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Epoxy resin composition, and prepreg material and printed circuit board prepared from the same

A technology of epoxy resin and phenolic epoxy resin, applied in the field of prepreg and printed circuit board, can solve the problems of easy generation of dust, excessive brittleness of laminated board, precipitation of crystals, etc.

Active Publication Date: 2014-04-02
TAIWAN POWDER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the introduction of thermoplastic materials can meet the requirements of electrical properties, this practice will easily lead to a decrease in the glass transition temperature (Tg) of the laminated board, and the lower the glass transition temperature, the worse the heat resistance of the material
Taiwan Patent No. 216439 proposes another solution, which is to use dicyclopentadiene (DCPD) type epoxy resin to provide good heat resistance, moisture resistance and electrical characteristics of the substrate, but this patent is combined with dicyandiamide Dicyandiamide (DICY) is used as a hardener. Although dicyandiamide can be used as a hardener to improve the tear resistance of the substrate produced, dicyandiamide has low selectivity to solvents and is prone to crystallization during the production of prepregs. Bad phenomenon of precipitation
[0006] In order to increase the glass transition temperature of the prepreg, the existing technology (such as Taiwan Patent No. 455613) uses epoxy resin together with styrene-maleic anhydride copolymer (SMA) to improve the glass transition temperature. The glass transition temperature of the prepreg made of epoxy resin, but it is worth noting that the amount of styrene-maleic anhydride copolymer is difficult to control, so that the laminated board is too brittle, and it is easy to produce powder chips during processing , so it will cause product pollution and urgently need to improve

Method used

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  • Epoxy resin composition, and prepreg material and printed circuit board prepared from the same
  • Epoxy resin composition, and prepreg material and printed circuit board prepared from the same
  • Epoxy resin composition, and prepreg material and printed circuit board prepared from the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] 100 parts by weight of dicyclopentadiene (DCPD) type epoxy resin (epoxy equivalent weight (EEW): 279, Dainippon Printing HP-7200H), 40 parts by weight of styrene-maleic anhydride copolymer (molecular weight is 11,000 , the weight ratio of styrene to maleic anhydride is 4:1, Sartomer EF40), 0.5 parts by weight of tetrabutylphosphonium acetate (Deep Water), 0.5 parts by weight of silane coupling agent, 22 parts by weight of phosphazene polymer (Otsuka Chemical SPB-100), 15 parts by weight of phosphorus-containing (DOPO) bisphenol A type epoxy resin (Dow ChemicalXZ-92741), 2 parts by weight of carboxyl-terminated nitrile rubber (Hexion 58005) and 60 parts by weight Talc was mixed at room temperature using a stirrer for 60 minutes, and then 80 parts by weight of methyl ethyl ketone was added. After the above materials were stirred at room temperature for 120 minutes, an epoxy resin composition varnish was formed.

Embodiment 2

[0049] 100 parts by weight of dicyclopentadiene (DCPD) type epoxy resin (EEW: 279, Dainippon Printing HP-7200H), 30 parts by weight of styrene-maleic anhydride copolymer (molecular weight is 11,000, styrene to horse The weight ratio of anhydride is 4:1, Sartomer EF40), 0.5 parts by weight of tetrabutylphosphonium acetate (DeepWater), 0.5 parts by weight of silane coupling agent, 22 parts by weight of phosphazene macromolecule (Otsuka Chemical SPB- 100), 15 parts by weight of phosphorus-containing (DOPO) bisphenol A novolac epoxy resin (Dow ChemicalXZ-92741), 2 parts by weight of carboxyl-terminated nitrile rubber (Hexion 58005) and talc of 60 parts by weight, at room temperature After mixing for 60 minutes using a stirrer, 80 parts by weight of methyl ethyl ketone was added. After the above materials were stirred at room temperature for 120 minutes, an epoxy resin composition varnish was formed.

Embodiment 3

[0051] 100 parts by weight of dicyclopentadiene (DCPD) type epoxy resin (EEW: 279, Dainippon Printing HP-7200H), 80 parts by weight of styrene-maleic anhydride copolymer (molecular weight is 11,000, styrene to horse The weight ratio of anhydride is 4:1, Sartomer EF40), 0.5 parts by weight of tetrabutylphosphonium acetate (DeepWater), 0.5 parts by weight of silane coupling agent, 22 parts by weight of phosphazene macromolecule (Otsuka Chemical SPB- 100), 15 parts by weight of phosphorus-containing (DOPO) bisphenol A novolac epoxy resin (Dow ChemicalXZ-92741), 2 parts by weight of carboxyl-terminated nitrile rubber (Hexion 58005) and talc of 60 parts by weight, at room temperature After mixing for 60 minutes using a stirrer, 80 parts by weight of methyl ethyl ketone was added. After the above materials were stirred at room temperature for 120 minutes, an epoxy resin composition varnish was formed.

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Abstract

An epoxy resin composition comprises (A) epoxy resin containing dicyclopentadiene (DCPD) type epoxy resin and (B) styrene-maleic anhydride copolymer as a hardener.

Description

technical field [0001] The present invention relates to an epoxy resin composition, and a prepreg and a printed circuit board made therefrom. Background technique [0002] In electronic assembly, the printed circuit board is a critical component. It carries other electronic components and connects the circuit to provide a stable circuit working environment, and the most common printed circuit board substrate is copper clad laminate (CCL), which is mainly composed of resin, It is composed of reinforcing material and copper foil. The commonly used resins are: epoxy resin, phenolic resin, polyamine formaldehyde, silicone and Teflon, etc., and the commonly used reinforcing materials are: glass fiber cloth, glass fiber mat, insulating paper, even canvas, flax cloth etc. [0003] Generally, a prepreg is obtained by impregnating a reinforcing material such as glass fabric with a resin varnish and curing it to a semi-hardened state (B-stage). Then the obtained prepreg is laminat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L25/08C08L63/04C08L13/00C08K3/34C09D163/00C09D163/02C09D125/08H05K1/03
Inventor 徐玄浩黄俊杰朱美玲陈宪德
Owner TAIWAN POWDER TECH CO LTD
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