Method for preparing silica/ceria composite abrasive grains

A technology of composite abrasive grains and silicon oxide, applied in chemical instruments and methods, semiconductor/solid-state device manufacturing, manufacturing tools, etc., can solve problems such as difficult post-cleaning, scratches, etc., to improve polishing removal rate and selectivity ratio, eliminate Scratch, roughness reduction effect

Active Publication Date: 2010-03-17
浙江新创纳电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But their common deficiency is that in the process of coating cerium oxide, there will still be some cerium oxide that nucleates and grows alone, and does not grow on the surface of silicon oxide. It is essentially a mixture of silicon oxide / cerium oxide composite abrasives and cerium oxide abrasives. abrasive
The mixed cerium oxide will also cause scratches, and its precipitation is adsorbed on the dielectric film, which makes it difficult to clean afterward.

Method used

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  • Method for preparing silica/ceria composite abrasive grains
  • Method for preparing silica/ceria composite abrasive grains
  • Method for preparing silica/ceria composite abrasive grains

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Prepare 40ml of silica sol with a weight concentration of 2%, the average particle size of the silica particles is 80nm, add 0.5g of polyvinylpyrrolidone, stir to dissolve, then add 5mmol of cerous nitrate hydrate, stir to dissolve, and transfer the dispersion Put it in a 60ml stainless steel autoclave with a Teflon liner, seal it, place it in an oven, heat it to 140°C, and react for 12 hours. After the reaction is completed, ultrafiltration, dilution, and ultrafiltration are repeated five times in this way, followed by drying to finally obtain silicon oxide / cerium oxide composite abrasive grains. The X-ray diffraction pattern and transmission electron microscope photograph of the prepared silicon oxide / cerium oxide core-shell composite abrasive are as follows: figure 1 with figure 2 shown. It can be seen from the figure that the product abrasives are all silicon oxide / cerium oxide composite abrasives with a core-shell structure, without homogeneous nucleated cerium ...

Embodiment 2

[0028] Prepare 40ml of silica sol with a weight concentration of 2%, the average particle size of the silica particles is 80nm, add 0.5g of polyvinylpyrrolidone, stir to dissolve, then add 5mmol of cerous nitrate hydrate, stir to dissolve, and transfer the dispersion Put it into a 60ml stainless steel autoclave with a Teflon lining, seal it, place it in an oven, heat it to 160°C, and react for 12 hours. After the reaction is completed, ultrafiltration, dilution, and ultrafiltration are repeated five times in this way, followed by drying to finally obtain silicon oxide / cerium oxide composite abrasive grains. The transmission electron microscope observation shows that the product abrasives are all silicon oxide / cerium oxide composite abrasives with a core-shell structure, and there is no homogeneous nucleated cerium oxide particles.

Embodiment 3

[0030] Prepare 40ml of silica sol with a weight concentration of 5%, the average particle size of silicon oxide is 80nm, add 1g of polyvinylpyrrolidone, magnetically stir to dissolve, then add 10mmol of cerium acetate, stir to dissolve, transfer this dispersion to a volume of 60ml In a stainless steel high-pressure reaction kettle with a polytetrafluoroethylene lining, after sealing, place it in an oven, heat it to 120°C, and react for 24 hours. After the reaction was completed, it was centrifuged, purified and dried as in Example 1 to finally obtain silicon oxide / cerium oxide composite abrasive grains. The transmission electron microscope observation shows that the product abrasives are all silicon oxide / cerium oxide composite abrasives with a core-shell structure, and there is no homogeneous nucleated cerium oxide particles.

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Abstract

The invention relates to a method for preparing silica/ceria composite abrasive grains, which comprises the following steps: 1) adding organic additives to silicon sol, stirring until the organic additives dissolve, and then, adding trivalent or tetravalent cerium salts, so as to obtain a dispersion liquid; 2) placing the dispersion liquid in an autoclave provided with a PTFE (polytetrafluoroethylene) lining, sealing the autoclave and conducting a heating reaction; and 3) centrifugating, purifying and stoving after the reaction, and finally obtaining the silica/ceria composite abrasive grains.The silica/ceria nuclear-shell composite abrasive grains prepared by the invention contain no homogeneous-nucleation ceria grains; and the composite abrasive grains have the advantages that the polishing removal rate and the selectivity thereof can be effectively increased, the surface roughness thereof can be reduced and the defects, such as scratches, can be eliminated. Therefore, the compositeabrasive grains are applicable to the chemical mechanical polishing (CMP) of very-large-scale integrated circuits (VLSIC) and glass.

Description

technical field [0001] The invention belongs to the field of high-precision polishing materials, and in particular relates to a preparation method of silicon oxide / cerium oxide composite abrasive grains. Background technique [0002] At present, the most commonly used polishing abrasives in chemical mechanical polishing are silicon oxide abrasives and cerium oxide abrasives. Silicon oxide abrasives have become the most widely used chemical mechanical polishing abrasives due to their good dispersion, uniformity and low price, and it is easier to treat the waste liquid in the post-cleaning process. But its disadvantage is that compared with oxide, the hardness is slightly lower, the removal rate is lower, and the removal rate selection between silicon oxide and silicon nitride in STI polishing is relatively low, which is difficult to meet the requirements of next-generation IC manufacturing. . [0003] Cerium oxide abrasives can chemically react with silicon oxide, so under ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14H01L21/02B24B37/00
Inventor 张泽芳刘卫丽宋志棠
Owner 浙江新创纳电子科技有限公司
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