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Method and device for pulse aperture injection batch preparation of even particles

A uniform and particle technology, applied in the industrial production field of high melting point particle preparation, can solve the problems of no obvious progress in the preparation of high melting point microparticles, unsuitable for industrial production, low production efficiency, etc., and achieves uniform size, consistent organization and low cost. Effect

Active Publication Date: 2011-03-02
DALIAN LONGTIAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dispersion of the particles prepared by the atomization method is relatively wide, and the particles that can meet the requirements of use must be obtained through multiple screening and testing; the method of shredding or punching and remelting is not suitable for small particle size particles or materials with poor plastic processing It is more difficult, in addition, the prepared solder balls must be degreased; the uniform droplet forming method has the problem of unstable precision, especially when the particle size is small; moreover, the above methods are only limited to The preparation of low-melting point microparticle materials has not made significant progress in the preparation of high-melting point microparticles. At the same time, the existing method of using spray holes to prepare particles has low production efficiency, high efficiency, and high cost, which is not suitable for industrial production.

Method used

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  • Method and device for pulse aperture injection batch preparation of even particles
  • Method and device for pulse aperture injection batch preparation of even particles
  • Method and device for pulse aperture injection batch preparation of even particles

Examples

Experimental program
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Effect test

Embodiment 1

[0027] Example 1 Batch preparation of uniform solidified particles of copper:

[0028] Devices used such as figure 1 shown. First, the copper block is broken into massive particles with a particle size or an equivalent particle size of 2 cm, and packed into a crucible 23 with holes in the bottom, and the holes are evenly distributed on the same circumference of the bottom of the crucible, such as figure 2 Shown; The charging amount of copper particle reaches 1 / 4 of described crucible 23 capacity, as figure 1 shown; then, the disc 21 made of graphite is installed on the bottom of the crucible 23 with holes through four uniformly distributed screws 22, and the diameter of the disc 21 is larger than the circle formed by the multiple holes on the bottom of the crucible. The diameter of the disc is provided with evenly distributed injection holes; the wetting angle of copper and graphite is 160°; manually adjust the position of the piston rod 2 until the distance between the pis...

Embodiment 2

[0029] Example 2 Batch preparation of uniform solidified particles of silicon:

[0030] Devices used such as figure 1 shown. First, the silicon block is broken into block particles with a particle size or an equivalent particle size of 1 cm, and the broken pieces are packed into a crucible 23 with holes in the bottom, and the holes are evenly distributed on the same circumference of the bottom of the crucible, such as figure 2 Shown; The charging amount of silicon particle reaches 3 / 4 of described crucible 23 capacity, as figure 1shown; then, the disc 21 made of graphite is installed on the bottom of the crucible 23 with holes through four uniformly distributed screws 22, and the diameter of the disc 21 is larger than the circle formed by the multiple holes on the bottom of the crucible. The diameter of the disc is provided with evenly distributed spray holes; the wetting angle between silicon and quartz is 95°; manually adjust the position of the piston rod 2 until the dis...

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Abstract

The invention relates to a method and device for the pulse aperture injection batch preparation of even particles. A heater is used to melt high melting -point material in a porous crucible on the bottom, and a pulse signal with certain waveform is input to piezoelectric ceramics; the piezoelectric ceramics drives a piston rod to move downwards to extrude fusant; the fusant injects drops from a plurality of injection apertures arranged on a disk; and drops are condensed in an annular landing tube to form even particles. The invention has the outstanding characteristics that even particles with even size, coincident tissue, good sphericity, controllable size and capability of meeting requirements can be prepared in bulk according to the invention. The invention has the characteristics of high efficiency, simple device, low cost and the like and is suitable for industrial production.

Description

technical field [0001] The invention belongs to the technical field of industrial production for the preparation of high-melting point particles, and in particular relates to a method and a device for batch-preparing uniform particles by pulse small hole jetting. Background technique [0002] With the continuous development of materials in the direction of light weight, miniaturization and integration, uniform spherical particle materials have received extensive attention and applications in electronic packaging, energy materials, and biomedical materials. Copper ball particles have good electrical properties, thermal properties, mechanical properties and economic advantages, so they are widely valued and are expected to become the main material in the next generation of electronic packaging technology; silicon ball particles can be used in solar panels, using silicon ball particles The solar cells produced can not only reduce the loss of raw materials in the traditional sil...

Claims

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Application Information

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IPC IPC(8): B01J13/02
Inventor 战丽姝董伟谭毅李国斌
Owner DALIAN LONGTIAN TECH
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