Environment-friendly silver conductive paste for surface mounting of semiconductor chips and preparation method of environment-friendly silver conductive paste

A silver conductor paste, chip mounting technology, applied in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, electrical components, etc., can solve problems such as limiting the development of conductor paste, and achieve excellent connection performance , Improve the connection strength, the effect of excellent electrical conductivity

Inactive Publication Date: 2011-10-19
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the past, conductive paste made of leaded glass powder was often used in the field of chip mounting. With the implementation of various environmental protection regulations, lead oxide has become a substance banned by governments and environmental protection organizations in various countries. Electronic pastes are also facing such problems. The problem of environmental protection needs to be solved, and if the problem of environmental protection is not solved, it will limit the development of conductive paste in the civilian product market

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The environment-friendly silver conductor paste for mounting semiconductor chips is specifically prepared according to the following process steps:

[0034] First prepare the following raw materials according to mass percentage:

[0035] Ultrafine silver powder 65%, organic vehicle 30%, lead-free glass powder 2% and additive 3%;

[0036] Among them, the ultrafine silver powder is ultrafine silver powder with a particle size of 0.1 to 5 μm; the organic solvent in the organic carrier is butyl carbitol, and the organic additive is methyl cellulose, and the ratio of the two is 4.5:5.5; the lead-free glass powder is Zinc boroaluminosilicate glass powder; the additive is a dispersant and a surfactant, wherein the dispersant is selected from dioctyl phthalate; the surfactant is selected from hexadecyl alcohol, wherein the dispersant and the surfactant are based on the ratio of 1: 1 ratio composition.

[0037] This kind is based on the preparation method of environment-friend...

Embodiment 2

[0043] The environment-friendly silver conductor paste for mounting semiconductor chips is specifically prepared according to the following process steps:

[0044] First prepare the following raw materials according to mass percentage:

[0045] 68% ultra-fine silver powder, 18% organic vehicle, 8% lead-free glass powder and 6% additive;

[0046] Among them, the ultrafine silver powder is ultrafine silver powder with a particle size of 0.1-5 μm; the organic solvent in the organic carrier is selected from turpentine, and the organic additive is selected from phenolic resin, and the ratio of the two is 4:6; the lead-free glass powder is zinc boroaluminosilicate system Glass powder; the additive is a dispersant and a surfactant, wherein the dispersant is selected from propylene glycol butyl ether; the surfactant is selected from castor oil, wherein the dispersant and the surfactant are formed in a ratio of 3:1.

[0047] This kind is based on the preparation method of environment-...

Embodiment 3

[0053] The environment-friendly silver conductor paste for mounting semiconductor chips is specifically prepared according to the following process steps:

[0054] First prepare the following raw materials according to mass percentage:

[0055] Ultrafine silver powder 66%, organic vehicle 20%, lead-free glass powder 2% and additive 12%;

[0056] Wherein the superfine silver powder is ultrafine silver powder with a particle size of 0.1 to 5 μm; the organic solvent in the organic carrier is selected from terpineol and butyl carbitol (mixed by mass percentage 1:2), and the organic additive is selected from ethyl cellulose, two The ratio is 6.5:3.5; the lead-free glass powder is zinc boroaluminosilicate glass powder; the additive is a dispersant and a surfactant, wherein the dispersant is selected from dioctyl phthalate; the surfactant is selected from lecithin , wherein the dispersant and surfactant are composed according to the ratio of 3.5:1.

[0057] This kind is based on th...

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PUM

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Abstract

The invention discloses an environment-friendly silver conductive paste for surface mounting of semiconductor chips and a preparation method of environment-friendly silver conductive paste. The paste comprises 65-80 percent of ultrafine silver powder, 10-30 percent of organic carriers, 2-8 percent of lead-free glass power and 3-12 percent of additives; the organic carriers comprise organic solvent and organic additives with mass percent of 4-7:3-6; and the additives comprise dispersing agents and surface active agents with mass ratio of 1-5:1. The preparation method of the environment-friendly silver conductive paste comprises the following steps: 1) the power is mixed for standby; 2) the organic carriers are prepared and cooled to room temperature for standby; and 3) the paste is mixed to obtain the environment-friendly silver conductive paste. The paste has good conductive performance, strong adhesive force, good stability, low expansion coefficient, difficulty in oxidization and good wettability and intermiscibility with a chip and a chip substrate.

Description

technical field [0001] The invention relates to an environment-friendly silver conductor paste based on semiconductor chip mounting, which is suitable for the field of electronic component manufacturing such as semiconductor chip mounting, in particular to an environment-friendly silver conductor paste based on semiconductor chip mounting and its Preparation. Background technique [0002] In the modern electronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The placement of semiconductor chips has developed from the original welding and flow soldering technology to the current production line. Correspondingly, new requirements of conductive paste are required to match the placement of semiconductor chips, and it is imperative to carry out research on new conductive pastes. [0003] Generally speaking, the main components of electronic paste include fu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
Inventor 张宇阳
Owner IRICO
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