Preparation method of high-temperature resistant polyimide glass fabric laminated board

A technology of polyimide glass and laminates, which is applied in the field of new polymer materials and preparations, can solve the problems that have not yet been published in literature or patent reports, and achieve low cost, wide application prospects, and excellent heat resistance. Effect

Inactive Publication Date: 2011-02-16
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The preparation method of the high-temperature-resistant polyimide glass cloth laminate disclosed by the present invention has not yet been published in the literature or patent reports

Method used

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  • Preparation method of high-temperature resistant polyimide glass fabric laminated board
  • Preparation method of high-temperature resistant polyimide glass fabric laminated board
  • Preparation method of high-temperature resistant polyimide glass fabric laminated board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] At room temperature, 322.4 grams (1.0 moles) of 1,4-bis(2,4-diaminophenoxy)benzene powder and 196.0 grams (2.0 moles) of maleic anhydride powder were added to 20,000 grams of N-methyl-2-pyrrolidone And 8370 grams of N, N-dimethylformamide strong polar aprotic organic solvent, after stirring and reacting at room temperature for 1 hour, add 2592.2 grams (5.0 moles) of 2,2-bis[4-(4-aminophenoxy Base) phenyl] hexafluoropropane aromatic diamine monomer powder, after stirring and dissolving completely, add 966.6 grams (3.0 mole) 3,3 ', 4,4'-tetracarboxylic benzophenone dianhydride and 930.0 grams (3.0 moles) 3,3',4,4'-tetracarboxylic diphenyl ether dianhydride aromatic dibasic acid anhydride powder, stirred and reacted at room temperature for 3 hours, added 2.4 grams of dibenzoyl peroxide initiator, stirred and dissolved , to obtain a homogeneous and transparent viscous resin solution, ie component A, whose resin solution has a solid mass percentage of 15%.

[0048] 12057.8 ...

Embodiment 2

[0052] At room temperature, 161.2 grams (0.5 moles) of 1,4-bis(2,4-diaminophenoxy)benzene powder and 98.0 grams (1.0 moles) of maleic anhydride powder were added to 11409 grams of N,N-dimethylethane In the amide strong polar aprotic organic solvent, after stirring and reacting at room temperature for 1 hour, add 410.0 grams (1.0 moles) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 400.0 grams (2.0 mol) 3,4'-diaminodiphenyl ether and 292.0 gram (1.0 mol) 1,3-(4-aminophenoxy group) benzene aromatic diamine monomer powder, after stirring and dissolving completely, add 966.6 gram (3.0 mol) mol) 3,3',4,4'-tetracarboxylic benzophenone dianhydride, 213.4 g (0.41 mol) 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl] Propane dianhydride and 310.0 g (1.0 mole) 3,3',4,4'-tetracarboxylic diphenyl ether dianhydride aromatic dibasic acid anhydride powder, stirred at room temperature for 3 hours, added 0.58 g of azobisisobutyl Nitrile and 0.4 g of dicumyl peroxide initiator were stirred and dissolved...

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Abstract

The invention relates to a preparation method of a high-temperature resistant polyimide glass fabric laminated board, which comprises the following steps: (1) adding 1,4-bis(2,4-diaminophenoxy) benzene and maleic anhydride to a non-proton organic solvent with strong polarity, then adding aromatic diamine monomer, aromatic dibasic anhydride and initiator, and stirring for dissolving to obtain a component A; (2) adding 1,4-bis(2,4-diaminophenoxy) benzene and maleic anhydride to a non-proton organic solvent with strong polarity, stirring and reacting for 2 hours to obtain a component B; and (3) mixing the component A and the component B evenly to obtain a polyimide precursor resin solution, impregnating the glass fabric in the resin solution, and obtaining the high-temperature resistant polyimide glass fabric laminated board after preliminary drying semi-curing and high-temperature press thermo-curing. The high-temperature resistant polyimide glass fabric laminated board prepared in the invention has excellent heat resistance, can be applied to high-temperature resistant electro-insulating material and high-temperature resistant structural part material of aerospace vehicles, and has wide application prospects.

Description

technical field [0001] The invention belongs to the field of preparation of new polymer materials and, in particular, relates to a preparation method of a high-temperature-resistant polyimide glass cloth laminated board. Background technique [0002] With the development of aerospace, electronic and electrical industries and the improvement of electrical and electrical technology, the demand for high-temperature-resistant glass cloth laminates is increasing. As the main variety of high-temperature-resistant polymer materials, polyimide resin materials have unique characteristics. excellent comprehensive performance. [0003] Polyimide is a kind of polymer material with excellent comprehensive properties. It has particularly excellent heat resistance, low temperature resistance, flame retardancy, electrical properties and mechanical properties. It is widely used in electronic microelectronics, aerospace, High-tech fields such as lasers and optoelectronics. [0004] Polyimid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/06B32B37/10C08G73/10B32B17/04
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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