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Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device

一种覆金属层压板、印刷布线板的技术，应用在金属层状产品、印刷电路、印刷电路等方向，能够解决粘连、操作困难、粘性大等问题，达到提高耐热性和阻燃性、操作容易、粘性良好的效果

Active Publication Date: 2011-05-04
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the high viscosity of resin varnishes containing a large amount of inorganic fillers, it is difficult to impregnate a sufficient amount of the base material with the resin composition and uniformly impregnate the inorganic fillers.
A method of reducing the viscosity of a resin varnish containing a large amount of inorganic filler by using a liquid epoxy resin mainly composed of a resin composition has also been considered. tack) is large, there are problems of adhesion and difficult operation

Method used

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  • Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
  • Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
  • Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0170] (1) Preparation of resin varnish containing epoxy resin composition

[0171] First, 9.950 wt % of silica nanoparticles (average particle diameter 56 nm) and 54.725 wt % of particle A (silica, SO25R, average particle diameter 0.5 μm, manufactured by Admatechs Co., Ltd.) were dispersed in dimethyl ethyl ether Amide, MEK (the ratio of the two is dimethylacetamide: MEK = 1: 3), and the concentration of the inorganic filler (silica nanoparticles and silica particles) prepared is 60% by weight of the inorganic filler slurry . Next, dissolve solid epoxy resin A (NC3000, biphenyl aralkyl type epoxy resin, weight average molecular weight 1300, softening point 57 ℃, epoxy equivalent 276g / eq, Nippon Kayaku ( Co., Ltd.) 9.800% by weight, cyanate resin A (PT30, novolac type cyanate resin, weight average molecular weight 380, manufactured by Lonza Japan Ltd.) 17.500% by weight, phenolic resin A (MEH7851, Meiwa Chemical Industry Co., Ltd.) 7.700% by weight and epoxy silane coupling ...

Embodiment 2

[0188] Except having adjusted the resin varnish component containing an epoxy resin composition as follows, it carried out similarly to Example 1. That is, solid epoxy resin A is 8.400% by weight, cyanate resin A is 15.000% by weight, phenolic resin A is 6.600% by weight, silica nanoparticles are 9.950% by weight, particle B (silicon dioxide, SO32R, average particle diameter 1.1 μm, manufactured by Admatechs Co., Ltd.) was 59.700% by weight, and the epoxysilane coupling agent was 0.350% by weight.

Embodiment 3

[0190] Except having adjusted the resin varnish component containing an epoxy resin composition as follows, it carried out similarly to Example 1. That is, solid epoxy resin B (EXA7320, naphthalene type, weight average molecular weight 750, softening point 58° C., epoxy equivalent 250 g / eq, manufactured by Dainippon Ink Chemical Industry Co., Ltd.) is 13.860% by weight, and cyanate resin A is 13.860% by weight, 9.950% by weight of silica nanoparticles, 61.690% by weight of particle A, curing catalyst A (キユアゾ-ル 2P4MHZ, 2-phenyl-4-methyl-5-hydroxymethylimidazole, Shikoku Chemical Industry Co., Ltd.) was 0.280% by weight, and the epoxysilane coupling agent was 0.360% by weight.

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Abstract

An epoxy resin composition, a prepreg, a metal-clad laminate, a printed wiring board and a semiconductor device. The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and / or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 [mu]m or more and 5.0 [mu]m or less.

Description

technical field [0001] The present invention relates to an epoxy resin composition, a prepreg, a metal-clad laminate, a printed wiring board, and a semiconductor device. Background technique [0002] In recent years, high-density lamination and further high-density mounting of electronic components have been advanced in response to demands for higher functionality of electronic devices and the like. For this reason, printed wiring boards and the like which are used for them, which are compatible with high-density mounting, have been more compact and thinner, higher in density, and multilayered than ever before. Therefore, in order to cope with the reduction in the rigidity of the substrate itself due to thinning, it is required to have excellent low thermal expansion, and the characteristics of small bending when connecting parts by reflow soldering; , it is required to have excellent heat resistance; in order to cope with the multilayering of printed wiring boards, it is r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08K3/36B32B15/092H05K1/03
CPCC08G59/4014C08G59/621C08J2363/00C08K3/36C08L63/00H05K2201/0209H05K2201/0257H05K2201/0266C08K2201/003C08K2201/011H05K1/0373Y10T428/252Y10T428/24994Y10T428/249952Y10T428/31515Y10T428/249951Y10T428/31522Y10S428/901C08J5/244C08J5/249C08L79/00C08F222/40C08L79/08C08J5/24
Inventor 田中伸树森清治
Owner SUMITOMO BAKELITE CO LTD
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