voltage, etc., to reduce The effects of on-resistance, improvement of overall withstand voltage, and area reduction

Active Publication Date: 2009-12-09
SUZHOU POWERON IC DESIGN
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Problems solved by technology

[0004] In related technologies, it is proposed that the doping concentration of the N-type doped semiconductor region can be reduced, which can not only reduce the peak value of the vertical electric field, improve the vertical withstand voltage value of the device, but also increase the lateral device withstand voltage value, but it will make The on-resistance of the device is greatly increased, which increases the power dissipation of the device
[0005]

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  • Lateral double-diffused metal-oxide-semiconductor transistor of silicon on N-type insulator
  • Lateral double-diffused metal-oxide-semiconductor transistor of silicon on N-type insulator
  • Lateral double-diffused metal-oxide-semiconductor transistor of silicon on N-type insulator

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[0027] Conventional high-voltage N-type silicon-on-insulator lateral double diffused metal oxide semiconductor transistor structure, such as figure 1 Shown. The present invention provides an N-type silicon-on-insulator lateral double diffused metal oxide semiconductor transistor that can effectively increase the withstand voltage of the device and reduce the on-resistance of the device.

[0028] Such as figure 2 As shown, the N-type silicon-on-insulator lateral double-diffused metal oxide semiconductor transistor includes: a semiconductor substrate 9, on which a buried oxide layer 8 is provided, and on the buried oxide layer 8 is provided with N-type doping In the semiconductor region 7, a P-well 6 and an N-type drain region 10 are provided on the N-type doped semiconductor region 7, and an N-type source region 11 and a P-type contact region 12 are provided on the P-well 6, and on the surface of the P-well 6 A gate oxide layer 3 is provided, and the gate oxide layer 3 extends fr...

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Abstract

The invention relates to a lateral double-diffused metal-oxide-semiconductor transistor of silicon on an N-type insulator, which comprises the following components: a substrate is provided with a buried oxide layer; the buried oxide layer is provided with an N-type doped semiconductor region; the N-type doped semiconductor region is provided with a P trap and an N-type drain region; the P trap is provided with an N-type source region and a P-type contact region; a gate oxide is mounted on the surface of the P trap; regions except for the N-type source region on the surface of the P trap, P-type contact region and gate oxide and regions except the N-type drain region on the surface of the N-type doped semiconductor region are provided with field oxides; the surface of the gate oxide is provided with polysilicon gate; the surfaces of the field oxide, the P-type contact region, the N-type source region, the polysilicon gate and the N-type drain region are provided with oxide layers; the N-type source region, the P-type contact region, the polysilicon gate and the N-type drain region are connected with metal layers; the upper surface of the N-type doped semiconductor region arranged between the P trap and the N-type drain region is provided with an upper groove region; the contact part of the N-type doped semiconductor region and the buried oxide layer is provided with a lower groove region. The structure of the invention can effectively improve the pressurization performance of devices and reduce the on resistance of devices.

Description

technical field [0001] The invention relates to a silicon-on-insulator lateral double-diffused metal oxide semiconductor transistor (SOI LDMOS) structure suitable for high-voltage applications, and belongs to the technical field of power semiconductor devices. Background technique [0002] Power semiconductor devices are the basic electronic components for energy control and conversion in power electronic systems. The continuous development of power electronics technology has opened up a wide range of application fields for semiconductor power devices, and the characteristics of semiconductor power devices such as on-resistance and breakdown voltage determine The basic performance of the power electronic system, such as efficiency and power consumption. Modern power electronic devices and related products represented by lateral double-diffused metal-oxide-semiconductor transistors are playing an increasingly important role in industries, energy, transportation, and other occ...

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Application Information

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IPC IPC(8): H01L29/78H01L29/06
Inventor 易扬波李海松王钦杨东林陶平
Owner SUZHOU POWERON IC DESIGN
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