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Double sided flexible printed circuit board for use hinge region

A circuit substrate, double-sided technology, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of thinness, poor flexibility, increased thickness, hindering the high density of electronic circuits or electronic parts, etc., to achieve the suppression of conductors The effect of broken or broken

Inactive Publication Date: 2011-11-02
NIPPON STEEL CHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009]However, in the case of combining a single-sided flexible circuit board to form a bending portion, the thickness of the layer itself of the formed flexible circuit board will increase, so the thinness and Flexibility will be worse than a single single-sided flexible circuit substrate
Furthermore, in the case where the flexible circuit board has a reinforcing structure, the reinforcing structure hinders the high density of electronic circuits or electronic components on the circuit board.

Method used

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  • Double sided flexible printed circuit board for use hinge region
  • Double sided flexible printed circuit board for use hinge region
  • Double sided flexible printed circuit board for use hinge region

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0058] Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples.

[0059] Processing copper foil circuit

[0060] A dry film is laminated on a double-sided copper-clad laminate made of a liquid crystal polymer film, and a circuit pattern is formed by UV (ultraviolet) exposure using a pattern film with a photoresist width of 100 μm and a circuit width of 100 μm. Next, copper foil etching was performed using a copper chloride etchant. The obtained double-sided conductor circuit board was checked with an optical microscope for peeling of circuits or residual copper between circuits.

[0061] Determination of thickness

[0062] According to JISC5016, the thickness of an insulating layer, a covering material, and a copper foil was measured using the film thickness tester (made by Mitutoyo Corporation, dial indicator 215-153).

[0063] Determination of initial resistance value

[0064] According to JISC5016, using a...

no. 1 Embodiment

[0070] A liquid crystal polymer film 280 (Beckstar (transliteration) manufactured by KURARAY Co., Ltd., heat distortion temperature 280°) with a thickness of 25 μm is used as an insulating layer, and rolled copper foil (BHY manufactured by Nippon Mining Materials Co., Ltd.) with a thickness of 18 μm is provided on both sides. -22B-T) double-sided copper-clad laminate, laminate dry film, and use a pattern film with a photoresist width of 100 μm and a circuit width of 100 μm, and use UV (ultraviolet) exposure to form a circuit pattern. Next, the copper foil was etched using a copper chloride etchant to fabricate a double-sided conductor circuit board W. Then, a liquid crystal polymer film 260 (Beckstar manufactured by KURARAY Co., Ltd., heat distortion temperature 260°) having a thickness of 25 μm was used as a covering material for the double-sided conductor circuit board W, and the above-mentioned rolled copper foil having a thickness of 18 μm was prepared on one side. The sin...

no. 2 Embodiment

[0074] Except for using a liquid crystal polymer film 260 with a thickness of 50 μm as the cover material, a double-sided flexible circuit board was produced in the same manner as in the first embodiment, and the same experiment was carried out.

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Abstract

The invention relates to a double sided flexible printed circuit board which is able to repeatedly bend, adapt to the transmission of the high-frequency signal, be light and thin, inhibit the conductor breakage and promote the high density of the circuit board. The double-sided flexible circuit board is provided with a conductor circuit 2 and a cover material 1 on both sides of an insulating layer 3. In this case, the insulating layer is formed of a liquid crystal polymer film or a polyimide film of 10-100 [mu]m in thickness, and the cover material is formed of only a liquid crystal polymer film with a thermal deformation temperature different from that of the insulating layer. The double-sided flexible circuit board for bending is also provided with a surrounding section of which the copper foil stress value Y is used in a range of 0.5-3% as shown in a following formula (1) Y(%)=(tCu+1 / 2 tLI) / (r+tCL.+tCu+1 / 2 tLI)*100 (where, tLI: thickness of insulating layer ([mu]m); tCL: thickness of cover material ([mu]m); tCu: thickness of copper foil ([mu]m); r: bending radius of surrounding section).

Description

[0001] This application is a divisional application of the Chinese patent application with the application number 200610007679.2 and the application date of February 17, 2006, and the invention title is "repeatedly bendable double-sided flexible circuit board". technical field [0002] The present invention relates to a repeatedly bendable double-sided flexible circuit board suitable for a hinge portion of a mobile phone that is frequently bent. Background technique [0003] As a key component of electronic equipment, mobile phones play an important role. Along with the miniaturization and high integration of electronic components, high performance is required. In response to these requirements, even in circuit boards with wiring circuits, not only high density, thinner, and flexible, but also high frequency signals have attracted attention in recent years in order to process a large amount of information. [0004] In order to transmit high-frequency signals, materials with ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H04M1/02
CPCH04M1/0214H04M1/0277H05K3/281H05K2201/0141
Inventor 高桥洋介平石克文后藤嘉宏
Owner NIPPON STEEL CHEMICAL CO LTD
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