Elecric device-installed apparatus and its noise reduction method
A technology for electronic devices and installation equipment, which is applied in the field of electronic device installation equipment and can solve the problem that the specified noise range is not satisfied.
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no. 1 example
[0042] Figure 5 is a top view of the electronic component mounting apparatus relating to the first embodiment of the present invention, and Figure 6 is along Figure 5 A cross-sectional view taken along line A-A' of . as in Figure 5 and Figure 6 As shown in , electronic devices 2 and 3 operated by a clock signal are mounted on a printed board 1 . In this example, electronic devices 2 and 3 have planar shapes different from each other. Although the application is not particularly limited, the shape of the electronic devices 2 and 3 is, for example, a semiconductor finished product of a system-in-package (SiP) in which one or more LSI bare chips are mounted on a package substrate, and an interposer substrate is inserted , and sealed by insulating material.
[0043] The thermally conductive sheet 4 and the heat sink plate 5 are stacked on the electronic devices 2 and 3 in order, and thus placed on the electronic devices 2 and 3 . In other words, electronic components 2...
no. 2 example
[0064] Figure 13 is a top view of an electronic component mounting apparatus related to a second embodiment of the present invention, and Figure 14 is along Figure 13 A cross-sectional view taken along the line A-A'.
[0065] Such as Figure 13 and14 As shown, electronic devices 2 and 3 are mounted on printed board 1 , and heat sink board 5 is mounted on electronic devices 2 and 3 with heat conducting sheet 4 inserted. Furthermore, the heat sink board 5 and the ground of the printed board 1 are connected at both ends in the longitudinal direction of the printed board 1 by the ground connection wire 6 . Between the heat sink board 5 and the printed board 1 , a plurality of dielectric members 12 are arranged at a plurality of positions isolated from the positions where the electronic devices 2 and 3 are mounted to electrically connect the heat sink board 5 and the ground of the printed board 1 . The dielectric member 12 has substantially the same shape as the planar shape...
no. 3 example
[0070] Figure 15 is a top view of an electronic component mounting apparatus relating to a third embodiment of the present invention, and Figure 16 is along Figure 15 A cross-sectional view taken along the line A-A'. Since the form shown in these figures is a modification of the second embodiment, only the different points will be described.
[0071] In this embodiment, a dielectric member 12 is inserted in a region having a length of at least 1 / 3 of the longitudinal dimension L of the radiator plate starting from the end of the radiator plate 5 connected to the ground connection line 6. Between the printed board 1 and the radiator plate 5. as in Figure 15 As shown by the dotted line in , the dielectric member 12 is constituted by a frame shape surrounding the electronic device 3 on the printed board 1 with an insertion pitch.
[0072] Also in this embodiment, almost all of the noise current flowing from the ground connection line 6 as a noise source to the heat sink ...
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