Liquid photosensitive solder resist ink and preparation method thereof

A photosensitive solder resist ink, liquid technology, which is applied in the field of liquid photosensitive solder resist ink and its preparation, can solve the problems that the heat resistance is difficult to meet the user's requirements, the solder resist layer is easy to become brittle, and the scrap rate increases, etc., to solve the problem of durability Insufficient heat and chemical resistance, excellent flexibility, excellent performance effect

Active Publication Date: 2010-06-02
新东方油墨有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Later, under the influence of the next process, UV type appeared, but due to the influence of precision, it finally developed into liquid photosensitive solder resist ink, which has both photocuring and thermal curing inks. The photosensitive resin is mainly novolac epoxy resin and different types. It is obtained by reacting saturated carboxylic acid and then reacting with acid anhydride. Because the resin contains acid groups, it can be developed with alkaline water. After curing, the ink has excellent heat resistance, but because of the large shrinkage after curing, the solder mask layer is easy to become brittle , the scrap rate is high in the production process
In order to change the brittleness of photosensitive resins using novolac epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins or hydroxymethyl bisphenol A epoxy resins have been used to completely replace novolac epoxy resins. Epoxy resin or partially replaced products to synthesize photosensitive resin, which has indeed been greatly improved in terms of shrinkage after curing, but unfortunately bisphenol A or bisphenol F and its modified bisphenol A or bisphenol F The heat resistance of epoxy resin is always a bit difficult to meet the requirements of users, especially the implementation of the lead restriction order, bisphenol A or bisphenol F and its modified bisphenol A or bisphenol F epoxy resin in soldering pure tin Or the solder resistance is more attacked when soldering tin, and the novolak epoxy resin is also incapable of soldering pure tin or soldering tin, resulting in an increase in the scrap rate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The photosensitive resin described in this example is prepared by adding 220 g of silicone-modified novolac epoxy resin and 230 g of diethylene glycol monoethyl ether acetate into a reaction vessel and heating to 70° C. to dissolve, and adding methacrylic acid after the dissolution is complete 88g, N,N-dimethylbenzylamine 1.5g, toluene 100g, concentrated sulfuric acid 1g, heated to 90-110°C for about 10 hours, refluxed for dehydration, distilled to remove toluene, added 125g of tetrahydrophthalic anhydride and heated to 100-120° C. to obtain a photosensitive resin (1) with an acid value of 70 mgKOH / g and a solid content of 64%.

Embodiment 2

[0022] The preparation method of the photosensitive resin described in this example is: add 220 g of silicone modified novolak epoxy resin and 231.5 g of diethylene glycol monoethyl ether acetate to a reaction vessel and heat to 70° C. to dissolve, and then add methyl 88g of acrylic acid, 1.5g of N,N-dimethylbenzylamine, 100g of toluene, 1g of concentrated sulfuric acid, heated to 90-110°C for about 10 hours, reflux for dehydration, distilled to remove toluene, added 102g of tetrahydrophthalic anhydride and heated At 100-120°C, a photosensitive resin (2) with an acid value of 60 mgKOH / g and a solid content of 64% is obtained.

Embodiment 3

[0024]The preparation method of the photosensitive resin described in this example is: add 220 g of silicone-modified novolac epoxy resin and 219.4 g of diethylene glycol monoethyl ether acetate to a reaction vessel and heat to 70° C. to dissolve, and then add methyl 88g of acrylic acid, 1.5g of N,N-dimethylbenzylamine, 100g of toluene, 1g of concentrated sulfuric acid, heated to 90-110°C for about 10 hours, reflux for dehydration, distilled to remove toluene, then added 80.5g of tetrahydrophthalic anhydride Heating to 100-120° C. to obtain a photosensitive resin (3) with an acid value of 50 mgKOH / g and a solid content of 64%.

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Abstract

The invention discloses liquid photosensitive solder resist ink, which comprises the components of a photosensitive resin, an acrylic monomer, a thermosetting resin, a pigment, a filler, a photoinitiator, accessories and a solvent, and is characterized by comprising the components in the following parts by weight: the photosensitive resin 20-80, the acrylic monomer 1-30, the thermosetting resin 5-30, the pigment 0.5-3, the filter 10-40, the photoinitiator 1-10, the accessories 0.1-5 and the solvent 10-30. The liquid photosensitive solder resist ink prepared in the invention has excellent heat resistance and flexibility. The liquid photosensitive solder resist ink has the advantages of simple process, reasonable formula and excellent performance.

Description

technical field [0001] The invention relates to a circuit board ink, and proposes a series of new liquid photosensitive solder resist inks used on PCBs, and the solder resist layer formed by the solder resist ink on the surface of the PCB. The invention also relates to liquid photosensitive solder resist inks and their preparation method. Background technique [0002] With the continuous advancement and development of the modern electronics industry, the solder resist ink for printed boards in my country began in the late 1970s. At that time, it was mainly heat-cured solder resist ink, and it began to be imported from domestic production. type character ink. Later, under the influence of the next process, UV type appeared, but due to the influence of precision, it finally developed into liquid photosensitive solder resist ink, which has both photocuring and thermal curing inks. The photosensitive resin is mainly novolac epoxy resin and different types. It is obtained by rea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/10C09D11/101C09D11/102
Inventor 林华君任诗旻
Owner 新东方油墨有限公司
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