Multilayer laminated plate with spherical fillers, and circuit board thereof

Abstract

The present invention provides a multilayer laminated plate with spherical fillers and a circuit board thereof. The multilayer laminated plate is formed by alternate stacking and laminating of a plurality of conducting layers and insulating layers, one conducting layer and another adjacent conducting layer in the multilayer laminated plate are brought into conduction by a conductive pole in a buried hole structure in order to improve circuit designability, wherein the insulating layers of the multilayer laminated plate are provided with spherical fillers inside in order to increase heat conductivity of the insulating layers and modulate heat expansibility of the insulating layers. The insulating layers are formed by solidification of semi-solid films via a hot pressboard laminating program, during the hot pressboard laminating program with the proviso of high temperature and high pressure, the semi-solid films melt into resin solution and fill in the buried hole structure, then the resin solution further solidifies to form the insulating layers. The spherical fillers are uniformly distributed in the buried hole structure of the multilayer laminated plate, which can improve the overall heat conductivity and modulate the heat expansibility of the multilayer laminated plate. In addition, the multilayer laminated plate can effectively give off heat when used in circuit board downstream high temperature assembling technology, at the same time, heat resistance as well as process yield rate of the plate can be improved.

Description

technical field [0001] The invention relates to a circuit board, in particular to a multilayer circuit board with spherical fillers. Background technique [0002] In the past, materials with low thermal conductivity were used to achieve the insulation effect under the requirement of electrical insulation for printed circuit board insulation layer materials. Due to the low thermal conductivity, the board accumulates a large amount of heat energy during the subsequent surface mount technology (SMT) high-temperature assembly process, which cannot be effectively dissipated, resulting in poor heat resistance and even material degradation. [0003] In recent years, under the premise of environmental protection, the downstream assembly process of printed circuit boards has progressed from lead-containing to lead-free process, and the SMT assembly temperature has also increased from 245°C to 260°C, which makes the heat dissipation and heat resistance of the board face greater proble...

AI Technical Summary

Problems solved by technology

[0005] However, factors such as the increase in the number of layers of the multilayer laminate, the increase in the assembly temperature, the increase in the aspect ratio of the plate thickness to the aperture, and the increase in the density of the buried holes make it easy for the buried holes of the multilayer board to accumulate a large amount of heat during the assembly process. Due to the small thermal conductivity of the insulating layer material, the heat cannot be effectively discharged from the board, causing the board temperature to rise rapidly in the densely buried hole area, resulting in the phenomenon of delamination and cracking of the material due to high temperature, which limits the design of the number of layers of the circuit board

[0006] However, in the prior art, non-regular fillers (such as talcum powder) are used to fill the insulating layer of the circuit board to increase thermal conductivity, please refer to image 3 However, when the irregularly shaped filler is pressed on the insulating layer and the conductive layer hot pressing plate, the irregularly shaped filler in the insulating layer is not easy to flow into the buried hole structure, so that the resin material in the buried hole structure is in the above heat environment It is easy to cause heat energy to accumulate and cannot effectively discharge heat energy, causing the material in this part to be extruded and stratified and cracked due to thermal expansion.

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