Method for processing multi-functional multilayer ceramic capacitor

Abstract

The invention discloses a method for processing a multi-functional multilayer ceramic capacitor, which comprises the following steps that: mixed ceramic slurry in the raw blank manufacturing process is subjected to belting, laminating and cutting to form a solid ceramic capacitor semi-finished product; adhesive is adhered to the surfaces of more than one ceramic capacitor semi-finished product for adhesion to ensure that the ceramic capacitor semi-finished products are in a stacking state; and two ends of an integral ceramic capacitor semi-finished product are plated with a conductive material to form a terminal electrode, and the conductive material is combined with the two ends of the ceramic body by a burning process, so that the surfaces of the two terminal electrodes of the ceramic capacitor semi-finished product are plated with a protecting metal material; therefore, the surface of a finished blank and the surface of another finished blank are in an adhesion state. The method provides a plurality of multilayer ceramic capacitors in a staking and parallel fixing state on a circuit board for use, so the capacitance value is increased, and structural forms with different appearances can be selected by users according to the requirements of the users; and the multilayer ceramic capacitor has the advantages of having wide applicability and better extensibility and meeting market requirement.

Description

technical field [0001] The invention relates to a method for manufacturing multifunctional laminated ceramic capacitors, which belongs to the technical field of electronic information technology product manufacturing. Specifically, it belongs to the technical field of the manufacturing procedure or method of the multilayer ceramic capacitor in the electronic information technology product. Background technique [0002] Today's electronic related products need to use active components and passive components. Among them, the active components (such as IC or CPU) can independently perform calculation and processing functions, while the passive components are relative to the active components. When the current or voltage is changed, its Components whose resistance or impedance will not change accordingly. Resistors, capacitors, and inductors are collectively referred to as the three major passive electronic components. In terms of function, the capacitors store charges in electr...

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Problems solved by technology

[0006] It can be seen from the above that if the user wants to increase the capacitance value of the multilayer ceramic capacitor, it can be expanded through the number of layers of the internal ceramic thin film stack and the size of the surface area. After the BULK process, the multilayer ceramic capacitor will become a finished product, so that the number of layers and the area are determined (that is, the capacitance value is determined), and it is impossible to change it to increase the capacitance value in use. In this way, Generally, the industry will connect the multilayer ceramic capacitors one by one side by side, and then perform welding work on the contacts of the circuit board, so that the plurality of multilayer ceramic capacitors arranged side by side can increase the total storage capacity of the capacitor, such as the finished product of each multilayer ceramic capacitor When the surfaces are connected to each other, due to the unevenness of the volume and angle of each multilayer ceramic capacitor, the terminal electrodes of each connected contact surface cannot be effectively aligned, resulting in gaps between the contact surfaces, and poor transmission signal status. , Poor connection effect and lower overall quality. At the same time, there will be a height difference between the terminal electrodes of some MLCCs and the metal contacts on the circuit board, resulting in poor contact, resulting in invalid MLCCs, and affecting the reliability of components. This will lead to electrical defects, discontinuous contact, resistance value change, capacitance attenuation and excessive leakage.

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