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Ceramic composite material and preparation method thereof

A technology of ceramic composite materials and porous ceramics, applied in the field of thermal conductive materials, can solve the problems of poor heat dissipation performance, small contact area, low thermal conductivity, etc., and achieve the effects of low cost, good bonding performance and excellent thermal conductivity.

Active Publication Date: 2011-11-09
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to solve the technical problem of low thermal conductivity of thermal conductive materials in the prior art, or poor heat dissipation performance caused by small contact area

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0026] The invention provides a kind of preparation method of ceramic composite material, comprises the following steps:

[0027] Step 1. Pretreatment of the porous open-pore ceramics:

[0028] 1) Ultrasonic cleaning of porous and open-pore ceramics, and then drying in an oven at 100-120°C for 8-20h;

[0029] The ceramics of the present invention are porous open-pore ceramics, the volume of the pores accounts for 10%-90% (porosity 10-90%) of the total volume of the ceramics, and the above-mentioned pores are open pores, which expose the surface of the ceramics and are used for filling glue. adhesive. The composition of the above-mentioned porous and open-pore ceramics can be aluminum oxide, aluminum nitride, boron nitride, silicon nitride or silicon carbide, and the preparation method of the porous and open-pore ceramics is well known to those skilled in the art, for example: the thermal conductivity of aluminum oxide is 25 ~ 60W / mK, the thermal conductivity of aluminum nitr...

Embodiment 1

[0046] 1. Ultrasonic cleaning of Al 2 o 3 Porous open-pore ceramics, dried at 120°C for 10h, Al 2 o 3 The porosity of porous open-pore ceramics is 50%, and the average pore diameter is 200nm;

[0047] 2. Use polytetrafluoroethylene plastic film to cover the surface of porous open-pore ceramics in contact with electronic components or / and heat sinks. Other surfaces are not covered with polytetrafluoroethylene plastic film, soaked in silane coupling agent and ethanol In the mixed solution, the mass percentage of silane coupling agent and alcohol in the mixed solution is 0.4%, and at the same time, the solution is ultrasonically oscillated at 90°C for 20min, the plastic film is removed, and then dried at 90°C for 6h;

[0048] 3. Prepare epoxy resin adhesive, the composition is as follows: E-51 100Kg; propylene oxide butyl ether 10Kg; liquid nitrile rubber 15Kg; acid anhydride curing agent 90Kg; imidazole accelerator 1Kg; mix the above raw materials evenly After mutual dissolu...

Embodiment 2

[0052] 1. Ultrasonic cleaning of Al 2 o 3 Porous open-pore ceramics, dried at 100°C for 10h, Al 2 o 3 The porosity of porous open-pore ceramics is 30%, and the average pore diameter is 500nm;

[0053] 2. Soak the porous open-pore ceramics in a mixed solution of titanate coupling agent and ethyl acetate. In the mixed solution, the mass percentage of titanate coupling agent and ethyl acetate is 0.3%. The solution was ultrasonically oscillated for 30 minutes, then dried at 100°C for 6 hours, and then the surface of the porous ceramic was ground to remove the organic layer;

[0054] 3. Prepare a polyester resin adhesive, the composition of which is as follows: 100Kg of polyester; 10Kg of liquid nitrile rubber, 10Kg of dibutyl phthalate; 0.2Kg of methyl ethyl ketone peroxide; mix the above materials evenly and dissolve each other to obtain glue Adhesive;

[0055] 4. Under a vacuum environment, immerse the treated porous and open-pore ceramics in the adhesive. Then, under norm...

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PUM

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Abstract

The invention provides a ceramic composite material, comprising porous ceramic, wherein adhesive is filled in the pore space of the porous ceramic. The invention also provides a preparation method of the ceramic composite material, comprising the steps of: adhesive dipping: dipping the porous ceramic into the adhesive, and pressing the adhesive into the pore space of the porous ceramic; and curing: curing the adhesive in the porous ceramic to obtain the ceramic composite material. According to the preparation method provided by the invention, the ceramic composite material is obtained by filling the adhesive in the pore space of the porous ceramic; the porous ceramic is adopted as a substrate for the ceramic composite material, therefore, the forming of heat conductive paths is ensured, and compared with high molecular heat conducting composite material, the ceramic composite material has an excellent heat conducting performance; synchronously, because the porous ceramic is subjected to the adhesive dipping treatment, the ceramic composite material has a better bonding performance with heating elements and heat radiating devices compared with the single ceramic material; and the ceramic composite material is simple in production process and low in cost.

Description

technical field [0001] The invention relates to the field of heat-conducting materials, in particular to a ceramic composite material and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of electronic technology, the miniaturization of integrated circuits is getting higher and higher, and electronic components are becoming more and more dense, which makes the heat generation of electronic components per unit area of ​​integrated circuit modules increase sharply, and the operating temperature rises. It will affect the operating efficiency of electronic components, and severe overheating will also cause damage to electronic components, so it is necessary to effectively dissipate heat from the integrated circuit module. [0003] At present, in order to dissipate the heat generated by electronic components as soon as possible, those skilled in the art have adopted various heat dissipation methods, such as: using fans to diss...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/02
Inventor 徐述荣张凌紫林信平
Owner BYD CO LTD
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