Method for preparing highly heat-conductive copper-clad plate

A copper clad laminate, high thermal conductivity technology, applied in chemical instruments and methods, epoxy resin glue, adhesive types, etc., can solve the problems of unsatisfactory thermal conductivity, large thermal resistance, difficult production, etc., and achieve excellent dimensional stability. The effect of high thermal conductivity, high thermal conductivity and high installation density

Active Publication Date: 2010-07-07
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional FR-4 copper clad laminate is a single system combined with epoxy resin and E-grade glass cloth. The thermal conductivity is not ideal and the thermal resistance is large.
However, metal-b

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0015] Glue preparation; using a mixture of multifunctional epoxy resin and polyurethane, where the multifunctional epoxy resin accounts for 60% to 90% of the total weight of the mixture, and the polyurethane accounts for 10% to 40% of the total weight of the mixture. The mixture is adjusted to a solid content of 60 ~90% glue solution;

[0016] The composition of the inorganic filler; a mixture of aluminum nitride and alumina as the main body; wherein the proportion of aluminum nitride accounts for 40-60% of the total weight of the mixture, and the proportion of alumina accounts for 40-60% of the total weight of the mixture;

[0017] The inorganic filler is fully mixed and uniformly mixed and used as the filler of the glue;

[0018] Use dicyandiamide as curing agent, imidazole as accelerator, acetone as solvent to prepare a solid content of 60-80%, and a gel time of 150-450 seconds for coating glue;

[0019] The glue is transferred to the thermal oil vertical gluing machine through th...

Example Embodiment

[0022] Example 1

[0023] Multi-functional epoxy resin and polyurethane are mixed at a ratio of 65% and 35%, and the mixture is prepared into a resin glue solution with a solid content of 70%, and the solvent is acetone; alumina and aluminum nitride are used at a ratio of 40% and 60% Mix and make a filling body. Use dicyandiamide as curing agent and 2-methylimidazole as accelerator to prepare a glue with a solid content of 70% and a gel time of 320 seconds, and use this as the glue for coating;

[0024] The above glue solution is transferred to the thermal oil vertical gluing machine through the glue adjusting equipment, dipped on the 7628 E-grade glass cloth, and then passed through the oven at a temperature of 140-260℃ at a speed of 8-25m / min Carry out baking, the baking time is 1 to 3 minutes, the glue content is 44%, and the gel time is 115 seconds. Lay the above-mentioned bonding sheets neatly, apply a single-sided 18μm~70μm electrolytic copper foil, place it between the lam...

Example Embodiment

[0026] Example 2

[0027] Multifunctional epoxy resin and polyurethane are mixed in the ratio of 70% and 30%, and the mixture is prepared into a resin glue solution with a solid content of 68%, and the solvent is acetone; alumina and aluminum nitride are used in the ratio of 45% and 55% Mix and make a filling body. Using dicyandiamide as the curing agent and 2-methylimidazole as the accelerator, a glue solution with a solid content of 70% and a gel time of 280 seconds was prepared and used as the glue solution for coating.

[0028] The above glue solution is transferred to the thermal oil vertical gluing machine through the glue adjusting equipment, dipped on the 7628 E-grade glass cloth, and then passed through the oven at a temperature of 140-260℃ at a speed of 8-25m / min Carry out baking, the baking time is 1 to 3 minutes, the glue content is 44%, and the gel time is 120 seconds to make an adhesive sheet. Lay the above-mentioned bonding sheets neatly, apply a single-sided 18μm~...

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Abstract

The invention relates to a method for preparing a highly heat-conductive copper-clad plate, which is realized by the following steps of: preparing gluewater; preparing a gluewater solution with the solid content of 60-90% by using a mixture of polyfunctional epoxy resin and polyurethane; taking an inorganic filler which adopts a mixture of aluminium nitride and aluminium oxide as the main contents, wherein aluminium nitride content accounts for 40-60 wt% of the total weight of the mixture, and aluminium oxide content accounts for 40-60 wt% of the total weight of the mixture; using the inorganic filler after being fully and uniformly mixed as the filler of the gluewater solution; using dicyandiamide as a curing agent, imidazole as an accelerating agent and acetone as a solvent to prepare the gluewater solution with the solid content of 60-80% and the gel time of 150-450 seconds for application; putting the gluewater solution into a glue mixer and then conveying the gluewater solution to a heating medium oil vertical gluing machine; and preparing a single-surface or double-surface copper-clad plate. The prepared copper-clad plate has high heat conductivity, capability of holding a higher installation density and excellent dimension stability, and can be used for preparing printed circuit boards with finer wiring and more layers.

Description

Technical field [0001] The invention relates to a method for preparing a copper clad laminate, in particular to a glue solution in the process. Background technique [0002] With the development of modern electronic products to "light, thin, small, and multifunctional", the high integration of electronic devices, high-speed, high-frequency, and large-capacity signal transmission in the process of information transmission, along with the increase in power consumption, the unit area It generates more heat. If the heat is not dissipated in time, it will affect the working stability of the semiconductor device. As the substrate material (CCL) carried by electronic components, it must have excellent thermal conductivity, and timely transfer the heat generated by the components to ensure the stable performance of electronic products. [0003] The traditional FR-4 copper clad laminate is a single system combining epoxy resin and E-grade glass cloth, which has unsatisfactory thermal cond...

Claims

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Application Information

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IPC IPC(8): B32B37/12B32B37/06B32B37/10B32B38/08B32B38/16B32B15/14B32B15/20B32B17/02C09J163/00C09J175/04
Inventor 胡瑞平郑建明
Owner SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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