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Halogen-free fire resistance epoxy resin composite as well as prepreg material and printed circuit board therefrom

A technology of halogenated epoxy resin and epoxy resin, which is applied in the field of epoxy resin composition, can solve the problems of reducing the resistance to dipping of the substrate, poor dielectric constant of the dissipation factor of electrical characteristics, and reduced adhesion of copper foil to the substrate, etc. Achieve good solder dip resistance and avoid the effect of brittleness

Active Publication Date: 2011-11-23
TAIWAN POWDER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the addition of such polymer thermoplastic resins will significantly reduce the dip soldering resistance of the substrate, and have adverse effects on electrical properties such as dissipation factor (Df), dielectric constant (Dk), etc., and will also make copper foil Reduced adhesion to substrate

Method used

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  • Halogen-free fire resistance epoxy resin composite as well as prepreg material and printed circuit board therefrom
  • Halogen-free fire resistance epoxy resin composite as well as prepreg material and printed circuit board therefrom
  • Halogen-free fire resistance epoxy resin composite as well as prepreg material and printed circuit board therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 100 parts by weight of phosphorus-containing (DOPO) o-cresol novolac epoxy resin, 15 parts by weight of styrene-maleic anhydride copolymer, 40 parts by weight of polymethyl phosphate 1,3-phenylene ester, 0.5 parts by weight Parts of 2-methylimidazole and 15 parts by weight of silica were mixed using a stirrer at room temperature for 60 minutes, and then 30 parts by weight of methyl ethyl ketone was added. After stirring the above materials at room temperature for 120 minutes, a halogen-free flame-retardant epoxy resin composition varnish is formed.

Embodiment 2

[0033] 100 parts by weight of phosphorous (DOPO)-containing ortho-cresol novolac epoxy resin, 15 parts by weight of styrene-maleic anhydride copolymer, 30 parts by weight of 1,3-phenylene polymethyl phosphate, 0.5 parts by weight Parts of 2-methylimidazole and 15 parts by weight of silica were mixed using a stirrer at room temperature for 60 minutes, and then 30 parts by weight of methyl ethyl ketone was added. After stirring the above materials at room temperature for 120 minutes, a halogen-free flame-retardant epoxy resin composition varnish is formed.

Embodiment 3

[0035] 100 parts by weight of phosphorous (DOPO)-containing ortho-cresol novolac epoxy resin, 15 parts by weight of styrene-maleic anhydride copolymer, 60 parts by weight of polymethyl phosphate 1,3-phenylene ester, 0.5 parts by weight Parts of 2-methylimidazole and 15 parts by weight of silica were mixed using a stirrer at room temperature for 60 minutes, and then 30 parts by weight of methyl ethyl ketone was added. After stirring the above materials at room temperature for 120 minutes, a halogen-free flame-retardant epoxy resin composition varnish is formed.

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Abstract

The invention discloses a halogen-free fire resistance epoxy resin composite comprising halogen-free epoxy resin (a), styrene-maleic anhydride copolymer (b) serving as a hardening agent, polymethyl methacrylate phosphoric acid 1,3-phenylene ester (c) serving as a fire retardant, a hardening accelerator (d) and an inorganic filling agent (e).

Description

Technical field [0001] The present invention relates to an epoxy resin composition, in particular a halogen-free flame-retardant epoxy resin composition, and a prepreg and printed circuit board made from it. In the processing process of cutting the prepreg or drilling the printed circuit board, the amount of glue or dust falling is significantly reduced. Background technique [0002] With the consideration of the flame retardancy of electronic materials, it is known that electronic components will use bromine-containing materials to increase their flame retardant effect. However, with the rise of industry environmental awareness, electronic component materials have begun to require halogen-free environmentally friendly materials, such as The resin raw material for the manufacture of printed circuit boards has been changed from epoxy resin containing bromine to epoxy resin containing nitrogen or phosphorus. [0003] Generally, the most important substrate of a printed circuit board...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/04C08L35/06C08L85/02B32B15/092H05K1/03
Inventor 徐玄浩
Owner TAIWAN POWDER TECH CO LTD
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