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Diamond grinding tool of ceramic-metallic bond and preparation method of grinding tool

A metal bond and ceramic bond technology, which is applied in metal processing equipment, grinding/polishing equipment, abrasives, etc., can solve the problem of unsatisfactory service life of diamond abrasive tools, difficulty in meeting market requirements, and inability to use hot-press sintering Process and other issues, to achieve the effect of easy shaping and sharpening, shortening the production cycle, and improving strength and toughness

Active Publication Date: 2012-07-04
长沙百通新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the field of high-precision grinding, metal-bonded diamond abrasive tools are mainly used in China. Although this type of abrasive tool has the characteristics of strong bonding force, long grinding life, and good shape retention, it is easy to block due to excessive viscosity. Poor sharpness, difficult to trim and other shortcomings, often cause workpiece burns and low processing efficiency during processing
Vitrified bonded grinding tools are mainly used abroad. Vitrified bonded diamond grinding tools have great advantages over metal bonded diamond grinding tools in terms of grinding accuracy and grinding efficiency. Due to poor wetness and other reasons, the service life of vitrified bonded diamond abrasive tools has not been ideal
In addition, due to the non-conductive characteristics of the vitrified bond itself, the hot-press sintering process commonly used for metal-bond diamond abrasive tools cannot be used, but only cold-press sintering can be used. This production process is complicated, the production cycle is long, and the product is difficult to satisfy the market. Require

Method used

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  • Diamond grinding tool of ceramic-metallic bond and preparation method of grinding tool
  • Diamond grinding tool of ceramic-metallic bond and preparation method of grinding tool
  • Diamond grinding tool of ceramic-metallic bond and preparation method of grinding tool

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The specific process of this example is as follows image 3 shown.

[0031] Table 1: Ceramic-metal bond components and proportions

[0032] components

SiO 2

Al 2 o 3

B 2 o 3

Li 2 o

Na 2 o

K 2 o

ZnO

Ti

Al

wt%

44

9

19

6

7

3

5

5

2

[0033] Analytical pure SiO 2 、Al 2 o 3 、HBO 3 , Li 2 CO 3 、Na 2 CO 3 、K 2 CO 3 and ZnO as raw materials, calculated according to the formula in the above table, weighed, mixed evenly, put into a crucible, heated to 1300°C in a high-temperature frit furnace, kept for 2 hours, water quenched after the raw materials were completely melted, and then wet milled on a ball mill ( 1000r / min) for 24h, dry the wet-milled slurry in an oven at 100°C for 12h, dry-grind for 4h, and pass through a 200-mesh sieve to make a basic vitrified bond.

[0034] Add Ti powder (particle size ≤ 20 μm) and Al powder (particle size ...

Embodiment 2

[0038] Table 2: Ceramic-metal bond components and proportions

[0039] components

SiO 2

al 2 o 3

B 2 o 3

Li 2 o

Na 2 o

K 2 o

ZnO

Ti

Al

wt%

48

12

12

3

8

4

2

8

3

[0040] Analytical pure SiO 2 、Al 2 o 3 、HBO 3 , Li 2 CO 3 、Na 2 CO 3 、K 2 CO 3 and ZnO as raw materials, calculated according to the above formula, weighed, mixed evenly, put into a crucible, heated to 1300 °C in a high-temperature frit furnace, kept for 2 hours, water quenched after the raw materials were completely melted, and then wet milled on a ball mill (1000r / min) for 24 hours, dry the wet-milled slurry in an oven at 100°C for 12 hours, then dry-mill it for 4 hours and pass it through a 200-mesh screen to make a basic vitrified bond.

[0041]Add Ti powder (particle size ≤ 20 μm) and Al powder (particle size ≤ 20 μm) designed in the formula to the basic vitrified bond, and...

Embodiment 3

[0046] Table 3: Ceramic-metal bond components and proportions

[0047] components

SiO 2

Al 2 o 3

B 2 o 3

Li 2 o

Na 2 o

K 2 o

ZnO

Ti

Al

wt%

41

8

18

6

9

6

3

6

3

[0048] Analytical pure SiO 2 、Al 2 o 3 、HBO 3 , Li 2 CO 3 、Na 2 CO 3 、K 2 CO 3 and ZnO as raw materials, calculated according to the above formula, weighed, mixed evenly, put into a crucible, heated to 1300 °C in a high-temperature frit furnace, kept for 2 hours, water quenched after the raw materials were completely melted, and then wet milled on a ball mill (1000r / min) for 24 hours, dry the wet-milled slurry in an oven at 100°C for 12 hours, then dry-mill it for 4 hours and pass it through a 200-mesh screen to make a basic vitrified bond.

[0049] Add Ti powder (particle size ≤ 20 μm) and Al powder (particle size ≤ 20 μm) designed in the formula to the basic vitrified bond, and...

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Abstract

The invention discloses a diamond grinding tool of a ceramic-metallic bond and a preparation method of the grinding tool. The preparation method comprises the following steps of: firstly, preparing the ceramic-metallic bond by ball milling the following components in percentage by weight: 40 to 50 percent of silicon dioxide (SiO2), 8 to 15 percent of aluminium oxide (Al2O3), 12 to 20 percent of diboron trioxide (B2O3), 3 to 6 percent of lithium oxide (Li2O), 6 to 12 percent of sodium oxide (Na2O), 3 to 6 percent of potassium oxide (K2O), 2 to 8 percent of zinc oxide (ZnO), 1 to 10 percent of titanium (Ti) and 1 to 5 percent of aluminium (Al); secondly, mixing the ceramic-metallic bond with a diamond abrasive to obtain a mixed material, and then adding 3 to 5 mass percent of wetting agent into the mixed material to obtain a raw material of the grinding tool; and finally, carrying out hot-forming and cooling de-moulding on the raw material of the grinding tool respectively to obtain thediamond grinding tool of the ceramic-metallic bond. The diamond grinding tool of the ceramic-metallic bond provided by the invention has the advantages of the diamond grinding tool of a metallic bondand the grinding tool of a ceramic bond.

Description

technical field [0001] The invention relates to a ceramic-metal bonded diamond grinding tool and a preparation method thereof. Background technique [0002] Diamond grinding tools are widely used in the processing of engineering ceramic materials, crystal materials, semiconductor materials, hard alloy materials and composite materials. At present, in the field of high-precision grinding, metal-bonded diamond abrasive tools are mainly used in China. Although this type of abrasive tool has the characteristics of strong bonding force, long grinding life, and good shape retention, it is easy to block due to excessive viscosity. The disadvantages of poor sharpness and difficult trimming often cause workpiece burns and low processing efficiency during processing. Vitrified bonded grinding tools are mainly used abroad. Vitrified bonded diamond grinding tools have great advantages over metal bonded diamond grinding tools in terms of grinding accuracy and grinding efficiency. Due t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D3/14B24D3/06B24D18/00
Inventor 万隆王志起刘小磐胡伟达翟浩冲张国威
Owner 长沙百通新材料科技有限公司
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