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Silicon carbide-based grid-shaped Schottky contact type nuclear battery

A Schottky contact and nuclear battery technology, applied in the field of microelectronics, can solve the problems of large energy loss of incident particles, reduced energy conversion efficiency, difficult realization of PN junction process, etc., to improve energy conversion efficiency, improve energy conversion efficiency, Easy to achieve effects

Active Publication Date: 2010-12-22
陕西半导体先导技术中心有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this PN junction structure, in order to prevent the ohmic contact electrode from blocking incident particles, the ohmic electrode must be overloaded in one corner of the device, but this will cause the irradiated carriers far away from the ohmic electrode to be recombined during the transport process, and Incident particles must pass through the SiO at the surface 2 The passivation layer and part of the P-type layer cause energy loss and reduce energy conversion efficiency
[0007] The nuclear battery disclosed in Chinese patent CN 101325093A adopts a Schottky junction structure, which avoids the difficulty in realizing the above-mentioned PN junction technology, but the Schottky contact layer of the Schottky nodule battery covers the entire battery area, as shown in Figure 8 As shown, since the incident particles reach the surface of the device, they will be blocked by the Schottky contact layer, only part of the particles can enter the device, and the particles entering the depletion region will contribute to the output power of the battery. Therefore, this The energy loss of the incident particles in the nuclear battery structure is large, and the energy conversion efficiency is low

Method used

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  • Silicon carbide-based grid-shaped Schottky contact type nuclear battery
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  • Silicon carbide-based grid-shaped Schottky contact type nuclear battery

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] In the first step, a low-doped n-type epitaxial layer is epitaxially grown on a SiC highly-doped n-type substrate, such as Figure 6 a.

[0038] The selected doping concentration is 7×10 18 cm -3 A SiC highly doped n-type SiC substrate is used as the substrate 6. After cleaning, it is grown on the epitaxial surface with a thickness of about 3 μm by the low pressure hot wall chemical vapor deposition method and the doping concentration is 5×10 15 cm -3 The 4H-SiC low-doped epitaxial layer 5 has an epitaxial temperature of 1570°C and a pressure of 100mbar, the reaction gases are silane and propane, and the carrier gas is pure hydrogen.

[0039] Step 2, forming SiO on the epitaxial layer 2 passivation layer, such as Figure 6 b.

[0040] At a temperature of 1100±50°C, the epitaxial substrate sample was subjected to dry oxygen oxidation for two hours to form SiO 2 passivation layer.

[0041] Step 3, form an ohmic contact on the back of the substrate, such as Figur...

Embodiment 2

[0053] In the first step, a low-doped n-type epitaxial layer is epitaxially grown on a SiC highly-doped n-type substrate.

[0054] The selected doping concentration is 5×10 18 cm -3 A SiC highly doped n-type SiC substrate is used as the substrate 6. After cleaning, it is grown on the epitaxial surface with a thickness of about 3 μm by the low-pressure hot-wall chemical vapor deposition method and the doping concentration is 3×10 15 cm -3 The 4H-SiC low-doped epitaxial layer 5 has an epitaxial temperature of 1570°C and a pressure of 100mbar, the reaction gases are silane and propane, and the carrier gas is pure hydrogen.

[0055] In the second step, SiO is formed on the epitaxial layer 2 passivation layer.

[0056] At a temperature of 1100±50°C, the epitaxial substrate sample was subjected to dry oxygen oxidation for two hours to form SiO 2 passivation layer.

[0057] In the third step, an ohmic contact is formed on the backside of the substrate.

[0058] (3.1) Etching a...

Embodiment 3

[0069] In step A, a low-doped n-type epitaxial layer is epitaxially grown on a SiC highly-doped n-type substrate.

[0070] The selected doping concentration is 1×10 18 cm -3 A SiC highly doped n-type SiC substrate is used as the substrate 6. After cleaning, it is grown on the epitaxial surface with a thickness of about 3 μm by the low-pressure hot-wall chemical vapor deposition method and the doping concentration is 1×10 15 cm -3 The 4H-SiC low-doped epitaxial layer 5 has an epitaxial temperature of 1570°C and a pressure of 100mbar, the reaction gases are silane and propane, and the carrier gas is pure hydrogen.

[0071] Step B, forming SiO on the epitaxial layer 2 passivation layer.

[0072] At a temperature of 1100±50°C, dry oxygen oxidation was performed on the epitaxy sample for two hours to form SiO 2 passivation layer.

[0073] In step C, an ohmic contact is formed on the backside of the substrate.

[0074] (C1) etching a SiC layer with a thickness of 0.5 μm on th...

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Abstract

The invention discloses a silicon carbide-based grid-shaped Schottky contact type nuclear battery and a manufacturing method thereof. The invention mainly solves the problems that in the prior art, a silicon carbide-based pn junction nuclear battery has difficult manufacturing process, and a Schottky junction nuclear battery has low efficiency. The nuclear battery of the invention sequentially comprises a bonding layer (1), a radioactive isotope source layer (3), a grid-shaped semitransparent Schottky contact layer (2), an n type SiC epitaxial layer (5) of which the doping concentration is 1*1015-5*1015cm<-3>, an n type SiC substrate (6) of which the doping concentration is 1*1018-7*1018cm<-3> and an ohmic contact electrode (7) from top to bottom, wherein a SiO2 passivation layer (4) is formed around the radioactive isotope source layer; the Schottky contact layer (2) comprises a horizontal grid bar and a plurality of vertical grid bars, wherein the horizontal grid bar is positioned in the middle position of each vertical grid bar; and the radioactive isotope source layer is positioned on the epitaxial layer (5) between every two vertical grid bars. The nuclear battery of the invention has the advantages of small energy loss and high energy conversion efficiency and can be used as an on-chip power source of an MEMS, a power source of a cardiac pacemaker or a spare power sourceof a mobile phone.

Description

technical field [0001] The invention belongs to the field of microelectronics, and in particular relates to a grid Schottky contact nuclear battery based on silicon carbide, which can be used to directly convert nuclear energy emitted by isotopes into electric energy. technical background [0002] In 1953, Rappaport discovered that the beta particles (β-Particles) produced by the decay of isotopes can generate electron-hole pairs in semiconductors. This phenomenon is called β-Voltaic Effect. Shortly thereafter, Elgin-Kidde first used the β-Voltaic Effect in power supply in 1957, and successfully manufactured the first isotope micro-battery (β-Voltaic Battery). Since 1989, GaN, GaP, AlGaAs, polysilicon and other materials have been used as materials for β-Voltaic batteries. With the advancement of the preparation and process technology of SiC, a wide bandgap semiconductor material, since 2006, there have been reports on SiC-based isotope batteries in the world. [0003] The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G21H1/00
Inventor 郭辉石彦强张玉明韩超贾仁需苏江黄建华
Owner 陕西半导体先导技术中心有限公司
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