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Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems such as disorder of resist image, decrease of resist performance, easy entrainment of air, etc., and achieve the effect of excellent electrical properties

Active Publication Date: 2012-12-26
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of using a dry film-type photosensitive resist, air is easily entrapped and bubbles are generated when the base material is thermocompression-bonded, so that the adhesion is reduced and the resist image is disturbed. There is a concern that the corrosion resistance performance will decrease

Method used

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  • Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
  • Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
  • Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board

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Embodiment

[0226] Hereinafter, the present invention will be more specifically described based on examples and comparative examples, but the present invention is not limited to the following examples.

Synthetic example 1

[0228] Add 475 parts by mass of YDF2001 (manufactured by Dongdu Chemical Industry Co., Ltd., bisphenol F type epoxy resin, which is Y in the general formula (5) 2 = glycidyl, R 12 = hydrogen atom), 72 parts by mass of acrylic acid, 0.5 parts by mass of hydroquinone, and 120 parts by mass of carbitol acetate were heated and stirred at 90° C. to dissolve the reaction mixture. Next, the obtained solution was cooled to 60 degreeC, 2 mass parts of benzyltrimethylammonium chlorides were added there, it heated again at 100 degreeC, and it was made to react until the solid content acid value became 1 mgKOH / g. Furthermore, 98 parts by mass of maleic anhydride and 85 parts by mass of carbitol acetate were added, heated to 80° C., and reacted for about 6 hours. Then, it was cooled to room temperature and diluted with carbitol acetate to a solid content concentration of 60% by mass to obtain a carboxylic acid-modified bisphenol F type epoxy acrylate (hereinafter referred to as "epoxy acr...

Synthetic example 2

[0230] Add 220 parts by mass of YDCN704 (manufactured by Dongdu Chemical Industry Co., Ltd., cresol novolac type epoxy resin, which is Y in the general formula (4) 1 = glycidyl, R 11 = methyl compound), 72 parts by mass of acrylic acid, 1.0 parts by mass of hydroquinone, and 180 parts by mass of carbitol acetate were heated and stirred at 90° C. to dissolve the reaction mixture. Next, the obtained solution was cooled to 60° C., 1 part by mass of benzyltrimethylammonium chloride was added thereto, and it was heated to 100° C. and reacted until the solid content acid value became 1 mgKOH / g. Furthermore, 152 parts by mass of tetrahydrophthalic anhydride and 100 parts by mass of carbitol acetate were added, heated to 80° C., and reacted for about 6 hours. Then, it was cooled to room temperature, and diluted to a solid content concentration of 60% by mass with carbitol acetate to obtain a carboxylic acid-modified cresol novolak-type epoxy acrylate (hereinafter referred to as "cycl...

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Abstract

A photosensitive resin composition comprising (A) an acid-modified vinyl-containing epoxy resin, (B) a photopolymerization initiator containing a compound having an oxime ester bond and (C) a compound having a thiol group.

Description

technical field [0001] The present invention relates to a method for forming a photosensitive resin composition, a photosensitive element, a resist pattern, and a printed circuit board. Background technique [0002] Historically, permanent masking resists in the manufacture of printed wiring boards have been produced by screen printing thermal or UV curable resist inks. In recent years, with the high integration of electronic equipment, it is necessary to have high-definition wiring patterns and insulating patterns in printed wiring boards. However, in the conventional resist forming method by screen printing, it is difficult to form a high-definition resist image because bleeding, bead defects, and the like occur during printing. Therefore, in order to form a high-definition resist image, a resist image forming method using photolithography has been developed. Specifically, the dry film type photosensitive resist is heat-compressed on the substrate, or the liquid photosen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/031G03F7/004G03F7/027H05K3/06H05K3/18
CPCG03F7/031G03F7/027H05K3/06
Inventor 大川昌也佐藤邦明吉野利纯片木秀行日高敬浩
Owner RESONAC CORP
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