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Surface modification processing method and device of MEMS microcomponent

A technology for the surface of micro-devices and workpieces, applied in the field of surface treatment of micro-devices, can solve problems such as not being retrieved, and achieve the effects of improving fatigue resistance and stress corrosion resistance, easier process and control, and good repeatability.

Inactive Publication Date: 2010-06-30
JIANGSU UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] At present, no relevant patents have been retrieved on the treatment method and device for the surface of MEMS micro-devices using laser micro-peening technology to improve their mechanical properties

Method used

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  • Surface modification processing method and device of MEMS microcomponent
  • Surface modification processing method and device of MEMS microcomponent
  • Surface modification processing method and device of MEMS microcomponent

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Embodiment Construction

[0037] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0038] The device includes a laser generator 1 and a light guide system, a shot blasting head 7 , a fixture system 12 , a computer control system 16 , a CCD monitoring system 5 and an X-ray micro-diffraction system 4 . The laser is a Nd:YAG Q-switched nanosecond pulse laser, which generates laser pulses with an energy of 100-500 μJ and a duration of 50 nanoseconds. The light guide system includes a reflector 2 , a light guide element 3 , and a rotating reflector 6 . The workpiece fixture system includes a workpiece fixture 12 and a multi-axis linkage worktable 13. This device has three coordinates of movement and two rotations, and can realize five-axis linkage, so that laser shot peening can be conveniently implemented on the workpiece 11. The control system is composed of machine tool controller 14 , laser controller 15 and computer contr...

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PUM

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Abstract

The invention relates to surface modification processing method and device of an MEMS microcomponent. Path planning and parameter selection are carried out on a miniature part with a specific shape, and an NC processing program for a computer control system is programmed to control the traveling tracks of a light guide system and a working platform; and after pulse laser is focused by a lens, thepulse laser penetrates through a transparent restraint layer and reaches an energy transformation body on the surface of a workpiece, and the energy transformation body transforms the absorbed pulse laser energy into shock wave pressure acting on the surface of the workpiece so as to realize reinforcement. A processing area is positioned by utilizing a CCD monitoring system, and an X-ray microdiffraction instrument carries out on-line residual stress detection. Therefore, the service life of an MEMS microstructure is prolonged. The device comprises a laser generator, a light guide system, a laser shot blasting head, a workholder system, a computer control system, a CCD monitoring system and an X-ray microdiffraction on-line detection system.

Description

technical field [0001] The invention relates to the field of micro-mechanical manufacturing, in particular to a micro-device surface treatment method and device based on high-energy pulse laser peening technology, which is suitable for surface modification of MEMS micro-device. It is especially suitable for surface modification treatment that is difficult to achieve by conventional methods or local selective strengthening treatment for specific areas, and is suitable for low-cost mass production of micro devices. Background technique [0002] Micro-components are usually subjected to alternating loads such as heat and force during the working process, and are prone to deformation, fracture, wear and fatigue damage, which will cause the failure of the microstructure, and then lead to the failure of the entire MEMS. Therefore, in addition to having a precise shape, micro-devices also require high mechanical properties and surface quality, and the key surfaces of micro-componen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C99/00
Inventor 周建忠樊玉杰黄舒王敏卫登辉
Owner JIANGSU UNIV
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