Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same

Abstract

The invention relates to a low-halogen-content fire-retardant adhesive and a flexible copper clad laminate prepared from the same. The low-halogen-content fire-retardant adhesive comprises synthetic rubber, brominated epoxy resin, biphenyl type epoxy resin, phosphonitrile compounds, an aromatic amine curing agent, an imidazole curing accelerator, inorganic filler, an ion exchanger, an oxidation inhibitor and a solvent. The flexible copper clad laminate prepared from the fire-retardant adhesive comprises a polyimide film, a low-halogen-content fire-retardant adhesive layer and copper foil, wherein the low-halogen-content fire-retardant adhesive layer is coated on the polyimide film, and the copper foil is pressed on the low-halogen-content fire-retardant adhesive layer. The fire-retardant adhesive has low halogen content, excellent flexibility, heat resistance, adhesion property and humidity resistance. The flexible copper clad laminate has excellent flexibility, folding resistance, deflection resistance, dip soldering resistance, ion mobility resistance and high peeling strength, the flame retardance reaches the UL94V-0 grade, and the flexible copper clad laminate is suitable for manufacturing a flexible printed circuit board.

Description

technical field [0001] The invention relates to an adhesive, in particular to a flame-retardant adhesive with low halogen content and a flexible copper-clad board prepared therefrom. Background technique [0002] Flexible copper clad laminate (FCCL) is mainly used to make flexible printed circuit board (FPC). FPC has the distinctive characteristics of thin, light and flexible structure. In addition to static bending, it can also be dynamically bent, curled and folded. , Widely used in mobile phones, digital cameras, digital video cameras, notebook computers, automotive electronics, missiles, rockets, aerospace and other fields. [0003] Flexible copper-clad laminates are divided into adhesive-type flexible copper-clad laminates and adhesive-free flexible copper-clad laminates. Adhesive-free flexible copper-clad laminates are also called two-layer flexible copper-clad laminates (2-layer FCCL), which are made of polyimide Composed of film and copper foil, it can be made by co...

AI Technical Summary

Problems solved by technology

To make the flame retardancy of adhesive-type flexible copper-clad laminate reach UL94VTM-0 or V-0, the key is to make the adhesive used in it flame-retardant. The flame-retardant of the adhesive is generally achieved by adding a flame retardant or using a flame-retardant resin. , For a long time, the flame retardant of the adhesive for flexible copper clad laminates is the use of bromine flame retardant mechanism, JP 2001-015876 uses brominated epoxy resin, antimony trioxide flame retardant, US6709741, CN1407049A uses brominated epoxy resin, hydrogen Alumina is flame retardant. Since flammable synthetic rubber is used as a toughening agent, the adhesive needs a high bromine content to be flame retardant. Experiments have found that if only bromine is flame retardant, the bromine content of the total organic matter in the adhesive system must reach 22%. The above can make the flame retardancy of polyimide film flexible copper clad laminate reach UL94V-0 level, but the high bromine content will lead to a significant decrease in the heat resistance and flexibility of the adhesive, and antimony trioxide is used as the bromine Although the synergistic flame retardant can reduce the bromine content of the system, the bromine antimony synergistic flame retardant system, like the bromine flame retardant system, produces a lot of smoke when burned, and antimony trioxide is also suspected to be carcinogenic. In particular, flexible copper clad laminates with high bromine content also have disadvantages such as poor solder resistance, folding resistance, and poor flex resistance.

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