Trace Cu-doped Bi2S3-based thermoelectric material
A thermoelectric material and micro-quantity technology, which is applied in the direction of thermoelectric device node lead-out materials, etc., can solve the problems of reducing thermal conductivity and difficult to improve power factor at the same time
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example 1
[0011] Weigh high-purity (99.99%) Cu powder, Bi powder and S powder according to the molar ratio of Cu: Bi : S 0.001:1.999:3, mix them, put them into a ball mill jar, vacuumize and fill with Ar gas, and cycle three times , make the Ar gas fill the ball mill jar, and seal the ball mill jar. Then put the ball milling jar into the ball mill and mill at 400 rpm for 10 hours. After the completion, take out the ball milling jar and inject 100 ml of absolute ethanol into the ball milling jar. Grind for 30 minutes. The powder was taken out and dried in a drying oven at 80 °C for 2 h. The dry powder was sintered into a block by spark plasma, the diameter of the mold was 20 mm, the heating rate was 100 ℃ / min, the temperature was 300 ℃, the pressure was 20 Pa, and the holding time was 5 min. Finally, trace copper-doped Cu 0.001 Bi 1.999 S 3 Thermoelectric material, tested and calculated to have a power factor of 200 μWm at 573 K -1 K -2 , with a thermal conductivity of 0.6 Wm -1 ...
example 2
[0013] Weigh high-purity (99.99%) Cu powder, Bi powder and S powder according to the molar ratio of Cu: Bi : S 0.002:1.998:3, mix them, put them into a ball mill jar, vacuumize and fill with Ar gas, and cycle three times , make the Ar gas fill the ball mill jar, and seal the ball mill jar. Then put the ball milling jar into the ball mill and mill at 450 rpm for 15 h. After the completion, take out the ball milling jar and inject 100ml of absolute ethanol into the ball milling jar. Grind for 1 h. The powder was taken out and dried in a drying oven at 80 °C for 12 h. The dry powder was sintered into a block by spark plasma, the diameter of the mold was 10 mm, the heating rate was 100 °C / min, the temperature was 550 °C, the pressure was 60 Pa and the holding time was 5 min. Finally, trace copper-doped Cu 0.002 Bi 1.998 S 3 Thermoelectric material, tested and calculated to have a power factor of 240 μWm at 573 K -1 K -2 , with a thermal conductivity of 0.54 Wm -1 K -1 . ...
example 3
[0015] Weigh high-purity (99.99%) Cu powder, Bi powder and S powder according to the molar ratio of Cu: Bi : S 0.007:1.995:3, mix them, put them into a ball mill jar, vacuumize and fill with Ar gas, and cycle three times , make the Ar gas fill the ball mill jar, and seal the ball mill jar. Then put the ball mill jar into the ball mill, mill at 300 rpm for 20 h, take out the ball mill jar after completion, and inject 100 ml of absolute ethanol into the ball mill jar, during this process, keep the Ar gas flowing to avoid damaging the inert protective atmosphere, 425 rpm Wet grinding for 3 h. The powder was taken out and dried in a drying oven at 80 °C for 8 h. The dry powder was sintered into a block by spark plasma, the diameter of the mold was 25 mm, the heating rate was 100 °C / min, the temperature was 400 °C, the pressure was 40 Pa, and the holding time was 5 min. Finally, trace copper-doped Cu 0.007 Bi 1.993 S 3 Thermoelectric material, tested and calculated to have a p...
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