Method for preparing semicylindrical minute groove by utilizing secondary film deposition and wet etching
A wet etching, semi-cylindrical technology, applied in the manufacture of microstructure devices, processes for producing decorative surface effects, coatings, etc., can solve the problem that the processing area is only on the order of microns and the cost is expensive, and achieve high efficiency Processing route, effect of reducing preparation cost
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[0025] In Example 1, a semi-cylindrical micro groove with a diameter of 1 micron was produced, and the production process was as follows figure 1 As shown, the details are as follows:
[0026] (1) Choose a quartz plate with a thickness of 360 microns as the substrate; use magnetron sputtering technology to deposit a 100-nanometer-thick metal chromium layer on the surface of the substrate, and coat the chromium layer with AR-P3100 with a thickness of 1.1 microns Photoresist (such as figure 2 Shown).
[0027] (2) Through exposure, development, and hard mold, the photoresist is prepared as image 3 Line structure shown.
[0028] (3) such as Figure 4 As shown, the photoresist pattern is used for masking and the isotropic feature of wet etching, and the metal chromium layer under the edge of the photoresist line pattern is etched using an etching solution. The corrosive liquid is chromium-removing liquid, the ratio of which is 100ml water, 13ml perchloric acid, 50g tetraammonium nitrat...
Example Embodiment
[0031] Example 2 Fabrication of semi-cylindrical micro grooves with a diameter of 700 nanometers is as follows: figure 1 As shown, the details are as follows:
[0032] (1) Choose a quartz plate with a thickness of 1000 microns as the substrate; use magnetron sputtering technology to deposit a 50-nm-thick metal chromium layer on the surface of the substrate, and coat the chromium film with a thickness of 1.1 microns AR-P3100 Photoresist (such as figure 2 Shown).
[0033] (2) Through exposure, development, and hard mold, the photoresist is prepared as image 3 Line structure shown.
[0034] (3) such as Figure 4 As shown, the photoresist pattern is used for masking and the isotropic feature of wet etching, and the metal chromium layer under the edge of the photoresist line pattern is etched using an etching solution. The corrosive liquid is chromium removal liquid, the ratio is 100ml water, 13ml perchloric acid, 50g tetraammonium nitrate, the corrosion temperature is 23℃, the time fo...
Example Embodiment
[0037] Example 3 Fabrication of semi-cylindrical micro grooves with a diameter of 2 microns, the fabrication process is as follows figure 1 As shown, the details are as follows:
[0038] (1) Choose a quartz plate with a thickness of 1000 microns as the substrate; use magnetron sputtering technology to deposit a 150-nm-thick metal chromium layer on the surface of the substrate, and coat the chromium film with a thickness of 1.1 microns AR-P3100 Photoresist (such as figure 2 Shown).
[0039] (2) Through exposure, development, and hard mold, the photoresist is prepared as image 3 Line structure shown.
[0040] (3) such as Figure 4 As shown, the photoresist pattern is used for masking and the isotropic feature of wet etching, and the metal chromium layer under the edge of the photoresist line pattern is etched using an etching solution. The corrosive liquid is chromium-removing liquid, the ratio is 100ml water, 13ml perchloric acid, 50g tetraammonium nitrate, the corrosion temperatur...
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