Silicon carbide-based grid-shaped Schottky contact type nuclear battery
A Schottky contact and nuclear battery technology, applied in the field of microelectronics, can solve the problems of large energy loss of incident particles, reduced energy conversion efficiency, difficult realization of PN junction process, etc., to improve energy conversion efficiency, improve energy conversion efficiency, Easy to achieve effects
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Embodiment 1
[0037] In the first step, a low-doped n-type epitaxial layer is epitaxially grown on a SiC highly-doped n-type substrate, such as Figure 6 a.
[0038] The selected doping concentration is 7×10 18 cm -3 A SiC highly doped n-type SiC substrate is used as the substrate 6. After cleaning, it is grown on the epitaxial surface with a thickness of about 3 μm by the low pressure hot wall chemical vapor deposition method and the doping concentration is 5×10 15 cm -3 The 4H-SiC low-doped epitaxial layer 5 has an epitaxial temperature of 1570°C and a pressure of 100mbar, the reaction gases are silane and propane, and the carrier gas is pure hydrogen.
[0039] Step 2, forming SiO on the epitaxial layer 2 passivation layer, such as Figure 6 b.
[0040] At a temperature of 1100±50°C, the epitaxial substrate sample was subjected to dry oxygen oxidation for two hours to form SiO 2 passivation layer.
[0041] Step 3, form an ohmic contact on the back of the substrate, such as Figur...
Embodiment 2
[0053] In the first step, a low-doped n-type epitaxial layer is epitaxially grown on a SiC highly-doped n-type substrate.
[0054] The selected doping concentration is 5×10 18 cm -3 A SiC highly doped n-type SiC substrate is used as the substrate 6. After cleaning, it is grown on the epitaxial surface with a thickness of about 3 μm by the low-pressure hot-wall chemical vapor deposition method and the doping concentration is 3×10 15 cm -3 The 4H-SiC low-doped epitaxial layer 5 has an epitaxial temperature of 1570°C and a pressure of 100mbar, the reaction gases are silane and propane, and the carrier gas is pure hydrogen.
[0055] In the second step, SiO is formed on the epitaxial layer 2 passivation layer.
[0056] At a temperature of 1100±50°C, the epitaxial substrate sample was subjected to dry oxygen oxidation for two hours to form SiO 2 passivation layer.
[0057] In the third step, an ohmic contact is formed on the backside of the substrate.
[0058] (3.1) Etching a...
Embodiment 3
[0069] In step A, a low-doped n-type epitaxial layer is epitaxially grown on a SiC highly-doped n-type substrate.
[0070] The selected doping concentration is 1×10 18 cm -3 A SiC highly doped n-type SiC substrate is used as the substrate 6. After cleaning, it is grown on the epitaxial surface with a thickness of about 3 μm by the low-pressure hot-wall chemical vapor deposition method and the doping concentration is 1×10 15 cm -3 The 4H-SiC low-doped epitaxial layer 5 has an epitaxial temperature of 1570°C and a pressure of 100mbar, the reaction gases are silane and propane, and the carrier gas is pure hydrogen.
[0071] Step B, forming SiO on the epitaxial layer 2 passivation layer.
[0072] At a temperature of 1100±50°C, dry oxygen oxidation was performed on the epitaxy sample for two hours to form SiO 2 passivation layer.
[0073] In step C, an ohmic contact is formed on the backside of the substrate.
[0074] (C1) etching a SiC layer with a thickness of 0.5 μm on th...
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