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Packaging material for high-blockage organic electronic device

A technology of organic electronic devices and packaging materials, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems of moisture and oxygen permeation resistance, limitation, etc., and achieve the effects of inhibiting permeability, long life, and preventing corrosion

Active Publication Date: 2013-01-16
孙国林 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of inorganic fillers with an average particle size of more than 5 microns in this resin composition can hinder the penetration of moisture and oxygen to a certain extent, but it is very limited.

Method used

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  • Packaging material for high-blockage organic electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Mix 100 parts of bisphenol A epoxy resin, 50 parts of flake mica (average particle size 5um, surface length / thickness = 25), 5 parts of iodine-based photocationic polymerization initiator, and 10 parts of long-chain alkyl silane coupling agent , mix and disperse with a three-roll rolling machine, pressurize and filter, and then use a coating machine to coat the device where the device needs to be packaged. After the package cover and the substrate are pressed together, use a UV lamp 10J / cm 2 Irradiation, and then heat treatment under the condition of 80C*1hr to complete the packaging of the device.

Embodiment 2

[0020] 100 parts of bisphenol F epoxy resin, 60 parts of flaky talc (average particle size 3um, surface length / thickness = 20), 10 parts of additive (Sb series photocationic polymerization initiator), 10 parts of additive (epoxy modified silane coupling Joint agent) 6 parts, mixed and dispersed with a banburyer, and filtered under pressure to obtain the packaging material composition of the present invention.

[0021] The encapsulation of the organic device was carried out under the same conditions as in the above-mentioned Example 1.

Embodiment 3

[0023] 100 parts of matrix polymer acrylate-modified epoxy resin, 55 parts of flaky inorganic compound (silica, average particle size 2um, surface length / thickness=5), 5 parts of additive (imidazole curing initiator), 5 parts of additive (epoxy Modified silane coupling agent) 10 parts, mixing and dispersing with a banburyer, pressure filtration, to obtain the packaging material composition of the present invention. This composition is coated on the place where the device needs to be packaged by using a screen printing device. After the package cover and the substrate are bonded, it is thermally cured under the condition of 70C*2hr+130C*4hr to package the device.

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Abstract

The invention discloses a packaging material for a high-blockage organic electronic device. The material mainly comprises 100 parts by mass of macromolecular resin and 20-100 parts by mass of inorganic filler, wherein the inorganic filler is platelike and has the surface length diameter / thickness ratio of 1.5-50 and the average particle size of 1.0-5.0; after the packaging material disclosed by the invention is cured through cross-linking reaction, XRD (X-Ray Diffraction) based structure analysis on the packaging material shows that the crystallization surface interval of the packaging material is between 0.1 nanometer and 3 nanometers which is far smaller than the size of a water molecule aggregation, therefore, the packaging material can block the permeability and diffusion paths of moisture and gas and can be applied to the high-blockage organic electronic device. The packaging material can be used for greatly inhibiting the permeability of moisture and gas and preventing ionic components from corroding electrodes and the like, has a lower coefficient of thermal expansion. By the adoption of the packaging material, the service life of the organic device can be prolonged, and the packaging cost can be reduced by the reduction in packaging width and packaging material consumption.

Description

technical field [0001] The invention relates to a packaging material for electronic devices, in particular to a packaging material for organic electronic devices with high barrier properties. Background technique [0002] In recent years, organic electronic devices using organic thin films, such as photosensors, organic electroluminescence, biosensors, electronic paper and other display devices, organic triodes, organic solar cells, organic semiconductor storage devices, communication devices, etc., have attracted more and more attention. . However, since organic films are easily affected by moisture and oxygen and other gases to cause deterioration and phase separation, the need for packaging materials with strong barrier properties for moisture and gases is also more urgent. [0003] High barrier property means that the intrusion of water vapor and oxygen brought from the external environment of the device to the organic device can be fully suppressed. As a method of imp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L75/04C08L69/00C08L33/04C08L23/00C08L63/02C08L63/10C08K7/00C08K3/34C09K3/10
Inventor 孙国林孙世峰秦学孔
Owner 孙国林