Preparation method of glass fiber reinforced epoxy resin composite material modified by reclaimed circuit board powder

A technology of glass fiber and epoxy resin, which is applied in the field of preparation of circuit board recycled powder modified glass fiber reinforced epoxy resin composite materials, can solve the problems of low interface bonding strength, low surface energy, low reactivity, etc. Achieve the effect of increasing the interface bonding strength, improving the interface bonding performance, and broadening the application range

Inactive Publication Date: 2011-09-14
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high inertia of the glass fiber surface, low surface energy, few chemically active functional groups, low reactivity, and poor

Method used

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  • Preparation method of glass fiber reinforced epoxy resin composite material modified by reclaimed circuit board powder
  • Preparation method of glass fiber reinforced epoxy resin composite material modified by reclaimed circuit board powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment l

[0017] Example 1: Using glass fiber as the initial raw material, the glass fiber is modified by a silane coupling agent KH550 to obtain a surface-active glass fiber reinforcement; the surface of the dried circuit board recycled powder is subjected to active treatment, and then combined with double Phenol A-type epoxy resin (E-44) is mixed to obtain a modified epoxy resin matrix filled with recycled circuit board powder; finally, the glass fiber reinforcement modified by the coupling agent obtained above and recycled circuit board powder are filled The modified epoxy resin matrix is ​​compounded in a certain way to obtain a glass fiber reinforced epoxy resin composite material modified by recycled circuit board powder.

[0018] Step (1): Weigh 200g of dry glass fiber, immerse the dry glass fiber in silane coupling agent KH550 at 30°C for 1 hour, take it out, and dry it at 60°C for 4 hours to obtain a surface-coated coupling agent Modified glass fiber reinforcement;

[0019] St...

Embodiment 2

[0024] Example 2: Using glass fiber as the initial raw material, the glass fiber is modified by the silane coupling agent KH570 to obtain a surface-active glass fiber reinforcement; the surface of the dried circuit board recycled powder is subjected to active treatment, and then combined with double Phenol A-type epoxy resin (E-51) is mixed to obtain a modified epoxy resin matrix filled with recycled circuit board powder; finally, the glass fiber reinforcement modified by the coupling agent obtained above and recycled circuit board powder are filled The modified epoxy resin matrix is ​​compounded in a certain way to obtain a glass fiber reinforced epoxy resin composite material modified by recycled circuit board powder.

[0025] Step (1): Weigh 600g of dry glass fiber, immerse the dry glass fiber in silane coupling agent KH570 at 50°C for 2 hours, take it out, and dry it at 60°C for 2 hours to obtain a surface-coated coupling agent Modified glass fiber reinforcement;

[0026]...

Embodiment 3

[0030] Example 3: Using glass fiber as the initial raw material, the glass fiber is modified by silane coupling agent KH560 to obtain a surface-active glass fiber reinforcement; the surface of the dried circuit board recycled powder is subjected to active treatment, and then combined with double Phenol A-type epoxy resin (E-54) is mixed to obtain a modified epoxy resin matrix filled with recycled circuit board powder; finally, the glass fiber reinforcement modified by the coupling agent obtained above and recycled circuit board powder are filled The modified epoxy resin matrix is ​​compounded in a certain way to obtain a glass fiber reinforced epoxy resin composite material modified by recycled circuit board powder.

[0031] Step (1): Weigh 100g of dry glass fiber, immerse the dry glass fiber in silane coupling agent KH560 at 40°C for 3 hours, take it out, and dry it at 80°C for 4 hours to obtain a surface-coated coupling agent Modified glass fiber reinforcement;

[0032] Ste...

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Abstract

The invention relates to a preparation method of a glass fiber reinforced epoxy resin composite material modified by reclaimed circuit board powder. The preparation method comprises the following steps: modifying glass fibers by a coupling agent to obtain a surface active glass fiber reinforced body; activating the surface of dried reclaimed circuit board powder and then mixing the powder with epoxy resins to obtain an epoxy resin matrix filled and modified by the reclaimed circuit board powder; and finally compounding the obtained glass fiber reinforced body modified by the coupling agent and the epoxy resin matrix filled and modified by the reclaimed circuit board powder to obtain the glass fiber reinforced epoxy resin composite material modified by the reclaimed circuit board powder. The preparation method has the advantages that reaction steps are simple; by means of the glass fibers treated by the coupling agent, the interface adhesive property between the glass fibers and the resin matrix is improved and the interface adhesive strength of the composite material is strengthened; and the resin matrix is toughened by virtue of strength and toughness of the glass fibers, and theresin matrix is filled and modified by the reclaimed powder after surface active treatment so as to improve the overall performance of the composite material, thus the composite material can be widely applied to fields such as aerospace, cars and ships, mechanical electronics and the like.

Description

technical field [0001] The invention belongs to the technical field of comprehensive utilization of solid waste, and in particular relates to a preparation method of recycled circuit board powder modified glass fiber reinforced epoxy resin composite material. Background technique [0002] Epoxy resin has excellent adhesive properties, wear resistance, mechanical properties, electrical insulation properties, chemical stability, and high and low temperature resistance. Due to its low shrinkage, easy processing and low cost, it is widely used in the fields of adhesives, coatings, electrical and electronic insulation materials, reinforcing materials and advanced composite materials. With the rapid development of information technology, information carriers and information materials, the life cycle of electronic products is getting shorter and shorter. These waste electronic products contain a lot of recyclable substances. Unreasonable disposal and recycling will not only cause a...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/04C08K9/06C08K7/14C08J5/08
Inventor 邱军王宗明
Owner TONGJI UNIV
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