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Binding agent suitable for high-order high-density interconnected laminated plates
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A high-order, high-density, adhesive technology, applied in the field of electronic information, to achieve high glass transition temperature, good machinability, and excellent heat resistance
Active Publication Date: 2013-08-28
NANYA NEW MATERIAL TECH CO LTD
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[0004] In the past, the glass transition temperature of FR-4 ordinary TG (glass transition temperature) and medium TG products were all below 160°C; the Z-axis CTE value was about 50 / 290, and the PTE was about 3.2%; the heat resistance could only guarantee that T260 was greater than 30 Minutes, T288 greater than 10 minutes, TD (thermal decomposition temperature) greater than 325 ° C
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Embodiment 1
[0037] 1. Proportion of glue mixing formula (by weight):
[0084] The above-mentioned epoxy glass cloth-based copper clad board has high glass transition temperature, e...
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glass transition temperature
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Abstract
The invention belongs to the technical field of electronic information, in particular to a binding agent suitable for producing high-order high-density interconnected laminated plates. The binding agent is prepared by phenolformaldehydeepoxy resin, a phenolic curing agent, 2-methylimidazole, micro silica powder, silane and propanediol methyl ether in an appropriate proportion. The binding agentis prepared by the following steps: orderly adding the propanediol methyl ether, the silane and the micro silica powder into a stirring tank to form a mixture; stirring the mixture for a certain time; orderly adding the phenolformaldehydeepoxy resin and the phenolic curing agent into the stirring tank; continuing stirring the mixture for a certain time; weighing the 2-methylimidazole; adding the propanediol methyl ether into the 2-methylimidazole for dissolving the propanediol methyl ether completely; adding the dissolved propanediol methyl ether into the stirring tank; continuing stirring the mixture to a coating prepreg; and finishing mixing glue. An epoxy glass cloth-base copper clad laminate prepared by using the binding agent of the invention has the characteristics of high glass transition temperature, high heat resistance, CAF resistance and size stability, low Z-CT value and water absorptivity, and high machinability, electrification resistance and flame resistance, and the binding agent is fully suitable for producing the high-order high-density interconnected laminated plates.
Description
technical field [0001] The invention belongs to the technical field of electronic information, and specifically relates to an adhesive suitable for producing high-order HDI (high-density interconnection laminates) epoxy glass cloth-based copper-clad boards. Background technique [0002] With the vigorous development of China's electronics industry, electronic products continue to change people's lives and integrate into every corner of various industries. The main substrate of electronic products, copper clad laminates, are widely used in communications, mobile communications, computers, instruments, digital TVs , CNC audio, satellite, radar and other products. [0003] With the demand for light, thin, short, small and digital electronic products, electronic products are developing towards miniaturization, multi-function, high performance and high reliability, which leads to the development of printed circuit boards with fine graphics, high density and high multi-layer With...
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