Hole-sealing agent for chemical nickel plating layer and hole-sealing treatment process thereof

A technology of electroless nickel plating layer and treatment process, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problem of insufficient corrosion resistance of the electroless nickel plating layer, and achieve simple hole sealing process, The effect of enhanced corrosion resistance and waste reduction

Active Publication Date: 2012-11-07
深圳明阳电路科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the invention is to solve the problem of insufficient corrosion resistance of the electroless nickel plating layer with low thickness in the existing electroless nickel plating technology

Method used

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  • Hole-sealing agent for chemical nickel plating layer and hole-sealing treatment process thereof
  • Hole-sealing agent for chemical nickel plating layer and hole-sealing treatment process thereof
  • Hole-sealing agent for chemical nickel plating layer and hole-sealing treatment process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] according to image 3 The flow chart of the sample preparation process of the electroless nickel plating layer is shown to carry out the preparation of the sample of the present invention.

[0051] Prepare a sealing agent with the following composition: add 5% volume of KH-560 to 93% volume of acrylic acid, mix well, then slowly add 2% volume of water, and mix well.

[0052] according to figure 1 The hole-sealing process of the electroless nickel-plated layer sample shown in the present embodiment carries out the hole-sealing process of the electroless nickel-plated layer sample, and the processing conditions of each step are as follows:

[0053] Conditions for immersion treatment of electroless nickel plating layer samples: the temperature is 45°C, and the time is 5 minutes.

[0054] The conditions for the water bath heating treatment of the electroless nickel plating layer sample: the temperature is 85°C, and the time is 3min.

[0055] Conditions for warm water rin...

Embodiment 2

[0057] according to image 3 The flow chart of the sample preparation process of the electroless nickel plating layer is shown to carry out the preparation of the sample of the present invention.

[0058] Prepare a sealing agent with the following composition: add 1% volume of KH-560 to 90% volume of acrylic acid, mix well, then slowly add 9% volume of water, and mix well.

[0059] according to figure 1 The hole-sealing process of the electroless nickel-plated layer sample shown in the present embodiment carries out the hole-sealing process of the electroless nickel-plated layer sample, and the processing conditions of each step are as follows:

[0060] Conditions for immersion treatment of electroless nickel plating layer samples: the temperature is 25°C, and the time is 10 minutes.

[0061] The conditions for the water bath heating treatment of the electroless nickel plating layer sample: the temperature is 90°C, and the time is 1min.

[0062] Conditions for warm water ri...

Embodiment 3

[0064] according to image 3 The flow chart of the sample preparation process of the electroless nickel plating layer is shown to carry out the preparation of the sample of the present invention.

[0065] Prepare a sealing agent with the following composition: add 9% volume of KBM-7103 to 90% volume of acrylic acid, mix well, then slowly add 1% volume of water, and mix well.

[0066] according to figure 1 The hole-sealing process of the electroless nickel-plated layer sample shown in the present embodiment carries out the hole-sealing process of the electroless nickel-plated layer sample, and the processing conditions of each step are as follows:

[0067] Conditions for immersion treatment of the electroless nickel plating layer sample: the temperature is 50°C, and the time is 1min.

[0068] The conditions for the water bath heating treatment of the electroless nickel plating layer sample: the temperature is 70°C, and the time is 5min.

[0069] Conditions for warm water rin...

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Abstract

The invention discloses a hole-sealing agent for a chemical nickel plating layer and a hole-sealing treatment process thereof. The hole-sealing agent is prepared from the following materials in percentage by volume: 90-98% of acrylic acid, 1-9% of silane coupling agent and 1-9% of water. The hole-sealing treatment process of the hole-sealing agent for a chemical nickel plating layer comprises thefollowing steps: soaking or spraying the hole-sealing agent onto the chemical nickel plating layer to enable the hole-sealing agent to be uniformly distributed on the surface of the chemical nickel plating layer; selecting water of 70-90 DEG C to carry out appropriate heating treatment on the chemical nickel plating layer, wherein the heating treatment time is 1-5 minutes; and selecting water of 30-45 DEG C to rinse the chemical nickel plating layer, and then carrying out blow-drying. After the hole-sealing treatment of the hole-sealing agent for a chemical nickel plating layer, a well combined organic film can be formed on the surface of the chemical nickel plating layer, so that the porosity of the chemical nickel plating layer is remarkably reduced, the corrosion resistance is obviously enhanced, and the conductivity and appearance of the chemical nickel plating layer are not affected.

Description

technical field [0001] The invention belongs to the technical field of surface chemical treatment of materials, and in particular relates to a sealing agent for sealing holes on an electroless nickel plating layer and a treatment process thereof. Background technique [0002] The electroless plating process is a self-catalyzed chemical reaction process, and there is no problem of the thickness difference of the plating layer caused by the uneven current distribution in the electroplating process. Due to the comprehensive physical and chemical properties of the electroless nickel plating layer, such as excellent uniformity, hardness, wear resistance, etc., the electroless nickel plating technology has been widely used in the industrial field. [0003] With the development of industrial technology and the need to improve mechanical properties, higher requirements are put forward for the wear resistance and corrosion resistance of coatings of industrial materials. Especially ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/32C23C22/54C23C22/73C23C22/76
Inventor 胡光辉唐锋徐家伟庄荣鑫潘湛昌魏志刚罗观和
Owner 深圳明阳电路科技股份有限公司
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